Sony TAV-L1 Service Manual page 58

TAV-L1
• Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
f : internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
• DMB13 and B boards are multi-layer printed board.
However, the patterns of intermediate layers have not been
included in diagrams.
• Indication of transistor
C
Q These are omitted.
B E
* Replacement of IC5500 on the B board used in this set
requires a special tool.
• Lead Layouts
surface
Lead layout of conventional IC CSP (chip size package)
TAV-L1
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
•
: internal component.
f
• 2 : nonflammable resistor.
• C : panel designation.
Note: Note:
The components identi- Les composants identifiés par
fied by mark 0 or dotted une marque 0 sont critiques
line with mark 0 are criti-
pour la sécurité.
cal for safety. Ne les remplacer que par une
Replace only with part pièce por tant le numéro
number specified. spécifié.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : DVD PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : AUDIO (ANALOG)
J : AUDIO (DIGITAL)
E : VIDEO
* Replacement of IC5500 on the B board used in this set
requires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
• Circuit Boards Location
MS-214 board
DMB13 board
VIDEO-UC board
EMR DOWN 4 board
H2-AU board
TUNER (FM)
(TM10SU)
58 58
EMR UP board
PANEL-UC board
EMR UP2 board
TOUCH SENSOR board
EMR DOWN 3 board
FG board
SENSOR (OUT2) board
SENSOR (OUT1) board
SENSOR DOWN board
SENSOR (IN1) board
SENSOR (IN2) board
G2 SOEM board
A3-AU board
LINK UC board
B board
P board
OPT IN board
POWER board
SUB board
CONNECT-UC board
KEY board
MAIN board
EMR DOWN 1
board
EMR DOWN 2
board