Intel DH55TC Specification
  1. Manuals
  2. Brands
  3. Intel Manuals
  4. Motherboard
  5. DH55TC
  6. Specification

Intel DH55TC Specification

Desktop board
Hide thumbs Also See for DH55TC:
Table of Contents

Advertisement

Quick Links

Intel® Desktop Board
DH55TC
Technical Product Specification
January 2010
Order Number: E81940-001US
®
The Intel
Desktop Board DH55TC may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DH55TC Specification Update.

Advertisement

Table of Contents
loading

Related Manuals for Intel DH55TC

Summary of Contents for Intel DH55TC

  • Page 1 Order Number: E81940-001US ® The Intel Desktop Board DH55TC may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DH55TC Specification Update.

  • Page 2: Revision History

    “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

  • Page 3: Intended Audience

    ® Intended Audience The TPS is intended to provide detailed, technical information about the Intel Desktop Board DH55TC and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
  • Page 4 Intel Desktop Board DH55TC Technical Product Specification Other Common Notation Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second Kilobyte (1024 bytes) Kbit Kilobit (1024 bits)

  • Page 5: Table Of Contents

    1.1.3 Block Diagram ..............13 1.2 Legacy Considerations..............14 1.3 Online Support................14 1.4 Processor ..................14 ® 1.5 Intel H55 Express Chipset ............... 15 1.6 System Memory ................15 1.6.1 Memory Configurations ............16 1.7 Graphics Subsystem ................ 18 1.7.1...
  • Page 6 Intel Desktop Board DH55TC Technical Product Specification 2.3 Jumper Block .................. 49 2.4 Mechanical Considerations ..............51 2.4.1 Form Factor................. 51 2.5 Electrical Considerations ..............52 2.5.1 Power Supply Considerations ..........52 2.5.2 Fan Header Current Capability..........53 2.5.3 Add-in Board Considerations ..........53 2.6 Thermal Considerations ..............
  • Page 7 14. Front Panel Audio Header for Intel HD Audio........42 15. Front Panel Audio Header for Passive AC ’97 Audio ....... 42 16. Front Panel USB Header ..............42 17. Front Panel USB Header (with Intel Z-U130 USB Solid-State Drive, or Compatible Device, Support)............. 43 18. SATA Connectors................43 19.
  • Page 8 Intel Desktop Board DH55TC Technical Product Specification 26. BIOS Setup Configuration Jumper Settings.......... 50 27. Minimum Recommended Power Supply Current Values......52 28. Fan Header Current Capability............53 29. Thermal Considerations for Components ..........55 30. Tcontrol Values for Components ............56 31.

  • Page 9: Product Description

    ― Six ports are implemented with stacked back panel connectors ― Six front panel ports are implemented with three dual-port internal headers; one header supports an Intel Z-U130 USB Solid-State Drive (or compatible device) • Six internal Serial ATA (SATA) 3.0 Gb/s ports: ―...
  • Page 10 Intel Desktop Board DH55TC Technical Product Specification Table 1. Feature Summary (continued) • Support for PCI* Local Bus Specification Revision 2.3 Instantly Available PC Technology • Support for PCI Express* • Suspend to RAM support • Wake on PCI, PCI Express, LAN, front panel, PS/2, serial and USB ports ®...

  • Page 11: Board Layout

    Product Description 1.1.2 Board Layout Figure 1 shows the location of the major components on Intel Desktop Board DH55TC. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.
  • Page 12 BIOS setup configuration jumper block Alternate front panel power LED header Front panel header Standby power LED Front panel USB header with support for an Intel Z-U130 USB Solid-State Drive (or compatible device) Front panel USB headers (2) Parallel port header...

  • Page 13: Block Diagram

    Product Description 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas of the board. Figure 2. Block Diagram...

  • Page 14: Legacy Considerations

    Processor The board is designed to support the Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors in an LGA1156 socket. Other processors may be supported in the future. This board is designed to support processors with a maximum TDP of 95 W.

  • Page 15: Intel ® H55 Express Chipset

    Intel H55 Express Chipset The Intel H55 Express Chipset consisting of the Intel H55 Platform Controller Hub (PCH) provides interfaces to the processor and the USB, SATA, LPC, audio, network, display, Conventional PCI, and PCI Express x1 interfaces. The PCH is a centralized controller for the board’s I/O paths.

  • Page 16: Memory Configurations

    025414.htm 1.6.1 Memory Configurations The Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors support the following types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal.

  • Page 17: Memory Channel And Dimm Configuration

    Figure 3 illustrates the memory channel and DIMM configuration. Figure 3. Memory Channel and DIMM Configuration NOTE When using a processor without Intel Graphics Technology: there must always be memory installed into any or both of the DIMM 0 (blue) memory slots for the system to boot.

  • Page 18: Graphics Subsystem

    Intel Desktop Board DH55TC Technical Product Specification Graphics Subsystem The board supports system graphics through either Intel Graphics Technology or a PCI Express 2.0 x16 add-in graphics card. 1.7.1 Integrated Graphics ® The board supports integrated graphics through the Intel Flexible Display Interface (FDI) for processors with Intel Graphics Technology.

  • Page 19: Pci Express X16 Graphics

    VGA or HDMI connectors. 1.7.2 PCI Express x16 Graphics The Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors in an LGA1156 socket support discrete add in graphics cards via the PCI Express 2.0 x16 graphics connector: •...

  • Page 20: Sata Interfaces

    Intel Desktop Board DH55TC Technical Product Specification SATA Interfaces The board provides six internal SATA connectors through the PCH, four for internal storage (black connectors) and two for internal as well as external SATA/eSATA connectivity (red connectors). The PCH provides independent SATA ports with a theoretical maximum transfer rate of 3 Gb/s per port.

  • Page 21: Parallel Port

    The location of the parallel port header Figure 10, page 39 1.11 Audio Subsystem The board supports Intel High Definition Audio via the HDMI interface as well as via the Realtek ALC888S audio codec. The ALC888S-based audio subsystem supports the following features: •...

  • Page 22: Back Panel Audio Connector Options

    Intel Desktop Board DH55TC Technical Product Specification 1.11.2.1 Analog Audio Connectivity The available configurable back panel audio connectors are shown in Figure 4. Item Description Audio line in Audio line out Mic in Figure 4. Back Panel Audio Connector Options The back panel audio connectors are configurable through the audio device drivers.

  • Page 23: 1.12 Lan Subsystem

    Transmit TCP segmentation • Full device driver compatibility • PCI Express power management support 1.12.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers http://downloadcenter.intel.com...

  • Page 24: Rj-45 Lan Connector With Integrated Leds

    Intel Desktop Board DH55TC Technical Product Specification 1.12.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5). Item Description Link/Activity LED (green) Link Speed LED (green/yellow) Figure 5. LAN Connector LED Locations Table 4 describes the LED states when the board is powered up and the LAN subsystem is operating.

  • Page 25: 1.13 Real-Time Clock Subsystem

    Thermally monitored closed-loop fan control for all three fans that can adjust fan speed as needed 1.14.2 Fan Monitoring ® Fan monitoring can be observed via the BIOS setup user interface, Intel Desktop Utilities or third-party software. For information about Refer to The functions of the fan headers Section 1.15.2.2, page 31...

  • Page 26: Thermal Monitoring

    Intel Desktop Board DH55TC Technical Product Specification 1.14.3 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item Description Rear chassis fan header Thermal diode, located on processor die Processor fan header Front chassis fan header...

  • Page 27: 1.15 Power Management

    Product Description 1.15 Power Management Power management is implemented at several levels, including: • Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯...

  • Page 28: Power States And Targeted System Power

    Intel Desktop Board DH55TC Technical Product Specification 1.15.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications.

  • Page 29: Wake-Up Devices And Events

    Product Description 1.15.1.2 Wake-up Devices and Events Table 7 lists the devices or specific events that can wake the computer from specific states. Table 7. Wake-up Devices and Events These devices/events can wake up the computer… …from this state Power switch S1, S3, S4, S5 RTC alarm S1, S3, S4, S5...

  • Page 30: Hardware Support

    Intel Desktop Board DH55TC Technical Product Specification 1.15.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.

  • Page 31: Fan Headers

    Product Description 1.15.2.2 Fan Headers The function/operation of the fan headers is as follows: • The fans are on when the board is in the S0 or S1 state • The fans are off when the board is in the S3, S4, or S5 state •...

  • Page 32: Instantly Available Pc Technology

    Intel Desktop Board DH55TC Technical Product Specification 1.15.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply.

  • Page 33: Location Of The Standby Power Led

    Product Description 1.15.2.9 Wake from Serial Port Serial port activity wakes the computer from an ACPI S1 or S3 state. 1.15.2.10 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off.

  • Page 34: Energy Star* 5.0, E-Standby, And Erp Compliance

    ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements. Intel Desktop Board DH55TC meets the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply: •...

  • Page 35: Technical Reference

    Technical Reference Memory Resources 2.1.1 Addressable Memory The board utilizes 16 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory).

  • Page 36: Detailed System Memory Address Map

    Intel Desktop Board DH55TC Technical Product Specification Figure 8. Detailed System Memory Address Map...

  • Page 37: Memory Map

    Technical Reference 2.1.2 Memory Map Table 8 lists the system memory map. Table 8. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K - 16777216 K 100000 - 3FFFFFFFF 16382 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS...

  • Page 38: Back Panel Connectors

    Intel Desktop Board DH55TC Technical Product Specification 2.2.1 Back Panel Connectors Figure 9 shows the location of the back panel connectors for the board. Item Description PS/2 keyboard/mouse port USB ports VGA port DVI-D connector HDMI connector USB ports USB ports...

  • Page 39: Component-Side Connectors And Headers

    Technical Reference 2.2.2 Component-side Connectors and Headers Figure 10 shows the locations of the component-side connectors and headers. Figure 10. Component-side Connectors and Headers Table 9 lists the component-side connectors and headers identified in Figure 10.
  • Page 40 Main power connector (2 x 12) SATA connectors Alternate front panel power LED header Front panel header USB header with support for an Intel Z-U130 USB Solid-State Drive (or compatible device) USB headers (2) Parallel port header Serial port header...

  • Page 41: Serial Port Header

    Technical Reference 2.2.2.1 Signal Tables for the Connectors and Headers Table 10. Serial Port Header Signal Name Signal Name DCD (Data Carrier Detect) RXD# (Receive Data) TXD# (Transmit Data) DTR (Data Terminal Ready) Ground DSR (Data Set Ready) RTS (Request To Send) CTS (Clear To Send) RI (Ring Indicator) Key (no pin)

  • Page 42: S/Pdif Header

    S/PDIF out Key (no pin) +5V_DC Table 13. Internal Mono Speaker Header Signal Name − Table 14. Front Panel Audio Header for Intel HD Audio Signal Name Signal Name [Port 1] Left channel Ground [Port 1] Right channel PRESENCE# (HD Audio/AC ’97 detect)

  • Page 43: Sata Connectors

    Technical Reference Table 17. Front Panel USB Header (with Intel Z-U130 USB Solid-State Drive, or Compatible Device, Support) Signal Name Signal Name +5 VDC +5 VDC D− D− Ground Ground KEY (no pin) LED# Table 18. SATA Connectors Signal Name...

  • Page 44: Processor Core Power Connector

    Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, pins 11, 12, 23, and 24 must remain unconnected.

  • Page 45: Main Power Connector

    Technical Reference Table 22. Main Power Connector Signal Name Signal Name +3.3 V +3.3 V +3.3 V −12 V Ground Ground +5 V PS-ON# (power supply remote on/off) Ground Ground +5 V Ground Ground Ground PWRGD (Power Good) −5 V (obsolete) +5 V (Standby) +5 V +12 V...

  • Page 46: Connection Diagram For Front Panel Header

    Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to an internal storage device. Proper LED function requires a SATA hard drive or optical drive connected to an onboard SATA connector, or the use of an Intel Z-U130 Solid-State Drive (or compatible device).

  • Page 47: Auxiliary Front Panel Power Led Header

    Technical Reference 2.2.2.4.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.2.2.4.3 Power LED Header Pins 2 and 4 can be connected to a one- or two-color LED.

  • Page 48: Connection Diagram For Front Panel Usb Headers

    Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. Figure 12. Connection Diagram for Front Panel USB Headers Figure 13. Connection Diagram for Front Panel USB Header (with Intel Z-U130 USB Solid-State Drive, or Compatible Device, Support)

  • Page 49: Jumper Block

    Technical Reference Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 14 shows the location of the jumper block. The 3-pin jumper block determines the BIOS Setup program’s mode.

  • Page 50: Bios Setup Configuration Jumper Settings

    Intel Desktop Board DH55TC Technical Product Specification Table 26. BIOS Setup Configuration Jumper Settings Function/Mode Jumper Setting Configuration Normal The BIOS uses current configuration information and passwords for booting. Configure After the POST runs, Setup runs automatically. The maintenance menu is displayed.

  • Page 51: Mechanical Considerations

    Technical Reference Mechanical Considerations 2.4.1 Form Factor The board is designed to fit into a MicroATX form-factor chassis. Figure 15 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters].

  • Page 52: Electrical Considerations

    Intel Desktop Board DH55TC Technical Product Specification Electrical Considerations 2.5.1 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.

  • Page 53: Fan Header Current Capability

    Technical Reference 2.5.2 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 28 lists the current capability of the fan headers.

  • Page 54: Thermal Considerations

    Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm...

  • Page 55: Thermal Considerations For Components

    Item Description Processor voltage regulator area Processor Intel H55 Express Chipset Figure 16. Localized High Temperature Zones Table 29 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures.

  • Page 56: Tcontrol Values For Components

    Intel Desktop Board DH55TC Technical Product Specification To ensure functionality and reliability, the component is specified for proper operation when Case Temperature is maintained at or below the maximum temperature listed in Table 29. This is a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified as the maximum sustainable power to be dissipated by the components).

  • Page 57: Reliability

    Technical Reference Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 50 ºC.
  • Page 58 Intel Desktop Board DH55TC Technical Product Specification...

  • Page 59: Overview Of Bios Features

    Overview of BIOS Features Introduction The board uses an Intel BIOS that is stored in a 64 Mbit (8,192 KB) Serial Peripheral Interface Flash Memory (SPI Flash) device which can be updated using a set of utilities. The SPI Flash contains the BIOS Setup program, POST, LAN EEPROM information, Plug and Play support, and other firmware.

  • Page 60: Bios Setup Program Menu Bar

    Intel Desktop Board DH55TC Technical Product Specification Table 32 lists the BIOS Setup program menu features. Table 32. BIOS Setup Program Menu Bar Maintenance Main Advanced Performance Security Power Boot Exit Clears Displays Configures Configures Sets Configures Selects Saves or...

  • Page 61: System Management Bios (Smbios)

    Overview of BIOS Features System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components.

  • Page 62: Bios Updates

    Intel Desktop Board DH55TC Technical Product Specification BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: ® • Intel Express BIOS Update utility, which enables automated updating while in the Windows environment.

  • Page 63: Custom Splash Screen

    During POST, an Intel splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. Refer to For information about ®...

  • Page 64: Boot Options

    Intel Desktop Board DH55TC Technical Product Specification Boot Options In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth.

  • Page 65: Bios Security Features

    Overview of BIOS Features BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: •...
  • Page 66 Intel Desktop Board DH55TC Technical Product Specification...

  • Page 67: Error Messages And Beep Codes

    Error Messages and Beep Codes Speaker The board-mounted piezoelectric speaker provides audible error code (beep code) information during POST. For information about Refer to The location of the onboard speaker Figure 1, page 11 BIOS Beep Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s piezoelectric speaker to beep an error message describing the problem (see Table 37).

  • Page 68: Front-Panel Power Led Blink Codes

    Intel Desktop Board DH55TC Technical Product Specification Front-panel Power LED Blink Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 38). Table 38. Front-panel Power LED Blink Codes...

  • Page 69: Port 80H Post Codes

    Error Messages and Beep Codes Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a PCI bus add-in card, often called a POST card.

  • Page 70: Port 80H Post Codes

    Intel Desktop Board DH55TC Technical Product Specification Table 41. Port 80h POST Codes POST Code Description of POST Operation Host Processor Power-on initialization of the host processor (Boot Strap Processor) Host processor cache initialization (including APs) Starting Application processor initialization...
  • Page 71 Error Messages and Beep Codes Table 41. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (USB) Resetting keyboard Disabling keyboard Detecting presence of keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS/2 only) Mouse (USB) Resetting mouse Disabling mouse...
  • Page 72 Intel Desktop Board DH55TC Technical Product Specification Table 41. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs Runtime Phase/EFI OS Boot Entering Sleep state...

  • Page 73: Typical Port 80H Post Sequence

    Error Messages and Beep Codes Table 42. Typical Port 80h POST Sequence POST Code Description Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase Starting application processor initialization SMM initialization Enumerating PCI busses Allocating resourced to PCI bus...
  • Page 74 Intel Desktop Board DH55TC Technical Product Specification...

  • Page 75: Regulatory Compliance And Battery Disposal Information

    Electromagnetic Compatibility (EMC) standards • Product certification markings 5.1.1 Safety Standards Intel Desktop Board DH55TC complies with the safety standards stated in Table 43 when correctly installed in a compatible host system. Table 43. Safety Standards Standard Title CSA/UL 60950-1, First Edition Information Technology Equipment –...

  • Page 76: European Union Declaration Of Conformity Statement

    European Union Declaration of Conformity Statement ® We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board DH55TC is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).

  • Page 77: Product Ecology Statements

    恰当的重复使用处理。 请参考http://www.intel.com/intel/other/ehs/product_ecology 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der...
  • Page 78 Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à...

  • Page 79: Lead Free Desktop Board

    RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six materials. One of the six restricted materials is lead. This Intel Desktop Board is lead free although certain discrete components used on the board contain a small amount of lead which is necessary for component performance and/or reliability.

  • Page 80: Lead-Free Board Markings

    Intel Desktop Board DH55TC Technical Product Specification Table 44. Lead-Free Board Markings Description Mark Lead-Free 2 Level Interconnect: This symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in the desktop board...

  • Page 81: Emc Regulations

    Regulatory Compliance and Battery Disposal Information 5.1.4 EMC Regulations Intel Desktop Board DH55TC complies with the EMC regulations stated in Table 45 when correctly installed in a compatible host system. Table 45. EMC Regulations Regulation Title FCC 47 CFR Part 15,...

  • Page 82: Product Certification Markings (Board Level)

    EMC requirements. You may use this equipment in residential environments and other non-residential environments. 5.1.5 Product Certification Markings (Board Level) Intel Desktop Board DH55TC has the product certification markings shown in Table 46: Table 46. Product Certification Markings Description Mark UL joint US/Canada Recognized Component mark.

  • Page 83: Battery Disposal Information

    Regulatory Compliance and Battery Disposal Information Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect.
  • Page 84 Intel Desktop Board DH55TC Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
  • Page 85 Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii.
  • Page 86 Intel Desktop Board DH55TC Technical Product Specification...

Table of Contents