Sony HCD-GNZ333D Service Manual page 35

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• Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
f : internal component.
•
: Pattern from the side which enables seeing.
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
• Indication of transistor
C
Q These are omitted.
B E
Q
B C E
These are omitted.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
T E
L 1 3 9 4 2 2 9 6 5 1 3
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
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HCD-GNZ333D/GNZ444D
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
•
: internal component.
f
• 2 : nonflammable resistor.
• 5 : fusible resistor.
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• H : adjustment for repair.
• A : B+ Line.
• B : B– Line.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
– DECK Section –
no mark : TAPE PLAY
< > : TAPE REC
– Other Section –
no mark : TUNER (FM/AM)
<< >> : DVD PLAY
• Circled numbers refer to waveforms.
• Signal path.
F : TUNER (FM/AM)
J : AUDIO (DVD)
c : VIDEO (DVD)
N : MIC
E : PB (TAPE)
a
: REC (TAPE)
• Abbreviation
E3 : 240 V AC area in E model
E12 : 220-240 V AC area in E model
E13 : Russian model
E15 : Iran model
EA : Saudi Arabia model
PH : Philippine model
SP : Singapore model
TH : Thai model
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• Circuit Boards Location
KEY LEFT board
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2 4
9 9 8
MAIN board
DECK board
PANEL board
JACK board
KEY CD board
DMB16 board
MIC board
1 5 1 5 0 8 9 2 4
m
c o
HCD-GNZ333D/GNZ444D
2
9 9
AMP board
PT board
REG board
9 8 2 9 9