Board-To-Board Application Connector; Table 19: Technical Specifications Of Molex Board-To-Board Connector - Siemens XT65 Hardware Overview

XT65/XT75 Hardware Interface Overview

7.3 Board-to-Board Application Connector

7.3 Board-to-Board Application Connector
This section provides the specifications of the 80-pin board-to-board connector used to connect XT65/XT75 to
the external application.
Connector mounted on the XT65/XT75 module:
Type: 52991-0808 SlimStack Receptacle 80 pins, 0.50mm pitch, for stacking heights from 3.0 to 4.0mm,
see Figure 14
Supplier: Molex, http//www.molex.com

Table 19: Technical specifications of Molex board-to-board connector

Parameter
Electrical
Number of Contacts
Contact spacing
Voltage
Rated current
Contact resistance
Insulation resistance
Dielectric Withstanding Voltage
Physical
Insulator material (housing)
Contact material
st
Insertion force 1
th
Insertion force 30
st
Withdrawal force 1
Maximum connection cycles
XT65_XT75_HO_v00.130
Confidential / Preliminary
for details.
Specification (80-pin B2B connector)
80
0.5mm (.020")
50V
0.5A max per contact
50mΩ max per contact
> 100MΩ
500V AC (for 1 minute)
White glass-filled LCP plastic, flammability UL 94V 0
Plating: Gold over nickel
< 74.4N
< 65.6N
> 10.8N
30 (@ 70mΩ max per contact)
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