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2.7
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia SR-332,
Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to
estimate repair rates and spare parts requirements. The MTBF data is calculated from
predicted data at 55 ºC. The MTBF for the board is 253,083 hours.
2.8
Environmental
Table 33 lists the environmental specifications for the board.
Table 33. Environmental Specifications
Parameter
Temperature
Non-Operating
Operating
Shock
Unpackaged
Packaged
Vibration
Unpackaged
Packaged
Note: Before attempting to operate this board, the overall temperature of the board must be above the
minimum operating temperature specified. It is recommended that the board temperature be at least
room temperature before attempting to power on the board.
Specification
(Note)
-20 °C to +70 °C
0 °C to +55 °C
The operating temperature of the board may be determined by measuring the
air temperature from within 1 inch of the edge of the chipset/PCH heatsink and
1 inch above the board, in a closed chassis, while the system is in operation.
50 g trapezoidal waveform
Velocity change of 170 inches/s²
Half sine 2 millisecond
Product Weight (pounds)
<20
21-40
41-80
81-100
5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
Free Fall (inches)
Velocity Change (inches/s²)
36
167
30
152
24
136
18
118
Technical Reference
59
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