Audio Subsystem Components; Back Panel Audio Connectors; S/Pdif Header - Intel DB85FL Specification

Intel Desktop Board DB85FL Technical Product Specification
1.8.2

Audio Subsystem Components

The audio subsystem includes the following components:
Intel B85 Express Chipset
•
Realtek ALC662s-VD audio codec
•
Front panel audio header that supports Intel HD audio and AC '97 audio (a 2 x
•
5-pin header that provides mic in and line out signals for front panel audio
connectors) (yellow)
S/PDIF digital audio out header (1 x 4-pin header) (yellow)
•
• 3-port analog audio input/output stack on the back panel
• Mono speaker header (1 x 2-pin header) (yellow)
The back panel audio connectors are configurable through the audio device drivers.
The available configurable back panel audio connectors are shown in Figure 4.
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about
The locations of the front panel audio header and S/PDIF audio header
The signal names of the front panel audio header and S/PDIF audio header
The back panel audio connectors
1.8.2.1

S/PDIF Header

The S/PDIF header allows connections to optical dongles for digital audio output.
26
Item Description
A Line-in (Surround)
B Line-out (Front Speakers)
C Mic-in (Center/Sub)
Figure 4. Back Panel Audio Connectors
Refer to
Figure 9, page 42
Section 2.2.2.1, page 44
Section 2.2.1, page 41