Sony DVP-S300 Training Manual page 7

4. You should apply enough pressure to shear off 4-5 legs as you rock
the blade while pressing down. DO NOT let the blade point touch the
board.
5. Reposition the blade back along the legs and repeat. Do not cut the
last leg off or you will lose control and the blade point will hit the board.
Use cutters to nip these last IC legs or unsolder and lift the leg with a
dental pick. Remove the IC body.
6. Use a standard soldering iron to heat and push the legs off the lands.
Push only in the direction of the lands so they are not damaged.
Wipe across
the land
7. Remove the solder on the lands using a solder wick looped about the
soldering iron for better control.
4
IC Lands