HP Pavilion 14-al00 Series Maintenance And Service Manual page 57

4. Remove the heat sink (2).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board each time the heat sink is removed.
Thermal material is used on the processor (1) and the heat sink section (2) that services it. Thermal material
is also used on the graphics subsystem chip (3) and the heat sink section (4) that services it. The following
illustration shows the thermal material locations on a computer model equipped with a graphics subsystem
with discrete memory.
Thermal material is used on the processor (1) and the heat sink section (2) that services it. The following
illustration shows the thermal material locations on a computer model equipped with a graphics subsystem
with UMA memory.
Component replacement procedures 49