Samsung OfficeServ 12 Service Manual
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Samsung OfficeServ 12 Service Manual

Samsung OfficeServ 12 Service Manual

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GANA-000029
Ed.
001
OfficeServ 12
Service Manual

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Summary of Contents for Samsung OfficeServ 12

  • Page 1 GANA-000029 OfficeServ 12 Service Manual...
  • Page 2 This manual is proprietary to SAMSUNG Electronics Co., Ltd. and is protected by copyright. No information contained herein may be copied, translated, transcribed or duplicated for any commercial purposes or disclosed to third parties in any form without the prior written consent of SAMSUNG Electronics Co., Ltd.
  • Page 3 Address: Document Center 2nd Floor IT Center. Dong-Suwon P.O. Box 105, 416, Maetan-3dong Yeongtong-gu, Suwon-si, Gyeonggi-do, Korea 442-600 Homepage: http://www.samsungdocs.com ©2004 SAMSUNG Electronics Co., Ltd. All rights reserved.

  • Page 4: Introduction

    This chapter describes the exploded view and parts list of the OfficeServ 12 system. ANNEX A. PCB Component Layout This annex describes the solder side and component side layout of the OfficeServ 12 system. ABBRIVATION Describes the acronyms used in this manual.

  • Page 5: Conventions

    Indicates additional information as a reference. Reference OfficeServ 12 Intallation Guide This guide is an installer’s guide containing information on system specification, how to install and set up the OfficeServ 12 system and how to connect the additional equipment. Revision History EDITION DATE OF ISSUE REMARKS 10.

  • Page 6: Safety Concerns

    For product safety and correct operation, the following information must be given to the operator/user and shall be read before the installation and operation. Symbols Caution Indication of a general caution Restriction Indication for prohibiting an action for a product Instruction Indication for commanding a specifically required action © SAMSUNG Electronics Co., Ltd.

  • Page 7: Warning

    Do not directly connect the external paging equipment or a common bell to a commercial AC power supply. This is to prevent fire and immediate breakdown of the OfficeServ 12 system. Check whether the power is on before connecting a cable for battery connection.
  • Page 8 - Do not turn off the power during program upgrades. Follow the instructions below before disassembling the OfficeServ 12 system. - Unplug the AC power cable and turn off the OfficeServ 12 system power. - Remove the cables of external devices such as phone and external battery from the OfficeServ 12 system.

  • Page 9: Caution

    CAUTION Caution for using battery DC 48 V(6~40 AH) batteries should be used for OfficeServ 12. If the capacity of the battery is too great, system malfunction may occur. If the capacity is too small, the system may not operate properly during a power failure.

  • Page 10: Table Of Contents

    Cable Specifications ........................5 1.2.6 Dimensions ........................... 5 1.2.7 Others............................5 CHAPTER 2. Disassembly and Reassembly Boards and PSU........................... 1 2.1.1 When 3/4TRK is Equipped ......................1 2.1.2 When 2BRI is Equipped....................... 2 Disassembly Procedure......................3 © SAMSUNG Electronics Co., Ltd.
  • Page 11 4TRK Board (MPD Type, Without CID)..................19 5.2.5 4TRK Board (PRS Type, Without CID) ..................24 5.2.6 2BRI Board ..........................28 5.2.7 MGI Board...........................31 ANNEX A. PCB Component Layout Base board ........................... 1 A.1.1 Component Side........................... 1 A.1.2 Solder Side............................ 2 © SAMSUNG Electronics Co., Ltd. VIII...
  • Page 12 A.3.2 Solder Side............................ 6 MGI Board............................. 7 A.4.1 Component Side........................... 7 A.4.2 Solder Side............................ 7 ABBREVIATION A ~ D ............................... I F ~ M ..............................II N ~ S ..............................III T ~ W ..............................IV © SAMSUNG Electronics Co., Ltd.
  • Page 13 LIST OF FIGURES Figure 1.1 Front View of the OfficeServ 12.................... 1 Figure 1.2 Ports and Switch of the OfficeServ 12 ................. 2 Figure 1.3 Bottom View of the OfficeServ 12 ..................3 Figure 2.1 OfficeServ 12 Board Configuration (When 3/4TRK is Equipped)........1 Figure 2.2 OfficeServ 12 Board Configuration (When 2BRI is Equipped)...........

  • Page 14: Chapter 1. System Specifications

    This chapter introduces the hardware and specifications of the OfficeServ 12 system. Compliance with local standards OfficeServ 12 is designed to comply with the standard of the corresponding country. 1.1 Hardware Descriptions This section introduces each view and part descriptions of the OfficeServ 12 system.

  • Page 15: Ports And Switch (After Removing Side Cover)

    This switch is for using the battery and supplying the power to the switch OfficeServ 12 system when power is interrupted to keep data for a predetermined time. The switch must be turned ‘ON’ after the data is input. DLI1 port...

  • Page 16: Bottom View

    1.1.3 Bottom View Groove for ground connection cable LAN port Power switch Groove for wall mounting Power connector Figure 1.3 Bottom View of the OfficeServ 12 Table 1.3 Bottom View Descriptions Item Description Groove for ground connection cable A groove for grounding.

  • Page 17: Specifications

    External Page AP(for WLAN) WIP-5000M phone The OfficeServ 12 system provides 8 station lines(1 DLI port, 2 HYB ports, and 5 SLI ports). DLI port supports 2B(KDB-D, KDB-S) and hybrid port supports analog phone and digital phone(DLI max configuration: 3 ports, SLI max configuration: 7 ports).

  • Page 18: Power Specifications

    Table 1.9 Dimensions Item Height(mm) Width(mm) Depth(mm) Mass(kg) OfficeServ 12 DPIM 1.2.7 Others Table 1.10 Other Specifications Item Specification External music source input Impedance: 600 ohm characteristics Voltage: Maximum 350 mV External Page Impedance: 600 ohm © SAMSUNG Electronics Co., Ltd.
  • Page 19 This page is intentionally left blank. © SAMSUNG Electronics Co., Ltd.

  • Page 20: Chapter 2. Disassembly And Reassembly

    Disassembly and Reassembly This chapter introduces how to disassemble the OfficeServ 12 system. You can reassemble the OfficeServ 12 system by following the steps in reverse order. 2.1 Boards and PSU OfficeServ 12 is composed of the base board, 3/4TRK board, 2BRI board, MGI(Media Gateway Interface) board, and PSU(Power Supply Unit).

  • Page 21: When 2Bri Is Equipped

    2.1.2 When 2BRI is Equipped The following figure shows the board configuration of OfficeServ 12 when the 2BRI digital trunk daughter board is equipped on the base board: Figure 2.2 OfficeServ 12 Board Configuration (When 2BRI is Equipped) © SAMSUNG Electronics Co., Ltd.

  • Page 22: Disassembly Procedure

    Disassemble the OfficeServ 12 system as following procedure. Follow the instructions below before disassembling the OfficeServ 12 system. - Unplug the AC power plug from the wall outlet and turn the OfficeServ 12 system power switch off. - Remove the cables of external devices such as phone and external battery from the OfficeServ 12 system.
  • Page 23 2) Remove the two screws at the side of the system. 3) Remove the two screws at the bottom panel of the system. © SAMSUNG Electronics Co., Ltd.
  • Page 24 4) Remove the top cover. 5) Remove the two screws marked below in order to separate the 3/4TRK board or 2BRI board: © SAMSUNG Electronics Co., Ltd.
  • Page 25 6) Remove the 3/4TRK board or 2BRI board from the base board. Follow the instructions below before disassembling the OfficeServ 12 system. Wear wrist straps and ground the straps before handling boards or parts of the OfficeServ 12 system. 7) Remove the MGI board attached to the connectors on both ends of the base board.
  • Page 26 8) Remove the screw marked below to separate the base board from the system chassis: Remove the cable from the PSU(Power Supply Unit). 9) Remove the 4 screws marked below to separate the PSU. © SAMSUNG Electronics Co., Ltd.
  • Page 27 10) The system chassis should be emptied as shown below when all boards and PSU are removed: © SAMSUNG Electronics Co., Ltd.
  • Page 28 OfficeServ 12 Troubleshooting This chapter describes problems that may occur while using the OfficeServ 12 system and solutions for solving those problems. © SAMSUNG Electronics Co., Ltd.

  • Page 29: Chapter 3. Troubleshooting

    3.1 Power Failures Failure The OfficeServ 12 system is not powered properly. Troubleshooting 1) Check the Power supply as follows: Turn on Power. Pull out the Power cable Is LED1(base board) connected to base board. Measured the DC Voltage between GND and -55 V of CN21 within the power board.
  • Page 30 Analyze system battery. Check the voltage of battery. Is the value above 50 V? Usable without any restrictions. The system will not work if battery is Is the value under Connected without AC power. 45 V? © SAMSUNG Electronics Co., Ltd.

  • Page 31: Base Board Failures

    3.2 Base board Failures Failure The base board of the OfficeServ 12 system does not operate properly. Troubleshooting Checking the base board boot as follows: Turn on the Power switch. Check if LED1 on base Check if Boot ROM(V121) is board is blinking fast.

  • Page 32: Sli Failures

    Replace the Trace -55 V from P992 and repair Is higher than -50 V? SLIC.(Subscriber Line the fault. Interface Circuit) - Check the relay(e.g., K501), fitter (e.g., M501), Wattage resister. (R504, R505) - Repair the fault. © SAMSUNG Electronics Co., Ltd.

  • Page 33: Troubleshooting

    QSLAC.(LE58Q021 VC) Replace the base board. Is the time slot signal inputted? Are signals inputted Check the HWR signals. from the HWR? Replace the QSLAC.(Quad low voltage Subscriber Line Audio- processing Circuit)(LE58Q021 VC) © SAMSUNG Electronics Co., Ltd.
  • Page 34 Follow the troubleshooting procedure of the ‘When No Tone is sent to the SLI port.’ failure. This failure does not occur when the ‘When No Tone is sent to the SLI port’ problem is solved. Failure 4 When the ring does not go off. Troubleshooting 4 © SAMSUNG Electronics Co., Ltd.
  • Page 35 D861 - Replace PWM(Pulse Width Is 80 VDC Is Ring singal outputted? Modulation) IC(U853) outputted at both ends of - Replace Q851 C877? Replace the Relay of the Replace Q852~Q855 corresponding port © SAMSUNG Electronics Co., Ltd.

  • Page 36: Dli Failures

    Check the voltage of the tip and ring Are they higher than -40 V? Replace the keyset Check the polyswitch of the corresponding port Replace the Transformer(DCT-1) of the Is polyswitch normal? corresponding port Replace the polyswitch © SAMSUNG Electronics Co., Ltd.
  • Page 37 When DLI port does not work. Troubleshooting 2 Check if the keyset display ‘VER.xxx’ - Check 4M(pin9), FSX(pin11), CLKX(pin10) of the QDASL(U381). - Check OCCLK(pin19), CI(pin21), CO(pin20) Are signals normal? Replace the engine(STC9604) Replace U381 © SAMSUNG Electronics Co., Ltd.

  • Page 38: Misc Failures

    Replace the U424 the QSLAC(U452)? Check if the 8 SLI port Replace the QSLAC(U452) is normal Check if signals(2M, FSX, DCLK, HVO) of the QSLAC(U452). Replace the engine Are signals normal? Replace the Base board © SAMSUNG Electronics Co., Ltd.
  • Page 39 ‘EXT’ position Change the shunt pin to ‘EXT’ position Is the shunt pin normal? Check if MOH source is connected to pin 3, 4 of the P973 Is connection normal? Reconnect normally Replace base board © SAMSUNG Electronics Co., Ltd.
  • Page 40 Operate the transistor(Q401) and check the status Replace the transistor(Q401), Is the transistor normally input resistor(R402), and diode(D401) functioning? - Check if +5V is supplied to the relay Does relay sound? (pin1) - Replace the Relay © SAMSUNG Electronics Co., Ltd.

  • Page 41: Caller Id Failures

    Repair MMC Check if the signals of the U151 are normal.(8 M pin32, INT_8MS: pin64, HAS: pin13, MRW: pin129, MRD: pin127, CS_DSP: 17) Check CPLD Are signals normal? (Complex Programmable Logic Device)(U51) version Replace LV51 © SAMSUNG Electronics Co., Ltd.

  • Page 42: Lan Failures

    - Check 25 MHz output signal pin78 of the U931 Replace crystal(Y931) Is the clock normal? Check the patterns from U931 to RJ-45(P901) Repair abnormal signals Are the patterns normal? - Replace U931 - Replace the base board © SAMSUNG Electronics Co., Ltd.

  • Page 43: 3/4Trunk Failures

    Request to repair the trunk line Check the Relay control signal normally operating? Is the Relay control Replace TMC (Trunk Module Controller)(U51) signal normal? Replace the Relay - Replace the TMC - Replace 3/4TRK board © SAMSUNG Electronics Co., Ltd.
  • Page 44 TIP and RING are higher than 40 Vrms Is the ring supplying voltage higher Request to repair the trunk line than 40 Vrms? - Check the ring path Is HOS(Hook Off Sensing) output? - Consisting of two Zener diodes Replace TMC(U51) © SAMSUNG Electronics Co., Ltd.
  • Page 45 Pin 14 Pin 5/12(FS), Pin 6(HWR) and (Rx)? Pin 11(HWX) of the CODEC - Check the point where the signal occurs or disappears between Pin 3/14 of the CODEC and the connector - Repair the point © SAMSUNG Electronics Co., Ltd.

  • Page 46: 2Bri Failures

    When the 2BRI is not recognized. Troubleshooting 1 Check the data bus of the board and the board enabling signals Are the signals normal? Repair the faulty port Check CPLD(U1) version Reprogram CPLD Is CPLD version normal? Replace 2BRI board © SAMSUNG Electronics Co., Ltd.
  • Page 47 Check the address, Data bus signals Is the bus normal? Repair the address, data bus Abbreviation - ISAC: ISDN Subscriber Access Controller - DU: Data Upstream - DD: Data Downstream - FSC: Frame Synchronize - OSC: Oscillator © SAMSUNG Electronics Co., Ltd.

  • Page 48: Mgi Failures

    3.10 MGI Failures Failure When No MGI call is connected. Troubleshooting Check if the MGI board is installed Is the MGI board installed? Install MGI board Check if the MMC SET normal. © SAMSUNG Electronics Co., Ltd.

  • Page 49: Chapter 4. H/W Block Diagrams And Schematic Description

    H/W Block Diagrams and Schematic Description This chapter describes the H/W block diagrams and schematic description of the OfficeServ 12 system. 4.1 H/W Block Diagram OfficeServ 12 Hardware block diagram is as follows: Base board Power Supply Unit +5 V (Input: AC 220 V)

  • Page 50: Schematic Description

    4.2 Schematic Description This section provides schematic description on each part of the OfficeServ 12 system. 4.2.1 Power Supply Unit The PSU(Power Supply Unit) consists of the three main blocks described below: • Circuit supplying -55 VDC(Volts Direct Current), the system’s main power •...
  • Page 51 Caution on using battery DC 48 V(6~40 AH) batteries should be used for OfficeServ 12. If the capacity of the battery is too great, system malfunction may occur. If the capacity is too small, the system may not operate properly during power failures.

  • Page 52: Base Board

    4.2.2 Base board Circuits of the OfficeServ 12 base board are configured as shown below: Bridge SRAM Backup SLIC#1 SLI1 RESET SRAM SLIC#2 SLI2 CPLD QSLAC1 MPC 855T SLIC#3 SLI3 (M4A3-192/96) SLIC#4 SLI4 Flash ROM RS232C (NAND) SLIC#5 SLI5 Boot ROM...
  • Page 53 Four 16 bit timers or two 32 bit timers • SIU(System Integration Unit) • Seven external IRQ(Interrupt request lines) • Four baud-rate generators • One SCC(Serial Communication Controller) • Two SMCs(Serial Management Channels) • Low power support © SAMSUNG Electronics Co., Ltd.

  • Page 54: Figure 4.4 /Ta (/Dtack) Signal Control

    Those components require additional time for processing commands. The OfficeServ 12 system uses the /TA port of MPC 855T to make the CPU wait for the additional time needed. This port usually maintains low status, which allows the CPU to operate without any interruptions.
  • Page 55 The T-switch is the core of a digital PABX and is the most important part of the engine. Each switch controls gain through 8 steps. Since OfficeServ 12 is a small system, only four out of the eight highways are used.

  • Page 56: Figure 4.5 Engine (Stc9604) Interface

    Each highway operates independently and contains 32 voice channels. Digital Conference The engine was designed to support 5-way 6-group conference, but OfficeServ 12 currently supports only 5-way 5-group conference. © SAMSUNG Electronics Co., Ltd.

  • Page 57: Figure 4.6 Highway Allocation Block Diagram

    DTMF decoder often receives and processes DTMF signals from trunk lines. Each engine has four decoders, which means that the system can process 4 channels at the same time. Decoded results are stored in corresponding registers of the engine, and can be read by the CPU. © SAMSUNG Electronics Co., Ltd.

  • Page 58: Figure 4.7 Reset Circuit Block Diagram

    QDASL(Quad Digital Adapter for Subscriber Loops) can control four digital key phones. TMC, DPLL, SIO OfficeServ 12 does not use the TMC(Trunk Module Controller), DPLL(Digital Phase Locked Loop), and SIO(Serial Input/Output) functions of the engine. 4.2.2.3 Reset Composed of various circuits, the system may malfunction due to internal or external reasons.
  • Page 59 WDRESET can either be disabled/enabled by external resistance, or an NMI Interrupt Request can be sent. 4.2.2.4 Memory The OfficeServ 12 system contains memories such as SRAM, SDRAM, NAND flash memory, and boot ROM. SRAM This SRAM(Static Random Access Memory) working memory must be backed up by battery.
  • Page 60 Boot ROM moves DB data required for system operation from the Flash ROM to enable setting related parameters. • Wait Control is determined considering that the Access Time is 120ns, using the internal DTACK method. • A common data bus is shared with the CPU. © SAMSUNG Electronics Co., Ltd.
  • Page 61 A 8-Bit HPI bus is used for interfacing with the host. [Bus Interface] MPC855T TMS32LC549 D24~31 HD00~07 /DTACK HRDY /HRD CPLD /HWR /WEO HR/W HB_IL LA31 MR/W LA30 HCNTLO LA29 HCNTL1 LA28 /CS4 /HCS LA08 CPLD LA09 LA09 /HCS © SAMSUNG Electronics Co., Ltd.
  • Page 62 The data memory and clock circuit share a same backup battery. 4.2.2.8 Digital Phone Connection Interface (1DLI, 2HYB) The base board of OfficeServ 12 provides a single DLI circuit and two HYB(hybrid) circuits, supporting total three lines for connecting digital phones.

  • Page 63: Figure 4.8 Dli Port Wiring Diagram

    Figure 4.8 DLI Port Wiring Diagram 4.2.2.9 Single Line Phone Connection Interface (5SLI, 2HYB) The base board of the OfficeServ 12 system has five SLI circuits and two HYB(hybrid) circuits, supporting up to seven analog phones. Main devices of SLI are configured using QSLAC(Quad Subscriber Line Audio-processing Circuit) and SLIC(Subscriber Line Interface Circuit).

  • Page 64: Figure 4.9 Hybrid Port Wiring Diagram

    Device: ADMTEK ADM6992 • Quantity: 1 • Power: 3.3 V +2.5 V • Package: 128P PQFP • Supports two Ethernet ports MGI Board An MGI board must be equipped to support VoIP(Voice Over IP) on Ethernet. © SAMSUNG Electronics Co., Ltd.

  • Page 65: Figure 4.11 Music Source/Paging/Dry Contact Wiring Diagram

    4.2.2.11 Music Source/Paging/Dry Contact Connection Interface (MISC) The base board of OfficeServ 12 provides a single MISC port. The functions of MISC are as follows: • One Music Channel internal or external Internal MOH: Melody chip, which is the default music source...

  • Page 66: Figure 4.12 Battery Backup

    In any case, the minimum retention voltage required by devices is satisfied. 4.2.2.13 Trunk/MGI board Connection Connector The base board of OfficeServ 12 has a 50pin connector for mounting a trunk daughter board(3/4TRK, 2BRI), and two 40pin connectors for mounting a VoIP daughter board(MGI).

  • Page 67: 3/4Trk, 2Bri Board

    The PSU supplies -55 VDC and +5 VDC, and the constant-voltage supply circuit of the base board supplies -5 VDC. The OfficeServ 12 system receives +5 VDC and generates minus power by using the SMPS(Switching Mode Power Supply) technology. MC34063A is used as the main component.
  • Page 68 The hybrid component for detecting MPD or PRS is shared with the DCS(Digital Communication System) system component. Since each port has only one socket, one of the two elements must be selected. © SAMSUNG Electronics Co., Ltd.

  • Page 69: Figure 4.14 2Bri Block Diagram

    Conversion of the frame structure between the S/T interface and IOM(ISDN Oriented Modular) • Receive timing recovery according to selected operating mode • D-channel access • Activation and deactivation procedures, with automatic wake-up from power-down state © SAMSUNG Electronics Co., Ltd.

  • Page 70: Mgi Board

    4 MHz clock and /FOI foe used as a reference clock for implementing Multi-ISDN. 4.2.4 MGI Board A MGI daughter board can be equipped on the base board of OfficeServ 12. The MGI board converts voice to data, which is exchanged through a data network.

  • Page 71: Ring Generator

    The ring generator transmits ring signals of 80 Vrms and 20/25 Hz to regular phone lines. The ring waveform of a ring generator is a square wave. If required, a sine wave ringer module can be equipped. © SAMSUNG Electronics Co., Ltd.
  • Page 72 This page is intentionally left blank. © SAMSUNG Electronics Co., Ltd.

  • Page 73: Chapter 5. Exploded View And Parts List

    OfficeServ 12 Exploded View and Parts List This chapter describes the exploded view and parts list of the OfficeServ 12 system. 5.1 Exploded View The exploded view of the OfficeServ 12 system is as follows: Figure 5.1 Exploded View of OfficeServ 12...

  • Page 74: Parts List

    5.2 Parts List The parts list of the OfficeServ 12 system is as follows: 5.2.1 Base Board Part No. Location Quantity Part Name Specification 0401-000116 D851-D855 DIODE-SWITCHING MMSD914T1, 100 V, 200MA, SOD-123, TP 0401-001099 D121, D381 DIODE-SWITCHING 1N4148WS, 75 V, 150 mA,...
  • Page 75 IC-POSI.FIXED REG. 1585, DD, 3P, PLASTIC, 3.235/3.3 1203-001559 U122 IC-RESET DS1834A, SOIC, 8P, 150 MIL, PLASTIC 1203-002482 U934 IC-POSI.FIXED REG. SOT-223, 4P, 137MIL, PLASTIC, 2.5 1204-002075 U424 IC-MELODY M994T-05L, TO-92, 3P, 4.6 × 4.6MM, PLASTIC © SAMSUNG Electronics Co., Ltd.
  • Page 76 10 Kohm, 1 %, 1/10 W, TP, 1608 R26, R29 2007-000052 R101, R102, R-CHIP 10 Kohm, 1 %, 1/10 W, TP, 1608 R121-R125 2007-000052 R151-R164, R-CHIP 10 Kohm, 1 %, 1/10 W, TP, 1608 R166, R167 © SAMSUNG Electronics Co., Ltd.
  • Page 77 R-CHIP 3.6 Mohm, 5 %, 1/10 W, TP, 1608 2007-002443 R716, R717, R766, R767 R-CHIP 3.6 Mohm, 5 %, 1/10 W, TP, 1608 2007-002443 R816, R817 R-CHIP 3.6 Mohm, 5 %, 1/10 W, TP, 1608 © SAMSUNG Electronics Co., Ltd.
  • Page 78 R732, R782, R832 R-CHIP 6.49 Kohm, 1 %, 1/10 W, TP, 1608 2007-008122 R146-R148 R-CHIP 22.1 OHM, 1 %, 1/10 W, TP, 1608 2007-008141 R889, R890 R-CHIP 3 ohm, 1 %, 1/10 W, TP, 1608 © SAMSUNG Electronics Co., Ltd.
  • Page 79 4.7 NF, 10 %, 50 V, X7R, TP, 1608 CHIP 2203-000998 C141 C-CER, 0.047 NF, 5 %, 50 V, C0G, TP, 1608 CHIP 2203-000998 C316 C-CER, 0.047 NF, 5 %, 50 V, C0G, TP, 1608 CHIP © SAMSUNG Electronics Co., Ltd.
  • Page 80 100 NF, 10 %, 50 V, X7R, TP, 1608 CHIP 2203-005249 BC101-BC106, BC121- C-CER, 100 NF, 10 %, 50 V, X7R, TP, 1608 BC127 CHIP 2203-005249 BC151-BC156, BC251- C-CER, 100 NF, 10 %, 50 V, X7R, TP, 1608 BC255 CHIP © SAMSUNG Electronics Co., Ltd.
  • Page 81 1 NF, 10 %, 2 KV, X7R, TP, 4520 C930 CHIP 2203-005565 C854 C-CER, 1 NF, 5 %, 50 V, NP0, TP, 1608 CHIP 2203-005687 C521, C522, C571, C-CER, 2.2 NF, 10 %, 500 V, X7R, TP, 3216 C572 CHIP © SAMSUNG Electronics Co., Ltd.
  • Page 82 1300000UF, 5.5 V, BK, 21 × 7.5 MM, 5 2601-001056 T901, T916 TRANS-SMD, 350 UH, 1:1, 1:1, PULSE 12.7 × 6.73 × 5.97 MM, TP 2702-001112 L122, L301 INDUCTOR- 60 uH, 35 %, 7.5 × 8.0 mm RADIAL © SAMSUNG Electronics Co., Ltd.
  • Page 83 CONNECTOR- BOX, 50P, 2R, 2.54 MM, STRAIGHT, HEADER AUF, BLK 3722-000575 P973 JACK-MODULAR 6P/6C, INVERTED, N, ANGLE, N, AU30U 3722-001564 P971, P972 JACK-MODULAR 6P/4C 4, INVERTED, N, STRAIGHT 3722-002157 P901 JACK-MODULAR 8P/8C, STANDARD, N, ANGLE, © SAMSUNG Electronics Co., Ltd.

  • Page 84: 3Trk Board (Mpd Type, With Cid)

    TR, 100-600%, 200mW, SOP-4, TP U301 COUPLER 0801-000702 U52, U53 IC-CMOS LOGIC 74HC125, BUFFER, SOP, 14, 150 MIL, QUAD, T 1201-000005 U151, U251, IC-OP AMP MC3403, SOP, TP, 14P, 150 MIL, U351 QUAD, 200 V/MV © SAMSUNG Electronics Co., Ltd.
  • Page 85 R-CHIP 3 ohm, 5 %, 1/8 W, TP, 2012 2007-000868 R111, R211, R311 R-CHIP 4.7 Kohm, 1 %, 1/8 W, TP, 2012 2007-000868 R123, R223, R323 R-CHIP 4.7 Kohm, 1 %, 1/8 W, TP, 2012 © SAMSUNG Electronics Co., Ltd.
  • Page 86 100 uF, 20 %, 16 V, GP, TP, 6.6 × 6.6 × 5.4 mm 2703-000202 INDUCTOR- 33 uH, 10 %, 3225 3301-000344 B51, B52 BEAD-RADIAL 200 ohm, 3.5 × 0.6 × 6.5 mm, 7000 mA, TP © SAMSUNG Electronics Co., Ltd.
  • Page 87 300 V, 15 %, 500 A ABSORBER 4715-000127 V301, V302, V303 SURGE 300 V, 15 %, 500 A ABSORBER GA13-00004A IC ASIC-TMC STL7053E, IDCS500 PREMIUM, 60 GA26-00003A T101, T201, T301 TRANS AF-5692B 5692B, DCS-408, 2P:3P, 800 MH, 1.3 DB © SAMSUNG Electronics Co., Ltd.

  • Page 88: 3Trk Board (Prs Type, With Cid)

    27 ohm, 5 %, 1 W, AF, TP, 4.3 × 12 mm R304 2007-000029 JP301, JP302 R-CHIP 0 ohm, 5 %, 1/8 W, TP, 2012 2007-000029 R121, R221, R-CHIP 0 ohm, 5 %, 1/8 W, TP, 2012 R321 © SAMSUNG Electronics Co., Ltd.
  • Page 89 75 Kohm, 1 %, 1/8 W, TP, 2012 2007-007584 R162, R262, R362 R-CHIP 73.2 Kohm, 1 %, 1/8 W, TP, 2012 2203-000130 C154, C254, C354 C-CER, CHIP 1.2 NF, 5 %, 50 V, C0G, TP, 2012 © SAMSUNG Electronics Co., Ltd.
  • Page 90 3501-001035 K202 RELAY- 5VDC, 140 MW, 2000 MA, 2FORMC, MINIATURE 4 MS, 4 MS 3703-000176 CONNECTOR 50 P, 2R, FEMALE, STRAIGHT, AUF -BACK PANEL 3704-001001 P101, P201, P301 SOCKET-IC 8 P, SIP, SN, 2.54 mm © SAMSUNG Electronics Co., Ltd.

  • Page 91: 4Trk Board (Mpd Type, Without Cid)

    MMBT5550, NPN, 300 MW, SOT-23, TP, Q402 SIGNAL 20-250 0501-000477 Q104, Q204, Q304, TR-SMALL MMBT5550, NPN, 300 MW, SOT-23, TP, Q404 SIGNAL 20-250 0502-000465 Q103, Q203, Q303, TR-POWER KTD2058, NPN, 25000 mW, TO-220IS, Q403 ST, 100-200 © SAMSUNG Electronics Co., Ltd.
  • Page 92 R412 2007-000307 R31-R33, R41-R43 R-CHIP 10 ohm, 1%, 1/8W, TP, 2012 2007-000378 R155, R255, R355, R-CHIP 13 Kohm, 1%, 1/8W, TP, 2012 R455 2007-000392 R118, R218, R318, R-CHIP 150 Kohm, 1%, 1/8W, TP, 2012 R418 © SAMSUNG Electronics Co., Ltd.
  • Page 93 73.2 Kohm, 1 %, 1/8W, TP, 2012 R462 2201-000545 C102, C202, C302, C-CERAMIC, 4.7NF, 20 %, 400V, Y5U, 16X7 MM, 7.5 C402 DISC 2201-000545 C103, C203, C303, C-CERAMIC, 4.7NF, 20 %, 400V, Y5U, 16X7 MM, 7.5 C403 DISC © SAMSUNG Electronics Co., Ltd.
  • Page 94 220 uF, 20 %, 16 V, GP, TP, 8.3x8.3x10 2402-001034 C105, C205, C305, C-AL, SMD 22 UF, 20 %, 35 V, GP, TP, C405 6.6X6.6X5.4 mm 2402-001042 C57, C58 C-AL, SMD 100 uF, 20 %, 16 V, GP, TP, 6.6x6.6x5.4 mm © SAMSUNG Electronics Co., Ltd.
  • Page 95 V103, V203, V303, SURGE 300 V, 15 %, 500 A V403 ABSORBER GA13-00004A IC ASIC-TMC STL7053E, IDCS500 PREMIUM, 60 PIN GA26-00003A T101, T201, T301, TRANS AF- 5692B, DCS-408, 2P : 3P, 800MH, 1.3DB T401 5692B © SAMSUNG Electronics Co., Ltd.

  • Page 96: 4Trk Board (Prs Type, Without Cid)

    4.7 Kohm, 5 %, 2W, AF, TP, 3.9x10 mm R401 OXIDE(S) 2003-002066 R102, R202, R302, R-METAL 20 ohm, 5 %, 1W, AF, TP, 2.5X6.5 mm R402 OXIDE(S) 2003-002169 R103, R203, R303, R-METAL 27 ohm, 5 %, 1W, AF, TP, 4.3x12 mm R403 OXIDE © SAMSUNG Electronics Co., Ltd.
  • Page 97 1 Kohm, 1 %, 1/8W, TP, 2012 2007-000474 R-CHIP 1 Mohm, 1 %, 1/8W, TP, 2012 2007-000490 R51-R53 R-CHIP 2.2 Kohm, 1 %, 1/8W, TP, 2012 2007-000515 R156, R256, R356, R-CHIP 2.7 Kohm, 1 %, 1/8W, TP, 2012 R456 © SAMSUNG Electronics Co., Ltd.
  • Page 98 100 NF, 10 %, 50V, X7R, 2012 C411 2203-000206 C152, C252, C352, C-CER, CHIP 100 NF, 10 %, 50V, X7R, 2012 C452 2203-000206 C153, C253, C353, C-CER, CHIP 100 NF, 10 %, 50V, X7R, 2012 C453 © SAMSUNG Electronics Co., Ltd.
  • Page 99 BACK PANEL 3704-001001 P101, P201, P301, SOCKET-IC 8P, SIP, SN, 2.54 mm P401 3722-000250 P2, P3 JACK- 6P/6C, INVERTED, N, ANGLE, MODULAR STANDARD 4715-000127 V101, V201, V301, SURGE 300 V, 15%, 500 A V401 ABSORBER © SAMSUNG Electronics Co., Ltd.

  • Page 100: 2Bri Board

    3.32 Kohm, 1 %, 1/10 W, TP, 1608 R251-R253 2007-000052 R161-R163, R-CHIP 10 Kohm, 1 %, 1/10 W, TP, 1608 R261-R263 2007-000052 R21-R27 R-CHIP 10 Kohm, 1 %, 1/10 W, TP, 1608 2007-000060 R-CHIP 100 Kohm, 1 %, 1/10 W, TP, 1608 © SAMSUNG Electronics Co., Ltd.
  • Page 101 0.1 NF, 5 %, 50 V, C0G, 1608 C302, C303 2203-000257 C55, C72, C301 C-CER, CHIP 10 NF, 10 %, 50 V, X7R, 1608 2203-000384 C121, C122, C221, C-CER, CHIP 0.015 NF, 5 %, 50 V, C0G, TP, 1608 C222 © SAMSUNG Electronics Co., Ltd.
  • Page 102 50P, 2R, FEMALE, STRAIGHT, AUF BACK PANEL 3711-003272 CONNECTOR- BOX, 10P, 2R, 2.54 MM, STRAIGHT, HEADER AUF, BLK 3722-000212 P72, P73 JACK- 8P/8C, INVERTED, N, ANGLE, MODULAR STANDARD GA26-00004A T101, T201 TRANS PULSE APT-2S0-22B, COMPACT II, 10P © SAMSUNG Electronics Co., Ltd.

  • Page 103: Mgi Board

    20 MHz, 50 ppm, 10TTL, 15pF, TP, CLOCK 3.3 V, 40 mA 3301-001120 L2, L3 BEAD-SMD 30 OHM, 2012, 3000, TP, 0.015 3711-004744 P1, P2 CONNECTOR- BOX, 40P, 2R, 0.8 MM, SMD-S, HEADER AU30U, NTR © SAMSUNG Electronics Co., Ltd.
  • Page 104 This page is intentionally left blank. © SAMSUNG Electronics Co., Ltd.

  • Page 105: Base Board

    OfficeServ 12 PCB Component Layout This annex describes the solder side and component side layout of the OfficeServ 12 system. A.1 Base board A.1.1 Component Side © SAMSUNG Electronics Co., Ltd.

  • Page 106: A.1.2 Solder Side

    A.1.2 Solder Side © SAMSUNG Electronics Co., Ltd.

  • Page 107: A.2 3/4Trk Board

    A.2 3/4TRK Board A.2.1 Component Side © SAMSUNG Electronics Co., Ltd.

  • Page 108: A.2.2 Solder Side

    A.2.2 Solder Side © SAMSUNG Electronics Co., Ltd.

  • Page 109: Component Side

    A.3 2BRI Board A.3.1 Component Side © SAMSUNG Electronics Co., Ltd.

  • Page 110: Solder Side

    A.3.2 Solder Side © SAMSUNG Electronics Co., Ltd.

  • Page 111: A.4 Mgi Board

    A.4 MGI Board A.4.1 Component Side A.4.2 Solder Side © SAMSUNG Electronics Co., Ltd.
  • Page 112 This page is intentionally left blank. © SAMSUNG Electronics Co., Ltd.
  • Page 113 DISA Direct Inward System Access Digital Line Interface Digital line interface Module Controller Do Not Disturb DPIM Door Phone Interface Module DPLL Digital Phase Locked Loop Digital Signal Processor DTMF Dual Tone Multi-Frequency Data Upstream © SAMSUNG Electronics Co., Ltd.
  • Page 114 Liquid Crystal Display Local Control Processor Least Cost Routing Light Emitting Diode Main Control Processor Multi-Frequency Media Gateway Interface MISC Miscellaneous Man Machine Command Music On Hold Metering Pulse Main Processing Unit Metering Pulse Detection © SAMSUNG Electronics Co., Ltd.
  • Page 115 Serial Input and Output Single Line Interface SLIC Subscriber Line Interface Circuit Serial Management Channel SMDR Station Message Detail Recording SMPS Switching Mode Power Supply SOHO Small Office Home Office SRAM Static Random Access Memory © SAMSUNG Electronics Co., Ltd.
  • Page 116 User Agent, or Universal Answer Uniform Call Distribution Alternating Current VBAT Voltage of Battery Volts Direct Current VoIP Voice over Internet Protocol Voice Mail System Watch-Dog Wired Equivalent Privacy WLAN Wireless Local Area Network Wireless LAN Interface © SAMSUNG Electronics Co., Ltd.
  • Page 117 OfficeServ 12 Service Manual ©2004 Samsung Electronics Co., Ltd. All rights reserved. Information in this document is proprietary to SAMSUNG Electronics Co., Ltd. No information contained here may be copied, translated, transcribed or duplicated by any form without the prior written consent of SAMSUNG.

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