Sony DVP-S300 Training Manual page 9

Put safety goggles on before using the butane torch. Circle the IC leads
with the torch flame and flip the IC over when the IC is loose.
IC Removal - Chip Quick ® Method
Chip Quick is a low temperature solder that remains molten longer than
ordinary solder, giving you time to unsolder the IC. Chip Quick is best for
removing medium to large scale ICs when there are few parts about the
IC. This method takes about the same time as the hot air method and
requires about the same level of skill.
The Chip Quick package (P/N = T99856421) contains:
•
Low Temperature Solder
•
Flux
•
Wick
1. Apply the Chip Quick flux to all the leads of the IC. (Medium size IC
shown for removal).
2. Melt the Chip Quick solder along the IC leads. Keep the solder molten
by running your iron along the IC leads.
3. Insert tweezers and lift the IC up.
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