Thermal Considerations For Components - Intel DQ57TM Specification

Intel Desktop Board DQ57TML Technical Product Specification
Figure 17 shows the locations of the localized high temperature zones.
Table 35 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 35. Thermal Considerations for Components
Component
Processor
Intel Q57 Express Chipset
For information about
Processor datasheets and specification updates
64
Item Description
A Processor voltage regulator area
B Processor
C Intel Q57 Express Chipset
Figure 17. Localized High Temperature Zones
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
111 C (under bias)
Refer to
Section 1.3, page 14