IBM i 830 Repair Manual page 653

the instructions on the screen when you use HSM to power down the IOP or
IOA. They will tell you how to use function 68 and function 69 on the control
panel.
v If the resource is the console IOA or the console IOP for a secondary partition
you will loose the console once you power down the domain. Follow the
procedure from the primary partition, then from the "Work with partition status"
screen do a function 69 for the partition.
v See "FC 5075 – Cards – Dedicated" on page 640 if you choose to perform
dedicated card removal.
Concurrent Removal Procedure:
Attention: All cards are sensitive to electrostatic discharge (see "Appendix C.
Working with Electrostatic Discharge-Sensitive Parts" on page 955).
CAUTION:
The circuit card contains lead solder. To avoid the release of lead (Pb) into the
environment, do not burn. Discard the circuit card as instructed by local
regulations. (RSFTC234)
From the Hardware Service Manager screen perform the following:
1. Select the Packaging hardware resources option.
2. Select the Hardware contained in packaging option.
3. Find the card position for the IOA or IOP that you are removing and select
the Concurrent maintenance option.
4. A listing of the power domain is shown. Find the IOA or IOP that you are
removing and select the Power off domain option. Everything within the IOA's
or IOP's power domain will be powered off .
5. To see the status of the power domain, select the Display power status option.
6. Find the IOA or IOP that you are removing and select the Toggle LED blink
off/on option.
7. Remove the cover to access the card that you are removing from the system.
See "FC 5075 – Covers" on page 641.
8. Look at the power LED ( ) for the card that you are removing to ensure that it
is powered off. The power LED ( ) is located to the left and directly above the
card slot. If the LED is blinking multiple times per second (rapidly) or it is off,
then the card is powered off.
9. Remove the right side cover, see "FC 5075 – Covers" on page 641.
10. Remove and label any cables connected to the card.
11. Turn the latches securing the card.
12. Gently pull the card off the system backplane.
This ends the procedure.
Concurrent Installation Procedure:
All cards are sensitive to electrostatic discharge (see "Appendix C. Working with
Electrostatic Discharge-Sensitive Parts" on page 955).
CAUTION:
The circuit card contains lead solder. To avoid the release of lead (Pb) into the
environment, do not burn. Discard the circuit card as instructed by local
regulations. (RSFTC234)
Remove and Replace Procedures
Chapter 4. Removal and Installation Procedures
639