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7-3. PRINTED WIRING BOARD — BD BOARD —
BD BOARD
(COMPONENT SIDE)
C302
C184
C182
R201
C201
C203
C209
CX-LDB30/LDB50
• See page 24 for Circuit Boards Location.
C305
C303
R313
R405
R351
C315
C316
R352
R302
R353
R354
C314
C312
C308
C318
C210
R162
R191
C183
R165
R173
C174
C196
C172
R172
C195
X171
C10
R171
C11
C15
C151
R121
C134
C123
:Uses unleaded solder.
BD BOARD
(CONDUCTOR SIDE)
C255
C260
28
22
C257
IC251
C258
R253
1
7
C259
C116
R252
C14
C17
12
C16
1-861-619-
(12)
Q10
E
27
27
M101
M
(SPINDLE)
S101
(LIMIT)
R404
21
15
R419
C306
C313
16
1
17
64
IC301
C320
R307
8
14
C307
32
49
C309
33
48
C310
R303
TP
R407
(VC)
R163
C163
120
91
TP
(TEO)
1
C115
TP
IC101
(FEO)
R111
C112
R112
C111
30
31
60
CN101
C124
TP
(RFDCO)
C143
C122
C133
R132
TP
(RFACO)
R133
C142
OPTICAL
PICK-UP
R131
BLOCK
(KSM-215CFP/C2NP)
CX-LDB30/LDB50
3
1
IC303
4
5
R403
M102
M
(SLED)
R301
R306
C311
C317
R305
R402
CN201
1
R401
R409
C211
C
90
R182
MAIN
BOARD
C181
CN902
(Page 31)
C186
C162
C185
R181
27
C161
61
R204
12
1-861-619-
(12)
R142
R203
• Semiconductor
Location
Ref. No.
Location
IC101
D-6
IC251
B-5
IC301
B-6
IC303
A-7
Q10
D-3
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