Panasonic PV-DV101 Manual page 5

foil, to prevent electrostatic charge buildup or exposure of the
assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an antistatic solder removal device. Some solder
removal devices not classified as "antistatic (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically
shorted together by conductive foam, aluminum foil or
comparableconductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to
the chassis or circuit assembly into which the device will be
installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe
all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement
ES devices. (Otherwise harmless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a
carpeted floor can generate static electricity (ESD)sufficient to
damage an ES device).
3. X-RADIATION
(For model with Monochrome EVF)
WARNING :
1. The potential source of X-Radiation in EVF sets is the High
Voltage section and the picture tube.
2. When using a picture tube test jig for service, ensure that jig is
capable of handling 10 kV without causing X-Radiation.
NOTE :
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