Transceiver Reassembly High Power Models; Figure 5-19. Wakefield / Thermal Compound Application Area; Figure 5-20. Inserting Transceiver Board - Motorola MCS 2000 Service Instructions Manual

5-16 Disassembly & Reassembly and Replacement Procedures: Transceiver Reassembly High Power Models

Transceiver Reassembly High Power Models

NOTE: Replace all gaskets at each servicing to ensure proper sealing of unit.
1. Inspect and reapply a thin coat of thermal compound as necessary to the heatsinking pads,
voltage regulator and Audio PA areas in the chassis per
compound may negatively effect heat sinking.

Figure 5-19. Wakefield / Thermal Compound Application Area

2. Insert the transceiver board placing board slots over locating features in chassis. Be sure the
board is sitting flush on the chassis mounting surface.
3. Replace the 25-D connector gasket on the transceiver board.
4. Replace the RF and power connector gaskets on the PA board.
5. Install the PA board carefully at an appropriate angle (approximately 30
necting the 2 and 12 pin connectors to the RF board.
6. Install the 2 PA connector retaining clips over the RF and power connectors and chassis wall.
December 6, 2004
Apply Thermal Compound
to these raised areas
Apply Thermal Compound
to this portion of
chassis wall
Spring Diode
Chassis
locating features

Figure 5-20. Inserting Transceiver Board

Figure 5-19. A thick coat of thermal
Transceiver board
o
) to the chassis con-
68P81083C20-D