Table of Contents
Disclaimers ...................................................................................................... ii
ESD Precautions ............................................................................................. iii
Section 1
1.1
Features ................................................................................................ 8
1.2
Specifications ........................................................................................ 8
1.3
Packing list .......................................................................................... 10
Section 2
2.1
Board Layout ....................................................................................... 11
2.2
Block Diagram ..................................................................................... 12
2.3
Jumper Settings .................................................................................. 13
2.3.1
2.3.2
Clear CMOS (JP2) .................................................................................... 14
2.3.3
2.4
Connectors .......................................................................................... 15
2.4.1
COM1 Connector (CN1) ............................................................................ 16
2.4.2
2.4.3
2.4.4
Audio Jack (CN4) ...................................................................................... 17
2.4.5
2.4.6
2.4.7
2.4.8
2.4.9
GPIO Header (CN10) ................................................................................ 19
2.4.10
SMBus Header (CN11).............................................................................. 19
2.4.11
2.4.12
2.4.13
2.4.14
2.4.15
2.4.16
2.4.17
2.4.18
2.4.19
2.4.20
Section 3
3.1
Microprocessors .................................................................................. 27
iv
Introduction ............................................. 7