Page 1
HPE ProLiant ML110 Gen9 Server Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and software. This guide is for an experienced service technician. Hewlett Packard Enterprise assumes that you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
Customer self repair Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard Enterprise will ship that part directly to you for replacement.
Page 6
• Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à Hewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
Page 7
NOTA: alcuni componenti Hewlett Packard Enterprise non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, Hewlett Packard Enterprise richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.
Page 8
Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien von Hewlett Packard Enterprise, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an Hewlett Packard Enterprise zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an Hewlett Packard Enterprise zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen.
Page 9
deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso requerido, Hewlett Packard Enterprise podrá cobrarle por el de sustitución.
Page 10
Enterprise u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt Hewlett Packard Enterprise alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest Hewlett Packard Enterprise zelf welke koerier/transportonderneming hiervoor wordt gebruikt. Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van Hewlett Packard Enterprise.
Page 11
Para obter mais informações sobre o programa de reparo feito pelo cliente da Hewlett Packard Enterprise, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da Hewlett Packard Enterprise (http://www.hpe.com/support/selfrepair). Serviço de garantia apenas para peças A garantia limitada da Hewlett Packard Enterprise pode incluir um serviço de garantia apenas para peças.
Illustrated parts catalog Mechanical components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer). Item Description Spare part number Customer self repair (on page 5) Redundant power supply blank 698883-001 Mandatory...
Page 16
Facultatif—Pièces pour lesquelles une réparation par le client est facultative. Ces pièces sont également conçues pour que le client puisse procéder lui-même aux réparations. Cependant, les frais supplémentaires engendrés par le remplacement de ces pièces par Hewlett Packard Enterprise dépendent du type de service de garantie désigné pour votre produit.
System components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer). Illustrated parts catalog 17...
Page 18
Item Description Spare part Customer self number repair (on page M.2 SSD single module enablement kit 797907-001 Optional a) M.2 SSD enablement board — — b) M.2 SSD module — — c) SATA cable* — — M.2 SSD dual module enablement kit 797908-001 Optional a) M.2 SSD enablement board...
Page 19
c) 16 GB, single-rank x4 PC4-2400T-R* 819411-001 Mandatory d) 16 GB, dual-rank x4 PC4-2400T-R* 846740-001 Mandatory e) 32 GB, dual-rank x4 PC4-2400T-R* 819412-001 Mandatory System battery 234556-001 Mandatory Processors (include alcohol pad and thermal — — compound)** Intel Xeon E5-2600 v3 processors a) 1.60-GHz Intel Xeon E5-2603 v3, 6C, 85 W 762441-001 Optional...
Page 20
b) 12G, 540 mm, Mini-SAS cable* — — c) 540 mm Mini-SAS Y cable* — — d) 300 mm SATA to Mini-SAS cable* — — Trusted Platform Module — a) TPM 1.2* 505836-001 b) TPM 2.0* 812119-001 *Not shown **All processors in this HPE ProLiant server must have the same cache size, speed, number of cores, and rated maximum power consumption.
Page 21
No—Algunos componentes de Hewlett Packard Enterprise no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, Hewlett Packard Enterprise pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No"...
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10/T-15 Torx screwdriver (included with the server) • HPE Insight Diagnostics software ("HPE Insight Diagnostics" on page 72) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching. This symbol indicates that the component exceeds the recommended weight for one individual to handle safely.
• Remove the PCI air baffle (on page 25). • Remove the system air baffle (on page 26). Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs. IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the system.
Slide and remove the access panel from the server. Remove the front bezel Power down the server (on page 24). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Place the server on its side. Remove the access panel (on page 24).
Disconnect each power cord from the power source. Disconnect each power cord from the server. Place the server on its side. Remove the access panel (on page 24). Remove the PCI air baffle. Remove the system air baffle Power down the server (on page 24). Remove all power: Disconnect each power cord from the power source.
Remove the system air baffle. Non-hot-plug drive cage CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Back up all server data on the drive. Power down the server (on page 24).
Remove the non-hot-plug drive cage. To replace the component, reverse the removal procedure. Non-hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Back up all server data on the drive.
Remove the non-hot-plug drive. To replace the component, reverse the removal procedure. Hot-plug drive blanks CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Remove the front bezel (on page 25).
Hot-plug SFF drive blank To replace the SFF drive blank, while pressing the release latch, slide the component into the bay until it is fully seated. Hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
Page 31
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. To remove the component: Power down the server (on page 24). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.
Box 2 To replace the component, reverse the removal procedure. 8-bay SFF hot-plug drive cage WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. To remove the component: Power down the server (on page 24).
Box 1 Box 2 To replace the component, reverse the removal procedure. M.2 SSD enablement kit M.2 SSD enablement option WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation.
Page 34
To remove the component: Power down the server (on page 24). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Place the server on its side. Remove the access panel (on page 24). If installed, remove the PCI air baffle (on page 25).
M.2 SSD module WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation.
Page 36
Disconnect the power and SATA cable. Release cables from clip and metal tabs. Press the metal tab. Removal and replacement procedures 36...
Remove the optical drive and disconnect the cable from the rear of the drive. To replace the component, reverse the removal procedure. Fans System fan module (92 x 32 mm) To remove the component: Power down the server (on page 24). Remove all power: Disconnect each power cord from the power source.
Remove the 92 × 32 mm system fan module. To replace the component, reverse the removal procedure. Upgrade fan module (92 x 38 mm) To remove the component: Power down the server (on page 24). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.
Remove the 92 × 38 mm system fan module. To replace the component, reverse the removal procedure. PCI fan module CAUTION: For proper cooling do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. To remove the component: Power down the server (on page 24).
Disconnect the fan power cable and remove the PCI fan. To replace the component, reverse the removal procedure. GPU supporting holder To remove the component: Power down the server (on page 24). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.
Remove the GPU with the supporting holder from slot 1: Open the PCIe slot cover retainer. Loosen the captive screw of the supporting holder. Open the latch on the slot 1 and remove the GPU. Remove the supporting holder. To replace the component, reverse the removal procedure. FBWC module WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Page 42
CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: Power down the server (on page 24). Remove all power: Disconnect each power cord from the power source.
Remove the cache module. To replace the component, reverse the removal procedure. Smart Storage Battery WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
Disconnect the battery cable from the system board connector and remove the Smart Storage Battery. To replace the component, reverse the removal procedure. DIMMs Memory-processor compatibility information • Intel Xeon E5-2600 v3 processors supports: Single-rank and dual-rank PC4-2133 (DDR4-2133) RDIMMs operating at up to 2133 MT/s Dual-rank PC4-2133 (DDR4-2133) LRDIMMs operating at up to 2133 MT/s •...
Remove the access panel (on page 24). If installed, remove the PCI air baffle (on page 25). Remove the system air baffle (on page 26). Open the DIMM slot latches. Remove the DIMM. To replace the component, reverse the removal procedure. Heatsink To remove the component: Power down the server (on page 24).
Page 46
Remove the heatsink from the processor backplate. To replace the component: Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. Remove the thermal interface protective cover from the heatsink. Install the heatsink: Position the heatsink on the processor backplate.
Finish the installation by completely tightening the screws in the same sequence. Install the system air baffle. If removed, install the PCI air baffle. Install the access panel. Return the server to an upright position. Connect each power cord to the server. Connect each power cord to the power source.
Page 48
Place the server on its side. Remove the access panel (on page 24). If installed, remove the PCI air baffle (on page 25). Remove the system air baffle (on page 26). Remove the heatsink: Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. Completely loosen all screws in the same sequence.
Page 49
Remove the processor from the processor retaining bracket. To replace the component: Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
Page 50
Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket. Press and hold the processor retaining bracket in place, and then close each processor locking lever.
Finish the installation by completely tightening the screws in the same sequence. Install the system air baffle. If removed, install the PCI air baffle. Install the access panel. Return the server to an upright position. Connect each power cord to the server. Connect each power cord to the power source.
Page 52
Remove the heatsink from the processor backplate. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts.
Page 53
Remove the processor from the processor retaining bracket. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removing the processor from the socket. • Do not tilt or slide the processor when lowering the processor into the socket. CAUTION: Removal of the processor or heatsink renders the thermal layer between the processor and heatsink useless.
Page 54
To replace the system board: Install the system board. Open each of the processor locking levers in the order indicated in the following illustration, and then open the processor retaining bracket. Removal and replacement procedures 54...
Page 55
Remove the clear processor socket cover. Retain the processor socket cover for future use. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts.
Page 56
Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing.
Page 57
Finish the installation by completely tightening the screws in the same sequence. IMPORTANT: Install all components with the same configuration that was used on the failed system board. Install all components removed from the failed system board. Connect all cables disconnected from the failed system board. Install the system air baffle.
System battery If the server no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack.
Dedicated iLO port management module To remove the component: Power down the server (on page 24). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Place the server on its side. Remove the access panel (on page 24).
The iLO 4 Configuration Utility screen appears. Select Network Options, and then press Enter. The Network Options screen appears. Set the Network Interface Adapter field to ON, and then press Enter. Press F10 to save your changes. A message prompt to confirm the iLO settings reset appears. Press Enter to reboot the iLO settings.
Remove the non-hot-plug power supply. To replace the component, reverse the removal procedure. HPE ATX 550-W Power Supply (non-hot-plug) WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
Remove the non-hot-plug power supply. To replace the component, reverse the removal procedure. RPS enablement kit WARNING: To reduce the risk of electric shock or damage to the equipment: • Do not disable the power cord grounding plug. The grounding plug is an important safety feature.
Page 63
Release the power cord from the strain relief clip. Remove the strain relief clip from RPS and retain the clip for future clip. Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Place the server on a sturdy, level surface.
Remove the RPS backplane. Remove the RPS bracket from the bay. To replace the component, reverse the removal procedure. HPE redundant power supply input module WARNING: To reduce the risk of electric shock or damage to the equipment: • Do not disable the power cord grounding plug. The grounding plug is an important safety feature.
Page 65
WARNING: To reduce the risk of injury from electric shock hazards, do not open power supplies. Refer all maintenance, upgrades, and servicing to qualified personnel. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Place the server on a sturdy, level surface. Remove the access panel (on page 24). If installed, remove the PCI air baffle (on page 25). Remove the system air baffle (on page 26).
Remove the power supply blank. To replace the component, reverse the removal procedure. HP Trusted Platform Module The TPM is not a customer-removable part. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.
Troubleshooting Troubleshooting resources The HPE ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: •...
Diagnostic tools Product QuickSpecs For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs). HPE iLO iLO is a remote server management processor embedded on the system boards of HPE ProLiant and Synergy servers.
The Active Health System, in conjunction with the system monitoring provided by Agentless Management or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status, and service alerts for various server components. The Agentless Management Service is available in the SPP, which can be downloaded from the Hewlett Packard Enterprise website (http://www.hpe.com/servers/spp/download).
• Selecting the primary boot controller • Configuring memory options • Selecting a language • Launching other pre-boot environments such as the Embedded UEFI Shell and Intelligent Provisioning For more information on the UEFI System Utilities, see the HPE UEFI System Utilities User Guide for HPE ProLiant Gen9 Servers on the Hewlett Packard Enterprise website (http://www.hpe.com/info/uefi/docs).
Press the Enter key to clear the warning. Enter the serial number and press the Enter key. Select Product ID. The following warning appears: Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis.
USB support Hewlett Packard Enterprise servers support both USB 2.0 ports and USB 3.0 ports. Both types of ports support installing all types of USB devices (USB 1.0, USB 2.0, and USB 3.0), but may run at lower speeds in specific situations: •...
• Supports online array capacity expansion, logical drive extension, assignment of online spares, and RAID or stripe size migration • Provides diagnostic and SmartSSD Wear Gauge functionality on the Diagnostics tab • For supported controllers, provides access to additional features. For more information about HPE SSA, see the Hewlett Packard Enterprise website (http://www.hpe.com/servers/ssa).
Front panel LEDs and buttons Item Description Status Power On/Standby button Solid green = System on and system power LED Flashing green (1 flash per second) = Performing power on sequence Solid amber = System in standby Off = No power present If the system power LED is off, verify the following conditions: •...
Item Description USB 3.0 connectors Video connector Rear panel LEDs Item Description Status Power supply LED Solid green = Normal Off = One or more of the following conditions exists: • Power is unavailable • Power supply failed • Power supply is in standby mode •...
System board components Item Description Fan connector 3 Fan connector 2 DIMM slots 24-pin power supply connector RPSU connector Processor 4-pin power supply connector Front I/O connector Fan connector 1 Mini-SAS connector 1 Front USB 3.0 connector SATA connector 2 (for M.2 SSD 2) Mini-SAS connector 2 SATA connector 1 (for M.2 SSD 1 or optical drive) Internal USB 3.0 connector...
Select System Configuration → BIOS/Platform Configuration (RBSU) → System Options → SATA Controller Options → Embedded SATA Configuration, and then press Enter. Select Enable SATA AHCI Support, and then press Enter. Press F10 to save the selection. Press Y to save the changes. The Change saved confirmation prompt appears.
Fan locations Item Description Default system fan (92 x 32 mm) Upgrade system fan (92 x 38 mm) The option is required to replace the default system fan when a 140 W workstation processor or SAS SSD drives are installed. PCI fan The PCI fan is part of the PCI fan and baffle option.
Page 83
• Four-bay LFF non-hot-plug drive model • Four-bay LFF hot-plug drive model Component identification 83...
• Eight-bay SFF hot-plug drive model Hot-plug drive LED definitions Item Status Definition Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Activity ring Rotating green Drive activity No drive activity...
Page 85
Item Status Definition The drive is not configured by a RAID controller. The blue Locate LED is behind the release lever and is visible when illuminated. IMPORTANT: The Dynamic Smart Array B140i Controller is only available in UEFI Boot Mode. It cannot be enabled in Legacy BIOS Boot Mode. If the B140i controller is disabled, drives connected to the system board Mini-SAS connectors operate in AHCI or Legacy mode.
Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the Hewlett Packard Enterprise website (http://www.hpe.com/info/servers). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
4-bay LFF hot-plug drive cabling • Box 1 drive backplane connected to the system board Item Description Drive power cable Mini-SAS cable • Box 2 drive backplane connected the system board Item Description Drive power cable Mini-SAS cable Cabling 87...
Page 88
• Box 1 and box 2 drive backplanes connected to an H240 adapter Item Description Box 2 drive power cable Box 1 drive power cable Mini-SAS cable to port 2 of the controller Mini-SAS cable to port 1of the controller •...
• Box 1 and box 2 drive backplane connected to a P840 controller Item Description Box 2 drive power cable Box 1 drive power cable Mini-SAS Y-cable to port 1 of the controller 8-bay SFF hot-plug drive cabling • Box 1 drive backplane connected to the system board Item Description Drive power cable...
Page 90
• Box 1 drive backplane connected to an H240 adapter Item Description Drive power cable Mini-SAS port 1 connection to port 1 controller Mini-SAS port 2 connection to port 2 controller • Box 2 drive backplane connected to an H240 adapter Item Description Drive power cable...
Page 91
• Box 1 drive backplane connected to a P440 controller Item Description Drive power cable Mini-SAS Y-cable to controller • Box 2 drive backplane connected to a P440 controller Item Description Drive power cable Mini-SAS Y-cable to controller Cabling 91...
Page 92
• Box 1 drive backplane connected to a P840 controller Item Description Drive power cable Mini-SAS Y-cable connection to port 1 controller • Box 2 drive backplane connected to a P840 controller Item Description Drive power cable Mini-SAS Y-cable connection to port 2 controller Cabling 92...
M.2 SSD cabling Item Description M.2 SSD 2 SATA cable M.2 SSD 1 SATA cable FBWC module cabling The FBWC solution is a separately purchased option. This server only supports FBWC module installation when a Smart Array P-Series controller is installed. Depending on the controller option installed, the actual storage controller connectors might look different from what is shown in this section.
• PCI fan Power supply cabling HPE ATX 350 W power supply (non-hot-plug) Item Description 8-pin power supply cable to box 2 drive backplane and optical drive 8-pin power supply cable to box 1 drive backplane 4-pin power cable to system board 24-pin power supply cable Cabling 97...
HPE ATX 550 W power supply (non-hot-plug) Item Description 8-pin power supply cable to box 2 drive backplane and optical drive 6-pin power cable to GPU 8-pin power supply cable to box 1 drive backplane 4-pin power cable to system board 24-pin power cable to system board HPE 750 W redundant power supply Item...
Item Description 6-pin power cable to GPU 4-pin power cable to system board RPS cable to system board 24-pin power cable to system board Front I/O cabling Front USB 3.0 cabling Cabling 99...
Specifications Environmental specifications Specification Value — Temperature range* 10°C to 35°C (50°F to 95°F) Operating -30°C to 60°C (-22°F to 140°F) Nonoperating — Relative humidity (noncondensing) Minimum to be the higher (more moisture) of Operating -12°C (10.4°F) dew point or 8% relative humidity Maximum to be 24°C (75.2°F) dew point or 90% relative humidity...
Power supply specifications Depending on the installed options and/or the regional location where the server was purchased, the server is configured with one of the following power supplies: • ATX 350 W Power Supply (non-hot-plug) (776442-B21) • ATX 550 W Power Supply (non-hot-plug) (776444-B21) •...
Acronyms and abbreviations Advanced Memory Protection application program interface ASHRAE American Society of Heating, Refrigerating and Air-Conditioning Engineers backplane Customer Self Repair file allocation table FBWC flash-backed write cache graphics processing unit host bus adapter HPE SIM HPE Systems Insight Manager Integrated Lights-Out Integrated Management Log large form factor...
Page 103
Lights-Out Management nonmaskable interrupt NVRAM nonvolatile memory Optical Disk Drive PCIe Peripheral Component Interconnect Express POST Power-On Self Test RBSU ROM-Based Setup Utility REST representational state transfer redundant power supply serial attached SCSI SATA serial ATA Secure Digital small form factor Systems Insight Manager Service Pack for ProLiant Acronyms and abbreviations 103...
Page 104
Trusted Platform Module UEFI Unified Extensible Firmware Interface unit identification universal serial bus Acronyms and abbreviations 104...
Documentation feedback Hewlett Packard Enterprise is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hpe.com). When submitting your feedback, include the document title, part number, edition, and publication date located on the front cover of the document. For online help content, include the product name, product version, help edition, and publication date located on the legal notices page.