2.12 Reliability; Thermal Considerations For Components - Intel BLKD865GSAL Technical Product Specification

Product specification
Table of Contents

Advertisement

Intel Desktop Board D865GSA Technical Product Specification
Table 36 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 36. Thermal Considerations for Components
Component
Intel Pentium 4 processor
Intel 82865G GMCH
Intel 82801EB ICH5
For information about
Intel Pentium 4 processor datasheets and specification updates

2.12 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction
is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board
D865GSA MTBF is 62454.70 hours.
68
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
99
C (under bias)
o
115
C (under bias)
Refer to
Section 1.2, page 15

Hide quick links:

Advertisement

Table of Contents
loading

This manual is also suitable for:

Boxd865gsalD865gsaD865gvip - celeron d 13ghz combo

Table of Contents