HP 240 G8 Maintenance And Service Manual page 54

3. Thoroughly clean the thermal material from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the heat
sink and system board spare part kits.
Thermal paste is used on the integrated system board processor (1) and associated location on the heat
sink (2). Thermal pads are used on specific system board components (3) and associated locations on
the heat sink (4).
4. UMA graphics with a fan: In the order indicated on the heat sink, remove the four Phillips M2.0 × 2.8
screws (1) that secure the heat sink to the system board.
5. Remove the heat sink (2).
46 Chapter 5 Removal and replacement procedures for authorized service provider parts