Related Manuals for Intel 6700PXH 64-BIT PCI HUB - MECHANICAL DESIGN
Summary of Contents for Intel 6700PXH 64-BIT PCI HUB - MECHANICAL DESIGN
- Page 1 ® Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines August 2004 Document Number: 302817-003...
- Page 2 Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting Intel's website at http://www.intel.com.
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Page 3: Table Of Contents
Extruded Heatsink Profiles ..............20 6.5.3 Mechanical Interface Material..............20 6.5.4 Thermal Interface Material..............21 6.5.5 Heatsink Clip ..................21 6.5.6 Clip Retention Anchors................22 Reliability Guidelines..................22 Thermal Solution Component Suppliers..............23 Torsional Clip Heatsink Thermal Solution............23 Mechanical Drawings ....................25 ® Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines... - Page 4 5-2. Zero Degree Angle Attach Methodology (Top View) ..........16 6-1. Reference Heatsink Measured Thermal Performance Versus Approach Velocity ..17 ® 6-2. Torsional Clip Heatsink Volumetric Envelope for the Intel 6700PXH 64-bit PCI Hub Chipset Component ...................18 6-3. Torsional Clip Heatsink Board Component Keepout ..........19 6-4.
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Page 5: Revision History
Number -001 Initial release Jul 2004 -002 Added “reference thermal solution rails to PXH package” footprint drawing in Aug 2004 Section 6.5 -003 Removed inaccurate text in three graphics Sep 2004 ® Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines... - Page 6 Introduction ® Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines...
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Page 7: Introduction
The goals of this document are to: ® Outline the thermal and Mechanical operating limits and specifications for the Intel 6700PXH 64-bit PCI Hub component. ® Describe a reference thermal solution that meets the specification of Intel 6700PXH 64-bit PCI Hub component. -
Page 8: Reference Documents
The reader of this specification should also be familiar with material and concepts presented in the following documents: Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Datasheet Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Thermal Design Guide Intel®6700PXH 64-bit PCI Hub (PXH) Thermal/Mechanical Design Guide... -
Page 9: Packaging Technology
6700PXH 64-bit PCI Hub component uses a 31 mm x 31 mm, 8-layer FC-BGA package (see Figure 2-1Figure 2-1Figure 2-1, Figure 2-2Figure 2-2Figure 2-2, and Figure 2-3Figure 2-3Figure 2-3). ® Figure 2-1. Intel 6700PXH 64-bit PCI Hub Package Dimensions (Top View) Handling Keepout 0.491 in. -
Page 10: Package Mechanical Requirements
Packaging TechnologyPackaging TechnologyPackaging Technology ® Figure 2-3. Intel 6700PXH 64-bit PCI Hub Package Dimensions (Bottom View) 4X 0.635 31.000 + 0.100 4X 15.500 1.270 23X 1.270 (0.895) 8X 14.605 29.2100 31.000 + 0.100 0.200 C NOTES: 1. All dimensions are in millimeters. -
Page 11: Thermal Specifications
For TDP specifications, see Table 3-1 for the PXH component. Flip chip ball grid array (FC-BGA) packages have poor heat transfer capability into the board and have minimal thermal capability without a thermal solution. Intel recommends that system designers plan for a heatsink when using the PXH component. - Page 12 Thermal SpecificationsThermal Simulation ® Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines...
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Page 13: Thermal Simulation
Computational Fluid Dynamics (CFD)-based thermal analysis tool “FLOTHERM”* (version 3.1 or higher) by Flomerics, Inc. These models are also available in IcePak* format. Contact your Intel field sales representative to order the Icepak thermal model and user's guide. - Page 14 Thermal SimulationThermal Simulation ® Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines...
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Page 15: Thermal Metrology
The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the PXH die temperatures. Section 5.1 provides guidelines on how to accurately measure the PXH die temperatures. -
Page 16: Zero Degree Angle Attach Heatsink Modifications
Figure 5-1. Zero Degree Angle Attach Heatsink Modifications NOTE: Not to scale. Figure 5-2. Zero Degree Angle Attach Methodology (Top View) Thermocouple Wire Cement + Thermocouple Bead Substrate 001321 NOTE: Not to scale. ® Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines... -
Page 17: Reference Thermal Solution
Reference Thermal Solution Intel has developed one reference thermal solution to meet the cooling needs of the PXH component under operating environments and specifications defined in this document. This chapter describes the overall requirements for the reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria. -
Page 18: Mechanical Design Envelope
When using heatsinks that extend beyond the PXH reference heatsink envelope shown in Figure 6-2Figure 6-2Figure 6-2, any motherboard components placed between the heatsink and motherboard cannot exceed 2.40 mm (0.094 in.) in height. ® Figure 6-2. Torsional Clip Heatsink Volumetric Envelope for the Intel 6700PXH 64-bit PCI Hub Chipset Component 3.01mm. -
Page 19: Torsional Clip Heatsink Board Component Keepout
0.750 See Detail Keepout (0.165) Detail A 0.100 0.165 0.083 2x 0.038 Plated Through Hole 0.173 0.345 0.200 0.100 2x 0.056 Trace Component Keepout Keepout NOTE: All dimensions are in inches. ® Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines... -
Page 20: Heatsink Orientation
Other heatsinks with similar dimensions and increased thermal performance may be available. Full mechanical drawing of this heatsink is provided in Appendix B. 6.5.3 Mechanical Interface Material There is no mechanical interface material associated with this reference solution. ® Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines... -
Page 21: Thermal Interface Material
The reference solution uses a wire clip with hooked ends. The hooks attach to wire anchors to fasten the clip to the board. See Appendix B for a mechanical drawing of the clip. ® Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines... -
Page 22: Clip Retention Anchors
6.5.6 Clip Retention Anchors ® For Intel 6700PXH 64-bit PCI Hub-based platforms that have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention on the board. It is based on a standard three-pin jumper and is soldered to the board like any common through-hole header. -
Page 23: A Thermal Solution Component Suppliers
Thermal Solution Component Suppliers Torsional Clip Heatsink Thermal Solution Supplier Part Intel Part Number Contact Information (Part Number) Heatsink Assembly includes: Harry Lin (USA) 714-739-5797 Unidirectional Fin hlinack@aol.com Heatsink C76435-001 CCI/ACK* Monica Chih (Taiwan) Thermal Interface 866-2-29952666, x131 Material monica_chih@ccic.com.tw... - Page 24 Thermal Solution Component Suppliers ® Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines...
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Page 25: B Mechanical Drawings
Drawing Description Figure Number Torsional Clip Heatsink Assembly Drawing Figure B-1Figure B- 1Figure B-1 Torsional Clip Heatsink Drawing Figure B-2Figure B- 2Figure B-2 Torsional Clip Drawing Figure B-3Figure B- 3Figure B-3 ® Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines...