Related Manuals for Texas Instruments THS7002
Summary of Contents for Texas Instruments THS7002
- Page 1 THS7002 Programmable Gain Amplifier Evaluation Module User’s Guide July 1999 Mixed-Signal Products SLOU037...
- Page 2 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
- Page 3 Trademarks TI is a trademark of Texas Instruments Incorporated. PowerPAD is a trademark of Texas Instruments Incorporated. Chapter Title—Attribute Reference...
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Page 5: Table Of Contents
Running Title—Attribute Reference Contents General Information ............. Features . - Page 6 Running Title—Attribute Reference Figures 1–1 THS7002 Evaluation Module ........... 1–2 THS7002 EVM Power Conditioning Schematic Diagram .
- Page 7 Chapter 1 General Information This chapter details Texas Instruments (TI ) THS7002 programmable-gain amplifier evaluation module (EVM), SLOP136. It includes a list of EVM features, a brief description of the module illustrated with pictorial and schematic diagrams, EVM specifications, details on configuring, connecting, and using the EVM, and a discussion on high-speed amplifier and PowerPAD package design considerations.
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Page 8: General Information
Features 1.1 Features THS7002 programmable-gain amplifier EVM features include: Multiple Input Configurations Set Via On-board Jumpers DIP Switches Allow Quick and Easy Adjustment of Gain, Shut Down, Reference Voltage, and Output Clamping Includes a THS4001 High-Speed Amplifier as an Inverter Standard BNC Connectors Inputs and Outputs 5-V to 15-V Operation with 5-V Reference Input Nominal 50- Impedance Inputs and Outputs... -
Page 9: Ths7002 Evaluation Module
Description Figure 1–1. THS7002 Evaluation Module SLOP136 THS7002 EVM Board Rev. B +V CC –V CC +5 V Pre-Amp A Output AS/D AVREF 1998 Input A PGA – A Output PGA – B Output R12 C13 BVREF U2 Out BS/D Input B Pre-Amp B Output... - Page 10 Description VREF S2-C R39, S2-B R37, S2-A R35, VREF R27, R25, R23, –Vcc General Information...
- Page 11 Description The THS7002 EVM is equipped with a separate BNC input connector for each of the two channels on the module. Each input is terminated with a 50- resistor to provide correct line impedance matching (Figure 1–3). Note that using a source with a 50- output impedance will create a voltage divider at the EVM inputs.
- Page 12 Description The shutdown feature of the THS7002 IC is implemented on this EVM. There is a separate shutdown pin for each half of the THS7002 IC. The shutdown signals are low for normal THS7002 operation. When a shutdown pin is high (5 V), the corresponding preamplifier and PGA section is turned off.
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Page 13: Programmable Gain Amplifier Gain Control
Programmable Gain Amplifier Gain Control 1.3 Programmable Gain Amplifier Gain Control Each channel of the THS7002 IC is provided with three digital control inputs for setting the gain of the PGA stage (AG0 – AG2 and BG0 – BG2). Standard TTL or CMOS Logic signals operate these control inputs. -
Page 14: Simplified Pga Section Of The Ths7002
Programmable Gain Amplifier Gain Control Figure 1–4. Simplified PGA Section of the THS7002 No Source Impedance V IN G 0 G 1 G 2 THS7002 IC –V IN R SOURCE Positive R TERMINATION Clamp V H – V OUT V REF Negative Clamp V L The PGA VREF terminals are also accessible via test points TP8 and TP14. -
Page 15: Evm Dip Switch Functionality
EVM DIP Switch Functionality 1.4 EVM DIP Switch Functionality The THS7002 can be fully evaluated without any external digital control signals applied. This is accomplished through the use of two banks of DIP switches. Each DIP switch bank incorporates six SPST switches labeled A through F. -
Page 16: Evm Circuit Configuration
EVM Circuit Configuration 1.5 EVM Circuit Configuration The THS7002 EVM design allows evaluation of each section of the THS7002 amplifier IC separately as well as a differential system. Configuration of the EVM is accomplished through jumpers mounted on the module PCB. Each jumper is a three-pin header that acts as an SPDT switch when a shunt is placed across two of the three pins to select either of two signal routes (Figure 1–5). - Page 17 EVM Circuit Configuration Jumper JP4: 1–2 — Connects the input of the B-channel PGA (U1: D) to the signal from JP3 2–3 — Connects the input of the B-channel PGA (U1: D) to the output of the B-channel preamplifier (U1:C) Jumper JP5: 1–2 —...
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Page 18: Using The Ths7002 Evm
Using the THS7002 EVM 1.6 Using the THS7002 EVM The THS7002 EVM operates from a split power supply with voltages ranging from 5 V to 15 V. It also uses 5 volt logic control signals to configure the operation of the EVM when the DIP switches are used. The use of a single supply for this EVM is not recommended. -
Page 19: Ths7002 Evm Performance
THS7002 EVM Performance 1.7 THS7002 EVM Performance Figure 1–6 shows the typical frequency response and Figure 1–7 shows the typical phase response of the THS7002 EVM preamplifiers. Typical –3 dB bandwidth with a 15-V power supply is 100 MHz for the preamplifier in each channel and 90 MHz with a 5-V power supply. -
Page 20: Ths7002 Evm Pga Frequency Response
THS7002 EVM Performance Figure 1–8 shows the typical frequency response and Figure 1–9 shows the typical phase response of the THS7002 EVM PGAs. This data was collected with the gain set to +2 dB. Typical – 3 dB bandwidth is 65 MHz with a 5-V power supply and 70 MHz with a 15-V power supply. -
Page 21: Ths7002 Evm Preamplifier + Pga Frequency Response
THS7002 EVM Performance Figure 1–10 shows the typical frequency response and Figure 1–11 shows the typical phase response of the THS7002 EVM preamplifiers + PGAs. This data was collected with the preamplifiers directly driving the PGA inputs. The PGA was set to a gain of +2 dB. Typical – 3 dB bandwidth is 65 MHz with a 5-V power supply and 70 MHz with a 15-V power supply. -
Page 22: General High-Speed Amplifier Design Considerations
General High-Speed Amplifier Design Considerations 1.8 General High-Speed Amplifier Design Considerations The THS7002 EVM layout has been designed and optimized for use with high-speed signals and can be used as an example when designing THS7002 applications. Careful attention has been given to component selection, grounding, power supply bypassing, and signal path layout. -
Page 23: General Powerpad Design Considerations
General PowerPAD Design Considerations 1.9 General PowerPAD Design Considerations The THS7002 IC is mounted in a special package incorporating a thermal pad that transfers heat from the IC die directly to the PCB. The PowerPAD package is constructed using a downset leadframe. The die is mounted on the leadframe but is electrically isolated from it. -
Page 24: Maximum Power Dissipation Vs Free-Air Temperature
General PowerPAD Design Considerations 6) The top-side solder mask should leave exposed the terminals of the package and the thermal pad area with its holes. Any larger holes outside the thermal pad area, but still under the package, should be covered with solder mask. -
Page 25: General Powerpad Design Considerations
General PowerPAD Design Considerations Even though the THS7002 EVM PCB is different than the one in the example above, the results should give an idea of how much power can be dissipated by the PowerPAD IC package. The THS7002 EVM is a good example of proper thermal management when using PowerPAD-mounted devices. -
Page 26: Ths7002 Evm Specifications
THS7002 EVM Specifications 1.10 THS7002 EVM Specifications Supply voltage range, V ..........5 V to 15 V Supply current, I . -
Page 27: Reference
Chapter 2 Reference This chapter includes a parts list and PCB layout illustrations for the THS7002 EVM. Topic Page THS7002 Dual Differential Line Drivers and Receivers ......... . . EVM Parts List 2–2 . -
Page 28: Ths7002 Programmable-Gain Amplifier Evm Parts List
THS7002 Programmable-Gain Amplifier EVM Parts List 2.1 THS7002 Programmable-Gain Amplifier EVM Parts List Table 2–1. THS7002 EVM Parts List Manufacturer/Distributor Reference Description Size Part Number C4, C5, C21 CAPACITOR, 6.8 F, CERAMIC, 20%, TANTALUM, SM (SPRAGUE) 293D685X9035D2T C2, C3, CAPACITOR, 0.1 F, CERAMIC, 10%, SM 0805 (MuRata) GRM40–X7R104K25 C11, C12,... -
Page 29: Ths7002 Evm Board Layouts
THS7002 EVM Board Layouts 2.2 THS7002 EVM Board Layouts Board layout examples of the THS7002 EVM PCB are shown in the following illustrations. They are not to scale and appear here only as a reference. Figure 2–1. THS7002 EVM Component Placement Silkscreen and Solder Pads THS7002 EVM Board SLOP136 Rev. -
Page 30: Ths7002 Evm Pc Board: Top Assembly
THS7002 EVM Board Layouts Figure 2–2. THS7002 EVM PC Board: Top Assembly Figure 2–3. THS7002 EVM PC Board: Top Layer Reference... -
Page 31: Ths7002 Evm Pc Board: Bottom Layer
THS7002 EVM Board Layouts Figure 2–4. THS7002 EVM PC Board: Bottom Layer (Top VIew) Reference... - Page 32 Reference...