Power Consumption - Radio Modes; Nonvolatile (Flash) Memory Characteristics; Thermal Resistance Characteristics - Texas Instruments SimpleLink CC2651R3SIPA Manual

Multiprotocol 2.4 ghz wireless system-in-package module with integrated antenna & 352-kb memory
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CC2651R3SIPA
SWRS278B – FEBRUARY 2022 – REVISED AUGUST 2023

8.6 Power Consumption - Radio Modes

When measured on the
CC2651RSIPA-EM
otherwise noted.
PARAMETER
Radio receive current
Radio transmit current
2.4 GHz PA (Bluetooth Low Energy)

8.7 Nonvolatile (Flash) Memory Characteristics

Over operating free-air temperature range and V
PARAMETER
Flash sector size
Supported flash erase cycles before failure, full bank
Supported flash erase cycles before failure, single sector
Maximum number of write operations per row before sector
(3)
erase
Flash retention
Flash sector erase current
(4)
Flash sector erase time
Flash write current
(4)
Flash write time
(1)
A full bank erase is counted as a single erase cycle on each sector
(2)
Up to 4 customer-designated sectors can be individually erased an additional 30k times beyond the baseline bank limitation of 30k
cycles
(3)
Each wordline is 2048 bits (or 256 bytes) wide. This limitation corresponds to sequential memory writes of 4 (3.1) bytes minimum
per write over a whole wordline. If additional writes to the same wordline are required, a sector erase is required once the maximum
number of write operations per row is reached.
(4)
This number is dependent on Flash aging and increases over time and erase cycles
(5)
Aborting flash during erase or program modes is not a safe operation.

8.8 Thermal Resistance Characteristics

R
Junction-to-ambient thermal resistance
θJA
R
Junction-to-case (top) thermal resistance
θJC(top)
R
Junction-to-board thermal resistance
θJB
ψ
Junction-to-top characterization parameter
JT
ψ
Junction-to-board characterization parameter
JB
(1)
For more information about traditional and new thermal metrics, see
(2)
°C/W = degrees Celsius per watt.
8.9 RF Frequency Bands
Over operating free-air temperature range (unless otherwise noted).
Frequency bands
12
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reference design with T
TEST CONDITIONS
2440 MHz
0 dBm output power setting
2440 MHz
+5 dBm output power setting
2440 MHz
= 3.0 V (unless otherwise noted)
DDS
(1) (5)
(2)
105 °C
Average delta current
Zero cycles
30k cycles
Average delta current, 4 bytes at a time
4 bytes at a time
(1)
THERMAL METRIC
PARAMETER
Product Folder Links:
= 25 °C, V
= 3.0 V with DC/DC enabled unless
c
DDS
TEST CONDITIONS
Semiconductor and IC Package Thermal
Copyright © 2023 Texas Instruments Incorporated
CC2651R3SIPA
www.ti.com
TYP
6.7
7.7
10
MIN
TYP
MAX
UNIT
8
KB
30
k Cycles
60
k Cycles
Write
83
Operations
11.4
Years
10.7
mA
10
ms
4000
ms
6.2
mA
21.6
ms
PACKAGE
MOU
UNIT
(SIP)
59 PINS
48.7
°C/W
12.4
°C/W
32.2
°C/W
0.40
°C/W
32.0
°C/W
Metrics.
MIN
TYP
MAX
UNIT
2360
2500
MHz
UNIT
mA
mA
mA
(2)
(2)
(2)
(2)
(2)

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