Dell XPS M140 Service Manual page 61

NOTICE: To avoid electrostatic discharge, ground yourself by using a wrist grounding strap or by periodically
touching an unpainted metal surface (such as the back panel) on the computer.
1. Follow the instructions in
NOTICE: Handle the microsprocessor module with care. Hold the microsprocessor module by its edges and do
not touch the processor die (the small chip in the center of the module).
2. Follow the instructions in
NOTICE: Ensure that the cam lock is in the fully open position before seating the microprocessor module.
Seating the microprocessor module properly in the ZIF socket does not require force. A microprocessor module
that is not properly seated can result in an intermittent connection or permanent damage to the microprocessor
and ZIF socket.
3. Align the pin-1 corner of the new microprocessor module with the pin-1 corner of the ZIF socket, and insert the
microprocessor module.
NOTE: The pin-1 corner of the microprocessor module has a triangle that aligns with the triangle on the pin-1
corner of the ZIF socket.
NOTE: Gently press down on the substrate on which the processor die is mounted to ensure the microprocessor
module is properly seated.
When the microprocessor module is properly seated, all four corners of the module are aligned at the same height. If
one or more corners of the module is higher than the others, the module is not properly seated.
NOTICE: To avoid damaging the microprocessor, hold the screwdriver so that it is perpendicular to the
microprocessor module when turning the cam screw.
4. Tighten the ZIF-socket cam lock by turning the cam screw clockwise to secure the microprocessor module to the
system board.
5. Replace the microprocessor thermal-cooling assembly (see
Assembly).
6. Replace the microprocessor module cover.
7. Update the BIOS using a flash BIOS update program floppy disk or CD. For instructions on how to flash the
BIOS, see BIOS
Back to Contents Page
Preparing to Work Inside the Computer
Removing the Microprocessor
Updates.
Module.
Replacing the Microprocessor Thermal- Cooling