User's Notice; Manual Revision Information; Item Checklist; Cooling Solutions - JETWAY HA 18 User Manual

Amd 990x & amd sb950 based m/b for amd am3+/am3 processor
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USER'S NOTICE

COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER.
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARES DESCRIBED IN IT MAY BE
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY
ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED FOR THE UTILIZATION OF THESE
MOTHER-BOARDS TO MEET THE USER'S REQUIREMENTS. BUT IT WILL CHANGE, CORRECT
AT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL "AS IS"
WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF
PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND
THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER'S
BENEFIT, WITHOUT INTENT TO INFRINGE.

Manual Revision Information

Reversion
Revision History
1.0
First Edition

Item Checklist

Motherboard
User's manual
DVD for motherboard utilities
SATA hard disk cable
I/O Back Panel Shield

Cooling Solutions

-for AMD Processor Family
As processor technology pushes to faster speeds and higher performance with
increasing operation clock, thermal management becomes increasingly crucial while
building computer systems. Maintaining the proper computing environment without
thermal increasing is the key to reliable, stable, and 24 hours system operation. The
overall goal is keeping the processor below its specified maximum case temperature.
Heatsinks induce improved processor heat dissipation through increasing surface
area and concentrated airflow from attached active cooling fans. In addition, interface
materials allow effective transfers of heat from the processor to the heatsink. For
optimum heat transfer, AMD recommends the use of thermal grease and mounting
clips to attach the heatsink to the processor.
Please refer to AMD website for collection of heatsinks evaluated and recommended
for Socket AM3+ processors by AMD. In addition, this collection is not intended to be
a comprehensive listing of all heatsinks that support Socket AM3+ processors.
Date
June, 2011
iv
NO PART OF THIS

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