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2.
L6 Integrated System Essential System Component
Installation
The Intel® D50DNP Modules are offered with different levels of system integration. Modules that are not
power-on ready are identified as L6 integrated modules. L6 modules require essential components (sold
separately) to be installed. If your Intel® D50DNP Module did not come preinstalled with any of the following
components, follow the procedures in this chapter:
•
2 processors – 4
Memory:
•
o Up to 16 DDR5 DIMMs or
o Up to 8 DDR5, plus 8 Intel® Optane™ persistent memory (PMem) 300 series DIMMs (air-cooled
configurations only).
Liquid-cooling Loop (liquid-cooled configurations only)
•
•
Power supplies
If your Intel® D50DNP Module came preinstalled with all the components listed earlier, skip this chapter and
go to
Chapter 3
for installation procedures associated with all other system options and accessories.
To complete the L6 integration of the Intel® Server D50DNP to be power-on ready, a chassis from the Intel®
Server Chassis FC2000 v2 family is required to contain the L6 integrated modules. The chassis for L6
systems is sold separately. The 2700 W (air cooled) or 3000 W (liquid cooled) power supply units are also
sold separately.
Each module within a system is operating independently from the others. However, the modules share
common chassis resources like power and cooling.
System D50DNP can be configured.
For additional information regarding configuration options, see the Intel® Server D50DNP Family
Configuration Guide.
Module Type
D50DNP1MHCPAC
Compute
D50DNP1MHEVAC
D50DNP1MHCPLC
Management
D50DNP2MHSVAC
Intel® Data
Center GPU Max
D50DNP1MFALLC
Series
Accelerator
PCIe* Accelerator
D50DNP2MFALAC
Intel® Server D50DNP Family Integration and Service Guide
th
Gen Intel® Xeon® Scalable processors or Intel® Xeon® CPU Max Series processors
Table 2. Intel® D50DNP Modules
iPC
Height
1U
2U
1U
2U
Table 2
describes the different ways that an Intel® Server
Width
Cooling
Air cooled
Half width
Liquid cooled
Half width
Air cooled
Full width
Liquid cooled
Full width
Air cooled
Maximum Processor
Modules per
Thermal Design
Power (TDP)
250 W
270 W
Up to four
350 W
350 W
350 W
350 W
Chassis
Up to two
Up to two
One
23
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