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Thermal Metrology
The system designer must make temperature measurements in order to accurately determine the
thermal performance of the system. Intel has established guidelines for measuring chipset
component case temperatures.
3.1
Case Temperature Measurements
To ensure functionality and reliability, the chipset component is specified for proper operation when
T
is maintained at or below the maximum temperature listed in Table 2. The surface temperature
C
at the geometric center of the mold encapsulant corresponds to T
care to ensure an accurate temperature measurement.
Temperature differences between the temperature of a surface and the surrounding local ambient air
can introduce error in the measurements. The measurement errors could be due to a poor thermal
contact between the thermocouple junction and the surface of the package, heat loss by radiation
and/or convection, and/or conduction through thermocouple leads. To minimize these measurement
errors, the approach described below titled 0° Angle Thermocouple Attach Methodology is
recommended.
3.2
0° Angle Thermocouple Attach Methodology
1. Mill a 3.3 mm [0.13 in] diameter hole centered on bottom of the heatsink base. The milled hole
should be approximately 1.5 mm [0.06 in] deep.
2. Mill a 1.3 mm [0.05 in] wide slot, 0.5 mm [0.02 in] deep, from the centered hole to one edge of
the heatsink. The slot should be in the direction parallel to the heatsink fins (see Figure 2).
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts
should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of
the top surface of the case using high thermal conductivity cement. During this step, make sure
no contact is present between the thermocouple cement and the heatsink base because any
contact will affect the thermocouple reading. It is critical that the thermocouple bead makes
contact with the case (see Figure 1).
6. Attach heatsink assembly to the ICH8, and route thermocouple wires out through the milled
slot.
Thermal and Mechanical Design Guidelines
Thermal Metrology
. Measuring T
requires special
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