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Intel DB75EN Specification

Technical product specification
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Intel® Desktop Board
DB75EN
Technical Product Specification
June 2012
Part Number: G54940-002
The Intel Desktop Board DB75EN may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DB75EN Specification Update.

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Summary of Contents for Intel DB75EN

  • Page 1 Part Number: G54940-002 The Intel Desktop Board DB75EN may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DB75EN Specification Update.

  • Page 2: Revision History

    “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

  • Page 3: Board Identification Information

    Board Identification Information Basic Desktop Board DB75EN Identification Information AA Revision BIOS Revision Notes G39650-300 ENB7510H.86A.0017 Notes: The AA number is found on a small label on the component side of the board. The B75 processor used on this AA revision consists of the following component:...
  • Page 4 Intel Desktop Board DB75EN Technical Product Specification...

  • Page 5: Preface

    Intended Audience The TPS is intended to provide detailed, technical information about Intel Desktop Board DB75EN and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
  • Page 6 Intel Desktop Board DB75EN Technical Product Specification Other Common Notation Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second Kilobyte (1024 bytes) Kilobit (1024 bits)

  • Page 7: Table Of Contents

    1.3 Processor ..................16 1.3.1 Graphics Subsystem .............. 17 1.4 System Memory ................19 1.4.1 Memory Configurations ............20 ® 1.5 Intel B75 Express Chipset ..............22 1.5.1 Direct Media Interface (DMI) ..........22 1.5.2 Display Interfaces ..............22 1.5.3 USB ..................
  • Page 8 Intel Desktop Board DB75EN Technical Product Specification ® 1.11.4 Intel Anti-Theft Technology ........... 32 ® ® 1.11.5 Intel Management Engine (Intel ME) Software and Drivers ..33 1.12 Power Management ................34 1.12.1 ACPI ..................34 1.12.2 Hardware Support ..............36 2 Technical Reference 2.1 Memory Resources ................
  • Page 9 Back Panel Audio Connectors ............. 26 LAN Connector LED Locations ............. 28 Thermal Sensors and Fan Headers ............30 Location of the Intel ME “M” State LED ..........33 Location of the Standby Power LED ............. 40 Detailed System Memory Address Map ..........42 10.
  • Page 10 12. Component-side Connectors and Headers Shown in Figure 11 ....46 13. Serial Port Header ................47 14. Front Panel Audio Header for Intel HD Audio ........47 15. Front Panel Audio Header for AC ’97 Audio ........... 47 16. Front Panel USB 2.0 Headers ............. 47 17.

  • Page 11: Product Description

    • Support for a PCI Express 3.0 x16 add-in graphics card Note: PCI Express 3.0 is only supported by 3 generation Intel Core processor family processors Audio 8-channel (6+2) Intel High Definition Audio via the Realtek* ALC662 audio codec continued...
  • Page 12 ― Four front panel ports implemented through two internal headers • Five Serial ATA (SATA) ports: ― One SATA 6.0 Gb/s interface through the Intel B75 Express Chipset with SATA ACHI support (blue) ― Three internal SATA 3.0 Gb/s interfaces through Intel B75 Express Chipset with SATA ACHI support (black) ―...

  • Page 13: Board Layout

    Product Description 1.1.2 Board Layout Figure 1 shows the location of the major components on Intel Desktop Board DB75EN. Figure 1. Major Board Components...

  • Page 14: Components Shown In Figure 1

    Intel Desktop Board DB75EN Technical Product Specification Table 3 lists the components identified in Figure 1. Table 3. Components Shown in Figure 1 Item/callout from Figure 1 Description Conventional PCI add-in card connector Conventional PCI add-in card connector PCI Express x1 add-in card connector...

  • Page 15: Block Diagram

    Product Description 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas of the board. Figure 2. Block Diagram...

  • Page 16: Online Support

    95 W Thermal Design Power (TDP). The processors listed above are only supported when falling within the wattage requirements of Intel Desktop Board DB75EN. See the Intel web site listed below for the most up-to-date list of supported processors.

  • Page 17: Graphics Subsystem

    Product Description 1.3.1 Graphics Subsystem The board supports graphics through either the processor Intel HD Graphics or a PCI Express x16 add-in graphics card. 1.3.1.1 Processor Graphics ® The board supports integrated graphics through the Intel Flexible Display Interface ®...

  • Page 18: Pci Express X16 Graphics

    Intel Desktop Board DB75EN Technical Product Specification 1.3.1.2 PCI Express x16 Graphics generation Intel Core processor family processors support PCI Express 3.0, 2.x, and 1.x and 2 generation Intel Core processor family processors support PCI Express 2.x and 1.x: PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of •...

  • Page 19: System Memory

    DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SDRAM DIMMs • Note: DDR3 1600 MHz DIMMs are only supported by 3 generation Intel Core processor family processors XMP version 1.3 performance profile support for memory speeds of 1600 MHz or •...

  • Page 20: Memory Configurations

    Intel Desktop Board DB75EN Technical Product Specification For information about… Refer to: Tested Memory http://support.intel.com/support/motherboards/desktop/sb /CS-025414.htm 1.4.1 Memory Configurations The 3 generation Intel Core processor family and 2 generation Intel Core processor family processors support the following types of memory organization: Dual channel (Interleaved) mode.

  • Page 21: Memory Channel And Dimm Configuration

    Product Description Figure 3 illustrates the memory channel and DIMM configuration. Figure 3. Memory Channel and DIMM Configuration NOTE For best memory performance always install memory in the blue DIMM sockets if installing only two DIMMs on your board.

  • Page 22: Intel

    PCH. The display data from the frame buffer is processed in the display engine of the processor and sent to the PCH over the Intel FDI where it is transcoded as per the display protocol and driven to the display monitor.

  • Page 23: Usb

    (LS) traffic on the bus. The board supports up to four USB 3.0 ports and eight USB 2.0 ports. The Intel B75 Express Chipset provides the USB controller for the 2.0/3.0 ports. The port arrangement is as follows: Two USB 3.0 ports are implemented with stacked back panel connectors (blue)

  • Page 24: Real-Time Clock Subsystem

    Intel Desktop Board DB75EN Technical Product Specification The underlying SATA functionality is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In native mode, standard PCI Conventional bus resource steering is used.

  • Page 25: Audio Subsystem

    (ctrl panel) Back panel – Pink Default (ctrl panel) 1.8.1 Audio Subsystem Software The latest audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 16...

  • Page 26: Audio Connectors And Headers

    Intel Desktop Board DB75EN Technical Product Specification 1.8.2 Audio Connectors and Headers The board contains audio connectors and headers on both the back panel and the component side of the board. The component-side audio headers include front panel audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio connectors).

  • Page 27: Lan Subsystem

    ® 1.9.1 Intel 82579V Gigabit Ethernet Controller The Intel 82579V Gigabit Ethernet Controller supports the following features: 10/100/1000 BASE-T IEEE 802.3 compliant • • Energy Efficient Ethernet (EEE) IEEE802.3az support (Low Power Idle [LPI] mode) Dual interconnect between the Integrated LAN Controller and the Physical Layer •...

  • Page 28: Lan Subsystem Software

    Intel Desktop Board DB75EN Technical Product Specification 1.9.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers http://downloadcenter.intel.com 1.9.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).

  • Page 29: 1.10 Hardware Management Subsystem

    Power monitoring of +12 V, +5 V, +3.3 V, 3.3 Vstandby, V_SM, +VCCP, and • PCH V SMBus interface • 1.10.2 Fan Monitoring ® Fan monitoring can be implemented using Intel Desktop Utilities or third-party software. For information about Refer to The functions of the fan headers Section 1.12.2.2, page 37 1.10.3...

  • Page 30: Thermal Monitoring

    Intel Desktop Board DB75EN Technical Product Specification 1.10.4 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item Description Thermal diode, located on the processor die Rear chassis fan header Processor fan header Front chassis fan header Thermal diode, located on the Intel B75 PCH Figure 6.

  • Page 31: Intel Security And Manageability Technologies

    PC. NOTE A processor with Intel VT does not guarantee that virtualization will work on your system. Intel VT requires a computer system with a chipset, BIOS, enabling software and/or operating system, device drivers, and applications designed for this feature.

  • Page 32: Intel

    Intel AT functionality has been activated and configured. Certain functionality may not be offered by some ISVs or service providers and may not be available in all countries. Intel assumes no liability for lost or stolen data and/or systems or any other damages resulting thereof.

  • Page 33: Intel Management Engine (Intel Me) Software And Drivers

    1.11.5.1 Intel Management Engine “M” State LED The board has a blue-colored Intel ME “M” state LED (see Figure 7). The “M” state is based on Intel ME status, as follows: M0 = Intel ME is in full control in S0 •...

  • Page 34: 1.12 Power Management

    Intel Desktop Board DB75EN Technical Product Specification 1.12 Power Management Power management is implemented at several levels, including: Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: •  Power connector  Fan headers  LAN wake capabilities ...

  • Page 35: Power States And Targeted System Power

    Product Description 1.12.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off.

  • Page 36: Hardware Support

    Intel Desktop Board DB75EN Technical Product Specification 1.12.1.2 Wake-up Devices and Events Table 10 lists the devices or specific events that can wake the computer from specific states. Table 10. Wake-up Devices and Events These devices/events can wake up the computer…...

  • Page 37: Power Connector

    Product Description LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line. NOTE The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support. 1.12.2.1 Power Connector ATX12V-compliant power supplies can turn off the system power through system control.

  • Page 38: Lan Wake Capabilities

    Intel Desktop Board DB75EN Technical Product Specification 1.12.2.3 LAN Wake Capabilities CAUTION For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply.

  • Page 39: Wake From Usb

    Product Description 1.12.2.5 Wake from USB USB bus activity wakes the computer from an ACPI S3 state. NOTE Wake from USB requires the use of a USB peripheral that supports Wake from USB. 1.12.2.6 PME# Signal Wake-up Support When the PME# signal on the Conventional PCI bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state (with Wake on PME enabled in the BIOS).

  • Page 40: Location Of The Standby Power Led

    Intel Desktop Board DB75EN Technical Product Specification 1.12.2.11 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 8 shows the location of the standby power LED.

  • Page 41: Technical Reference

    Technical Reference Memory Resources 2.1.1 Addressable Memory The board utilizes 32 GB of addressable system memory. Typically the address space that is allocated for Conventional PCI bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory).

  • Page 42: Detailed System Memory Address Map

    Intel Desktop Board DB75EN Technical Product Specification Figure 9. Detailed System Memory Address Map...

  • Page 43: Memory Map

    Technical Reference 2.1.2 Memory Map Table 11 lists the system memory map. Table 11. System Memory Map Address Range Address Range Size Description (decimal) (hex) 1024 K - 33550336 K 100000 – 7FFC00000 32764 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS...

  • Page 44: Back Panel Connectors

    Intel Desktop Board DB75EN Technical Product Specification 2.2.1 Back Panel Connectors Figure 10 shows the location of the back panel connectors for the board. Item Description PS/2 port USB 2.0 ports USB 2.0 ports VGA connector Parallel port DVI-D connector LAN port USB 3.0 ports...

  • Page 45: Component-Side Connectors And Headers

    Technical Reference 2.2.2 Component-side Connectors and Headers Figure 11 shows the locations of the component-side connectors and headers. Figure 11. Component-side Connectors and Headers...

  • Page 46: Component-Side Connectors And Headers Shown In Figure 11

    Intel Desktop Board DB75EN Technical Product Specification Table 12 lists the component-side connectors and headers identified in Figure 11. Table 12. Component-side Connectors and Headers Shown in Figure 11 Item/callout f rom Figure 11 Description Conventional PCI add-in card connector...

  • Page 47: Serial Port Header

    DSR (Data Set Ready) RTS (Request To Send) CTS (Clear To Send) RI (Ring Indicator) Key (no pin) Table 14. Front Panel Audio Header for Intel HD Audio Signal Name Signal Name [Port 1] Left channel Ground [Port 1] Right channel...

  • Page 48: Front Panel Usb 3.0 Connector

    Intel Desktop Board DB75EN Technical Product Specification Table 17. Front Panel USB 3.0 Connector Signal Name Description Vbus Power IntA_P1_SSRX− USB3 ICC Port1 SuperSpeed Rx− IntA_P1_SSRX+ USB3 ICC Port1 SuperSpeed Rx+ Ground IntA_P1_SSTX− USB3 ICC Port1 SuperSpeed Tx− IntA_P1_SSTX+ USB3 ICC Port1 SuperSpeed Tx+ Ground IntA_P1_D−...

  • Page 49: Chassis Intrusion Header

    Technical Reference Table 20. Chassis Intrusion Header Signal Name Intruder# Ground Table 21. Processor, Front, and Rear Chassis (4-Pin) Fan Headers Signal Name (Note) Ground +12 V FAN_TACH FAN_CONTROL Note: These fan headers use Pulse Width Modulation control for fan speed. Table 22.

  • Page 50: Add-In Card Connectors

    Intel Desktop Board DB75EN Technical Product Specification 2.2.2.2 Add-in Card Connectors The board has the following add-in card connectors: One PCI Express x16 (3.0/2.x/1.x) • One PCI Express x1 (2.x/1.x) • Two Conventional PCI (rev 2.3) • Note the following considerations for the Conventional PCI bus connectors: •...

  • Page 51: Processor Core Power Connector

    Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 • connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, attach that cable to the main power connector, leaving pins 11, 12, 23, and 24 unconnected.

  • Page 52: Connection Diagram For Front Panel Header

    Intel Desktop Board DB75EN Technical Product Specification 2.2.2.4 Front Panel Header This section describes the functions of the front panel header. Table 26 lists the signal names of the front panel header. Figure 12 is a connection diagram for the front panel header.

  • Page 53: States For A One-Color Power Led

    Technical Reference 2.2.2.4.3 Power/Sleep LED Header Pins 2 and 4 can be connected to a one- or two-color LED. Table 27 shows the possible states for a one-color LED. Table 28 shows the possible states for a two-color LED. Table 27. States for a One-Color Power LED LED State Description Power off/sleeping...

  • Page 54: Connection Diagram For Front Panel Usb 2.0 Headers

    Intel Desktop Board DB75EN Technical Product Specification 2.2.2.6 Front Panel USB 2.0 Headers Figure 13 is a connection diagram for the front panel USB 2.0 headers. NOTE The +5 V DC power on the USB headers is fused. • Use only a front panel USB connector that conforms to the USB 2.0 specification for •...

  • Page 55: Jumper Block

    Technical Reference Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 14 shows the location of the jumper block. The 3-pin jumper block determines the BIOS Setup program’s mode.

  • Page 56: Intel

    MEBX) Reset Header ® The Intel MEBX reset header (see Figure 15) allows you to reset the Intel ME configuration to the factory defaults. Momentarily shorting pins 1 and 2 with a jumper (not supplied) will accomplish the following: Return all Intel ME parameters to their default values.

  • Page 57: Mechanical Considerations

    Technical Reference Mechanical Considerations 2.5.1 Form Factor The board is designed to fit into an ATX-form-factor chassis. Figure 16 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters].

  • Page 58: Electrical Considerations

    Intel Desktop Board DB75EN Technical Product Specification Electrical Considerations 2.6.1 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.

  • Page 59: Power Supervisor

    Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm...

  • Page 60: Localized High Temperature Zones

    Intel Desktop Board DB75EN Technical Product Specification CAUTION Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.9.

  • Page 61: Thermal Considerations For Components

    For processor case temperature, see processor datasheets and processor specification updates Intel B75 Express Chipset To ensure functionality and reliability, the component is specified for proper operation when Case Temperature is maintained at or below the maximum temperature listed in Table 35.

  • Page 62: Reliability

    Issue 2; Method I Case 3 50% electrical stress, 50 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 50 ºC. The MTBF for the Intel Desktop Board DB75EN is 281,462 hours.

  • Page 63: Overview Of Bios Features

    Overview of BIOS Features Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support.

  • Page 64: Bios Flash Memory Organization

    Intel Desktop Board DB75EN Technical Product Specification Table 38 lists the BIOS Setup program menu features. Table 38. BIOS Setup Program Menu Bar Configura- Maintenance Main tion Performance Security Power Boot Exit Clears Displays Configures Configures Sets Configures Selects Saves or...

  • Page 65: System Management Bios (Smbios)

    6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used. ® 7. Additional USB legacy feature options can be access by using Intel Integrator Toolkit.

  • Page 66: Bios Updates

    Intel Desktop Board DB75EN Technical Product Specification To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s installation instructions. BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: ®...

  • Page 67: Custom Splash Screen

    The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. NOTE If you add a custom splash screen, it will share space with the Intel branded logo. Refer to For information about Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/...

  • Page 68: Boot Options

    Intel Desktop Board DB75EN Technical Product Specification Boot Options In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth.

  • Page 69: Adjusting Boot Speed

    It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen.

  • Page 70: 3.10 Bios Security Features

    Intel Desktop Board DB75EN Technical Product Specification 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: •...

  • Page 71: 3.11 Bios Performance Features

    3.11 BIOS Performance Features The BIOS includes the following options to provide custom performance enhancements when using 3 generation Intel Core processor family and 2 generation Intel Core processor family processors in an LGA1155 socket. • Processor Maximum Non-Turbo Ratio (processor multiplier can only be adjusted...
  • Page 72 Intel Desktop Board DB75EN Technical Product Specification...

  • Page 73: Error Messages And Beep Codes

    Error Messages and Beep Codes Speaker The board-mounted speaker provides audible error code (beep code) information during POST. For information about Refer to The location of the onboard speaker Figure 1, page 13 BIOS Beep Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s speaker to beep an error message describing the problem (see Table 43).

  • Page 74: Front-Panel Power Led Blink Codes

    Intel Desktop Board DB75EN Technical Product Specification Front-panel Power LED Blink Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 44). Table 44. Front-panel Power LED Blink Codes...

  • Page 75: Port 80H Power On Self Test (Post) Codes

    Error Messages and Beep Codes Port 80h Power On Self Test (POST) Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h.

  • Page 76: Port 80H Post Codes

    Intel Desktop Board DB75EN Technical Product Specification Table 47. Port 80h POST Codes Port 80 Code Progress Code Enumeration ACPI S States 0x00,0x01,0x02,0x03,0x04,0x05 Entering S0, S2, S3, S4, or S5 state 0x10,0x20,0x30,0x40,0x50 Resuming from S2, S3, S4, S5 Security Phase (SEC)
  • Page 77 Error Messages and Beep Codes Table 47. Port 80h POST Codes (continued) Port 80 Code Progress Code Enumeration PEI after MRC 0x2A Start to Program MTRR Settings 0x2B Done Programming MTRR Settings PEIMs/Recovery 0x31 Crisis Recovery has initiated 0x33 Loading recovery capsule 0x34 Start recovery capsule/ valid capsule is found CPU Initialization...
  • Page 78 Intel Desktop Board DB75EN Technical Product Specification Table 47. Port 80h POST Codes (continued) Port 80 Code Progress Code Enumeration 0x60 BDS driver entry point initialize 0x61 BDS service routine entry point (can be called multiple times) 0x62 BDS Step2...
  • Page 79 Error Messages and Beep Codes Table 47. Port 80h POST Codes (continued) Port 80 Code Progress Code Enumeration Removable Media 0xB8 Resetting removable media 0xB9 Disabling removable media 0xBA Detecting presence of a removable media (IDE, CDROM detection etc.) 0xBB Enabling/configuring a removable media DXE Core 0xE4...

  • Page 80: Typical Port 80H Post Sequence

    Intel Desktop Board DB75EN Technical Product Specification Table 48. Typical Port 80h POST Sequence POST Code Description Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase...

  • Page 81: Regulatory Compliance And Battery Disposal Information

    Electromagnetic Compatibility (EMC) standards • Product certification markings • 5.1.1 Safety Standards Intel Desktop Board DB75EN complies with the safety standards stated in Table 49 when correctly installed in a compatible host system. Table 49. Safety Standards Standard Title CSA/UL 60950-1 Information Technology Equipment –...

  • Page 82: European Union Declaration Of Conformity Statement

    European Union Declaration of Conformity Statement ® We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board DB75EN is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive).

  • Page 83: Product Ecology Statements

    当的重复使用处理。 请参考http://www.intel.com/intel/other/ehs/product_ecology 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der...
  • Page 84 Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à...
  • Page 85 Regulatory Compliance and Battery Disposal Information Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной...

  • Page 86: China Rohs

    The China Ministry of Information Industry (MII) stipulates that a material Self Declaration Table (SDT) must be included in a product’s user documentation. The SDT for Intel Desktop Board DB75EN is shown in Figure 18. Figure 18. Intel Desktop Board DB75EN China RoHS Material...

  • Page 87: Emc Regulations

    Regulatory Compliance and Battery Disposal Information 5.1.5 EMC Regulations Intel Desktop Board DB75EN complies with the EMC regulations stated in Table 50 when correctly installed in a compatible host system. Table 50. EMC Regulations Regulation Title FCC 47 CFR Part 15,...
  • Page 88 • Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications to the equipment not expressly approved by Intel Corporation could void the user’s authority to operate the equipment. Tested to comply with FCC standards for home or office use.

  • Page 89: Energy Star* 5.0, E-Standby, And Erp Compliance

    ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements. Intel Desktop Board DB75EN meets the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply: Energy Star v5.0, category D...

  • Page 90: Regulatory Compliance Marks (Board Level)

    Intel Desktop Board DB75EN Technical Product Specification 5.1.7 Regulatory Compliance Marks (Board Level) Intel Desktop Board DB75EN has the regulatory compliance marks shown in Table 51. Table 51. Regulatory Compliance Marks Description Mark UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel Desktop Boards: E210882.

  • Page 91: Battery Disposal Information

    Regulatory Compliance and Battery Disposal Information Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRÉCAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect.
  • Page 92 Intel Desktop Board DB75EN Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
  • Page 93 Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii.
  • Page 94 Intel Desktop Board DB75EN Technical Product Specification 小心 如果更換的電池類型不正確，可能會有爆炸的危險。請盡可能將電池送至回收處。請依照當地的環保 規範來處理使用過的電池。 주의 배터리를 잘못된 종류로 교체할 경우 폭발 위험이 있습니다. 가능한 경우 배터리는 재활용해야 하며, 수명이 다한 배터리를 폐기할 때는 각 지역의 환경법을 따라야 합니다. THẬN TRỌNG Có nguy cơ xảy ra nổ nếu thay pin không đúng loại. Pin cần được tái chế nếu có thể...
  • Page 95 Regulatory Compliance and Battery Disposal Information...
  • Page 96 Intel Desktop Board DB75EN Technical Product Specification...

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