Thermal Considerations For Components - Intel DH55PJ Specification

Figure 15 shows the locations of the localized high temperature zones.
Figure 15. Localized High Temperature Zones
Table 29 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 29. Thermal Considerations for Components
Component
Processor
Intel H55 Express Chipset
Item Description
A Processor voltage regulator area
B Processor
C Intel H55 Express Chipset
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
111 o C
Technical Reference
55