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electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically
shorted together by conductive foam, alminum foil or
comparableconductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to
the chassis or circuit assembly into which the device will be
installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe
all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement
ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a
carpeted floor can generate static electricity (ESD) sufficient
todamage an ES device).
4. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it's manufacture due to environmental conservation issues.
For service and repair work, we'd suggest the use of Pb free solder as well, although Pb solder
may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
- Pb free solder has a higher melting point than standard solder.
stamped on the back of PCB.
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