Diagrams - Sony CX-LDB30 Service Manual

Micro hi-fi component system
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CX-LDB30/LDB50
• Circuit Boards Location
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Schematic Diagrams.
Note:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and
specified.
f
: internal component.
• C : panel designation.
Note: The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
No mark: FM
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: TUNER
J
: CD
d
: AUX
E
: PB (TAPE)
a
: REC (TAPE)
• Abbreviation
E51
: Chilean and Peruvian model.
RU
: Russian model.
24
SECTION 7

DIAGRAMS

MAIN board
CD EJECT board
PANEL board
1
/
W or less unless otherwise
4
BD board
DRIVER board
PT board
JACK board
For Printed Wiring Boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
f
: internal component.
: Pattern from the side which enables seeing.
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side:
(Component Side) the parts face are indicated.
• Indication of transistor.
C
Q
B
E
B
C E
Q
B
C
Parts on the parts face side seen from
These are omitted.
These are omitted.
E
These are omitted.

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