HP Compaq 6730b Maintenance And Service Manual page 79

8. Remove the heat sink (2) by sliding it to the right.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Thermal paste is used on the
processor (1) and the section of the heat sink (1) that services it. Thermal pads are used on the
Northbridge chip (2) and the section of the heat sink (2) that services it. Replacement thermal
material is included with all heat sink, system board, and processor spare part kits.
Reverse this procedure to install the heat sink.
Component replacement procedures 71