Table Of Contents - Sony HCD-CPZ1DAB Service Manual

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HCD-CPZ1DAB
1.
2.
................................................................... 5
3.
3-1. Disassembly Flow ........................................................... 6
3-2. Case ................................................................................. 7
3-3. Front Panel Section ......................................................... 7
3-5. PANEL Board .................................................................. 8
3-6. MAIN Board .................................................................... 9
3-8. DAB Module Assy .......................................................... 10
3-9. Chassis (Top) ................................................................... 10
3-10. Lever (Loading-L/R) ....................................................... 11
3-11. Lever (Disc Sensor), Lever (Disc Stop) .......................... 12
Motor (Pulley) Assy (Loading) (M701) .......................... 12
3-13. CD Board ......................................................................... 13
3-14. BU Section ...................................................................... 13
3-15. Optical Pick-up Block (KSM-213DCP) .......................... 14
3-16. Lever (BU Lock) ............................................................. 14
3-17. Close Lever ...................................................................... 15
3-18. Lever (DIR), Gear (IDL-B) ............................................. 15
3-19. Gear (IDL-C) ................................................................... 16
4.
.............................................................. 17
5.
6.
7.
- CD SERVO/TAPE DECK Section - ............................ 20
7-2. Block Diagram - MAIN Section - .................................. 21
- PANEL/KEY/POWER SUPPLY Section - .................. 22
7-4. Printed Wiring Board - CD Board - ............................... 24
7-5. Schematic Diagram - CD Board - .................................. 25
7-6. Printed Wiring Board - TC Board - ................................ 26
7-7. Schematic Diagram - TC Board - .................................. 27
7-8. Printed Wiring Board - DAB Board - ............................. 28
7-9. Schematic Diagram - DAB Board - ............................... 29
7-10. Printed Wiring Board - DRIVER Board - ...................... 30
7-11. Schematic Diagram - DRIVER Board - ......................... 30
7-12. Printed Wiring Board - MAIN Board - .......................... 31
7-15. Schematic Diagram - AMP Board (1/2) - ...................... 34
7-16. Schematic Diagram - AMP Board (2/2) - ...................... 35
7-17. Printed Wiring Board - AMP Board - ............................ 36
7-18. Printed Wiring Board - SP Board - ................................ 37
7-19. Schematic Diagram - SP Board - ................................... 37
7-20. Printed Wiring Board - LCD Board - ............................. 38
7-21. Schematic Diagram - LCD Board - ................................ 39
7-23. Schematic Diagram - PANEL Section - ......................... 41
7-24. Printed Wiring Boards - JACK Section - ....................... 42
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TABLE OF CONTENTS

............................................... 4
....................... 19
......................... 19
7-25. Schematic Diagram - JACK Section - ............................ 43
8.
8-1. Case Section .................................................................... 60
8-2. Mechanical Deck (Tape) Section ..................................... 61
8-3. Front Panel Section ......................................................... 62
8-4. Lid (TC) Section .............................................................. 63
8-5. Chassis Section ................................................................ 64
8-6. AMP/Power Section ........................................................ 65
(CDM80BH-K6BD83S-WD) .......................................... 66
(CDM80BH-K6BD83S-WD) .......................................... 67
(CDM80BH-K6BD83S-WD) .......................................... 68
8-10. Base Unit Section (BU-K6BD83S-WD) ......................... 69
9.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
................................ 70

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