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AMD Athlon 64 FX manual available for free PDF download: Thermal Design Manual
AMD Athlon 64 FX Thermal Design Manual (82 pages)
Brand:
AMD
| Category:
Computer Hardware
| Size: 5.03 MB
Table of Contents
Table of Contents
3
Revision History
9
Chapter 1 Introduction
11
Summary of Requirements
11
Chapter 2 AMD Athlon
13
And AMD Opteron Processors Thermal Requirements
13
AMD Athlon
13
Processor
13
Table 1. Mechanical and Thermal Specifications for the AMD Athlon™ 64 and AMD Opteron™ Processors
13
Socket Description
14
Figure 1. 754-Pin Μpga Socket Used for the AMD Athlon™ 64 Processor
14
Figure 2. 940 Pin Μpga Socket Used for the AMD Opteron™ Processor
15
Motherboard Component Height Restrictions
16
Figure 3. Motherboard Component Height Restrictions for the AMD Athlon 64 Processor Thermal Solution
16
Figure 4. Motherboard Component Height Restrictions for the AMD Opteron Processor Thermal Solution
17
Thermal Solution Design Requirements
18
Table 2. Thermal Solution Design Requirements for the AMD Athlon 64 and AMD Opteron
18
Sample Heatsinks and Attachment Methods
19
Thermal Reference Design Solution 1
19
Table 3. Components for the AMD Athlon 64 and AMD Opteron Processors Thermal Reference
19
Figure 5. AMD Athlon 64 and AMD Opteron Processors Thermal Reference Design
20
Figure 6. Thermal Reference Design Solution 1 Components Assembled for Shipment
21
Figure 7. View of an Installed Heatsink Utilizing the Thermal Reference Design
21
Thermal Reference Design Solution 2
22
Table 4. Components for the AMD Athlon 64 and AMD Opteron Processors Thermal Reference
22
Figure 8. Exploded View of the Components Utilized in the AMD Athlon 64 and
23
Figure 9. Thermal Reference Design Solution 2 Components Configured for Shipment
24
Figure 10. View of a Heatsink Installation Utilizing the Thermal Reference Design
24
Thermal Solution Design Considerations
25
Backplate Assembly
25
Spring Clip
25
Retention Frame
26
Heatsink
26
Table 5. Chemical Composition of SK7 Spring Steel
26
Figure 11. Example of a Low-Cost Heatsink Using Aluminum Extrusion Technology
27
Figure 12. High Performance Heatsink with Copper Slug Embedded in the Base
28
Figure 13. Required Exhaust Airflow Direction for Motherboard Voltage Regulator
29
Fans
30
Figure 14. Typical Temperature-Fan Speed Relation for Speed-Controlled Fan
31
Figure 15. Acoustic Noise from Sample Thermal Solutions with a 70X15 MM Fan
32
Thermal Interface Material
33
EMC Shield
33
Table 6. Suggested Thermal Interface Materials
33
Chapter 3 Conclusion
35
A Appendix
37
Thermocouple Instrumentation
37
Case Thermocouple Attachment
37
Figure 16. Diagonals Marked on Processor to Locate Center
37
Figure 17. Thermocouple Taped to Processor Lid
38
Figure 18. Thermocouple Attached to Processor with Strain Relief on Package and PCB
39
Figure 19. Heatsink with Thermocouple Relief Groove Machined into Base
39
Heatsink Thermocouple Attachment
40
Ambient Thermocouple Attachment
40
Figure 20. Heatsink Thermocouple Relief Groove and Measurement Hole
40
Procedure for Clip Load Testing
41
Equipment
41
Figure 21. an Entran ELW-D1 Load Cell
41
Figure 22. Load Cell Inserted into the Load Cell Fixture
42
Figure 23. Drawing of Load Cell Fixture for the Entran ELW-D1 Load Cell
43
Figure 24. Test Board with a Load Cell Fixture Installed in the Socket 754
45
Figure 25. Heatsink Installation over the Load Cell Fixture
46
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