Table of Contents
Advertisement
26633 Rev. 3.03 September 2003
Chapter 2 AMD Athlon
This chapter describes thermal solutions for the AMD Athlon™ 64, AMD Athlon 64 FX, and
AMD Opteron™ processors.
2.1 AMD Athlon
AMD Opteron
The objective of thermal solutions, commonly referred to as heatsinks, is to maintain the processor
temperature within specified limits. The main factors that must be considered during the design of
a thermal solution are the thermal performance, physical mounting, acoustic noise, mass,
reliability, and cost.
This document presents the thermal and mechanical specifications, and heatsink requirements for
the AMD Athlon 64, AMD Athlon 64 FX, and AMD Opteron processors. The thermal and
mechanical specifications for the 940-pin AMD Athlon 64 FX processor are the same as those for
the AMD Opteron processor. For the thermal and mechanical requirements for the
AMD Athlon 64 FX processor, refer to the AMD Opteron processor information presented in this
document.
Table 1 lists the pertinent AMD Athlon 64 and AMD Opteron processor specifications for a
thermal solution design.
Table 1. Mechanical and Thermal Specifications for the AMD Athlon™ 64 and
AMD Opteron™ Processors
Symbol
T
Maximum case
CASE
temperature
A
Processor contact area
CPU
Form factor
Processor form factor
Form factor
Processor form factor
Chapter 2
AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Requirements
Preliminary Information
Processors Thermal Requirements
™
64, AMD Athlon 64 FX, and
™
Processor Specifications
Description
62–70°C
1400 sq. mm
µPGA
µPGA
AMD Athlon™ 64 and AMD Opteron™ Processors
™
64 and AMD Opteron
Maximum Value
Thermal Design Guide
Notes
Case temperature will be
defined in the processor
datasheet
Interfaces with heatsink
PGA Socket 754 form factor
for AMD Athlon™ 64
processor
PGA Socket 940 form factor
for AMD Opteron™ processor
™
13
Advertisement
Table of Contents
