Samsung ML-6050 Service Manual page 120

Electrical Parts Lists
SEC. Code
2203-000595 C301
2203-000634 C108, C109, C110, C111,
2203-000634 C112, C120, C157, C158,
C165, C166, C190, C314
2203-000938 C341, C342, C343, C344,
C345, C346, C347
2203-001002 C104, C105, C107, C113
2203-001158 C48, C50, C306
2404-000128 C162
2404-000308 C1, C2, C3, C191
2404-000308 C304, C340
2804-000349 OSC1
2804-001230 OSC2
2901-000229 LF1, LF2, LF3, LF4, LF5
2901-000229 LF9
2901-000235 LF6, LF10
3301-001074 B5, B6, R96
3301-001074 B7, B8, B113, B114, BD1
3702-000118 J1
3709-000177 J7
3711-001091 J2
3711-003204 J5
3711-003205 J11
4701-001020 U29
JC11-10507A U28
JC11-10510A U27
JC13-10506A U40
JC41-00003A PCB-6050
7-22
Location No.
C-CERAMIC, CHIP
C-CERAMIC, CHIP
C-CERAMIC, CHIP
C-CERAMIC, CHIP
C-CERAMIC, CHIP
C-CERAMIC, CHIP
C-TA, CHIP
C-TA, CHIP
C-TA, CHIP
OSCILLATOR-CLOCK
OSCILLATOR-CLOCK
FILTER-EMI SMD
FILTER-EMI SMD
FILTER-EMI SMD
CORE-FERRITE BEAD
CORE-FERRITE BEAD
CONNECTOR-RIBBON
CONNECTOR-CARD EDGE 72P, 1.27mm, ANGLE, SN
CONNECTOR-HEADER
CONNECTOR-HEADER
CONNECTOR-HEADER
FREQ-ATTENUATOR
IC MASK ROM-HIGH
IC MASK ROM-PCL6, LOW
IC ASIC-RET, GRAY
PCB—CONTROLLER
Description
220pF, 5%, 50V, NPO, TP, 2012, -
22pF, 5%, 50V, NPO, TP, 2012, -
22pF, 5%, 50V, NPO, TP, 2012, -
470pF, 5%, 50V, NPO, TP, 2012, -
47pF, 5%, 50V, NPO, TP, 2012, -
68pF, 5%, 50V, NPO, TP, 2012, -
10uF, 20%, 16V, -, TP, 6032, -
33uF, 20%, 10V, -, TP, 7342, 4.4mm
33uF, 20%, 10V, -, TP, 7342, 4.4mm
66MHz, 100ppm, 10 TTL, BK, 5V, 45mA
47.7789MHz, 50ppm, 10TTL & CMOS,
50V, 300mA, -, 22nF, 4.5x1.8x3.2mm
50V, 300mA, -, 22nF, 4.5x1.8x3.2mm
50V, 300mA, -, 150pF, 4.5x1.8x3.2,
AB, 2.0x1.25x0.9mm, -, -
AB, 2.0x1.25x0.9mm, -, -
36P, FEMALE, ANGLE, AU
BOX, 7P, 1R, 2.5mm, STRAIGHT, SN
BOX, 24P, 2R, 2mm, STRAIGHT, SN
BOX, 4P, 1R, 2.0mm, STRAIGHT, SN
5-80MHz, 15dB, -, 0.03W
ML-165, KM23C8105DG, SOP, 44P, 600
ml-165, KM23C8105DG, SOP, 44P, 600
ML-165, HYPER CHIP, PQFP, 100P, 14
ML-6050, FR-4, 4, 1.6, 192.5*145
Spec
Samsung Electronics