INTRODUCTION .......................................................................................................................................................................3
FEATURES............................................................................................................................................................................3~5
SPECIFICATIONS.................................................................................................................................................................6~9
LOCATION OF CUSTOMER CONTROLS .......................................................................................................................10~11
DISASSEMBLY .................................................................................................................................................................12~13
1-1. Bottom Chassis ..........................................................................................................................................................12
1-2. Front Bezel Assy ........................................................................................................................................................12
2. MECHANISM ASSY DISASSEMBLY..............................................................................................................................12
2-1. Pick-up Unit................................................................................................................................................................12
2-2. Pick-up ......................................................................................................................................................................13
EXPLODED VIEW .............................................................................................................................................................14~15
MECHANICAL REPLACEMENT PARTS LIST ................................................................................................................16~18
GLOSSARY .............................................................................................................................................................................19
1. Recording Layer ..............................................................................................................................................................20
2. Disc Specification ............................................................................................................................................................20
3. Disc Materials ..................................................................................................................................................................21
4. Reading Process of Optical Disc .....................................................................................................................................22
5. Writing Process of CD-R Disc .........................................................................................................................................23
6. Writing Process of CD-RW Disc ......................................................................................................................................23
8. Function of PCA and PMA area ......................................................................................................................................25
9. OPC and ROPC ..............................................................................................................................................................25
10. Writing Process of DISC................................................................................................................................................26
1. Recording Layer ..............................................................................................................................................................27
2. Disc Specification ............................................................................................................................................................28
3. Disc Materials ..................................................................................................................................................................28
5. Writing Pulse Waveform DVD+RW .................................................................................................................................33
LightScribe MEDIA...........................................................................................................................................................36~39
1. LightScribe Media............................................................................................................................................................36
3. MD Assy For LightScribe.................................................................................................................................................38
4. Optical Encoder Assy ......................................................................................................................................................39
DVD & CD DATA PROCESSING......................................................................................................................................40~43
1. Data Processing Flow......................................................................................................................................................40
2. Pick up Pin Assignment...................................................................................................................................................45
3. Signal detection of the P/U ..............................................................................................................................................46
DESCRIPTION OF CIRCUIT.............................................................................................................................................47~53
1. ALPC Circuit ....................................................................................................................................................................47
2. Focus Circuit....................................................................................................................................................................49
3. Tracking & Sled Circuit ....................................................................................................................................................50
4. Spindle Circuit .................................................................................................................................................................53
TROUBLESHOOTING GUIDE ..........................................................................................................................................73~90
BLOCK DIAGRAM ..................................................................................................................................................................91
PRINTED CIRCUIT BOARD DIAGRAM ...........................................................................................................................92~96
ELECTRICAL REPLACEMENT PARTS LIST ........................................................................................................................97
CAUTION - INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM.
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