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1.
2.
Location of Controls ........................................................ 5
3.
3-1. Disassembly Flow ........................................................... 7
3-2. Case ................................................................................. 8
3-3. Main Board, Front Panel Section .................................... 8
3-4. Tape Mechanism Deck .................................................... 9
3-5. Panel Board ..................................................................... 9
3-6. Back Panel ....................................................................... 10
3-8. S-Master Board ................................................................ 11
3-9. Tray .................................................................................. 11
3-11. Base Unit (BU-F1BD81A) .............................................. 12
3-12. BD Board ......................................................................... 13
4.
.............................................................. 14
5.
6.
Deck section .................................................................... 17
CD Section ...................................................................... 18
7.
7-1. Circuit Board Location .................................................... 21
7-2. Block Diagram - CD Servo Section - ............................ 22
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.

TABLE OF CONTENTS

................................................ 4
....................... 17
This appliance is classified as
a CLASS 1 LASER product.
This label is located on the rear
exterior.
7-4. Block Diagram - Main Section - ................................... 24
7-5. Block Diagram - S-Master Section - ............................. 25
7-6. Printed Wiring Board - BD Board - .............................. 26
7-7. Schematic Diagram - BD Board - ................................. 27
7-10. Printed Wiring Boards - Main Board - .......................... 30
7-14. Printed Wiring Boards - Panel Board - ......................... 34
7-15. Schematic Diagram - Panel Board - ............................... 35
7-19. Schematic Diagram - S-Master Board - ........................ 39
7-20. IC Block Diagram ........................................................... 40
7-21. IC Pin Function Description ............................................ 41
8.
8-1. Main Section .................................................................... 47
8-2. Front Panel Section ......................................................... 48
8-3. Chassis Section ................................................................ 49
(CDM81B-F1BD81A) .................................................... 50
(CDM81B-F1BD81A) .................................................... 51
(CDM81B-F1BD81A) .................................................... 52
9.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
HCD-CPX22/NXM3
................................ 53
3

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