Siemens SXG 75 Service Repair Documentation

Siemens SXG 75 Service Repair Documentation

Hide thumbs Also See for SXG 75:

Advertisement

Release 1.0
Service Repair Documentation
Level 3 – SXG75
Release
Date
Department
Notes to change
1.0
24.01.2006
BenQ Mobile CC S CES
New document
Technical Documentation
01/2006
TD_Repair_L3_SXG75_R1.0.pdf
Page 1 of 73
Company Confidential
2006©BenQ

Advertisement

Table of Contents
loading

Summary of Contents for Siemens SXG 75

  • Page 1 Release 1.0 Service Repair Documentation Level 3 – SXG75 Release Date Department Notes to change 24.01.2006 BenQ Mobile CC S CES New document Technical Documentation 01/2006 TD_Repair_L3_SXG75_R1.0.pdf Page 1 of 73 Company Confidential 2006©BenQ...
  • Page 2: Table Of Contents

    Release 1.0 Table of contents: Instruction ..........................4 List of available spare parts .....................5 Required equipment for level 3 ....................7 Required software for level 3 ....................7 Radio part...........................8 .......................9 LOCK DIAGRAM PART (RTR6250 RFR6250)...................10 ECEIVER ........................12 RANSMITTER .........................15 NTENNA SWITCH Baseband ..........................17 ........................17 LOCK DIAGRAM MSM6250...
  • Page 3 Release 1.0 13 Cameras ...........................59 13.1 ........................59 PIX CAMERA 13.2 .........................60 CAMERA 13.3 ......................60 AMERA BUS INTERFACE 13.4 ......................60 AMERA FLASH TRIGGER 14 Vibramotor ..........................62 15 IrDA and fuel gauge ........................63 15.1 ......................63 TRANSCEIVER 15.2 ..............63 ATTERY FUEL GAUGE AND MULTIPLEXING 16 Accessory interface ........................66 16.1...
  • Page 4: Instruction

    Release 1.0 1 Instruction This Service Repair Documentation is intended to carry out repairs on BenQ Mobile repair level 3. The described failures shall be repaired in BenQ Mobile authorized local workshops only. All repairs has to be carried out in an ESD protected environment and with ESD protected equipment/tools.
  • Page 5: List Of Available Spare Parts

    Release 1.0 2 List of available spare parts (according to Component Matrix V1.03 - check C-market for updates) Component Ordernumber Description V101 L50640-D4060-D670 DISDIODE DUAL ESD-PROTECTION SOT23 V200 L50630-C1101-D670 DISTRANS SI1555DL N200 L50645-K280-Y337 IC FEM LMSP43MA-288TEMP GSM UMTS SMD Z203 L50645-K280-Y323 FILTER DUPLEX WCDMA Z200...
  • Page 6 Release 1.0 V1801 L36840-D61-D670 DIODE 1SV305 (Di-Type4) V1900 L36840-C4057-D670 TRANSISTOR EMD12 EMT6 (Tra-Type8) N1900 L50610-C6152-D670 IC ANA REG 2*2,85V 150MA USMD8 LP3986T D1900 L50610-B6198-D670 IC LOGIC BUFFER 74ALVC16244AZQLR VBGA LF D1901 L50610-B6198-D670 IC LOGIC BUFFER 74ALVC16244AZQLR VBGA LF V2000 L36840-C4014-D670 TRANSISTOR BC847BS BC846S (Tra-Type7) D2100 L50610-B6134-D670...
  • Page 7: Required Equipment For Level 3

    Release 1.0 3 Required equipment for level 3 GSM-Tester (CMU200 or 4400S incl. options) PC, incl. monitor, keyboard and mouse USB boot cable ( F30032-P465-A1 Troubleshooting frame SXG75 Power supply Spectrum analyser Active RF-Probe incl. power supply Oscilloscope incl. probe RF-Connector (N<>SMA(f)) Power supply cables Dongle (F30032-P28-A1).
  • Page 8: Radio Part

    Release 1.0 5 Radio part The RF section consists of three data capable transceivers and two further broadcast receivers. The first transceiver is an IMS UMTS 2100MHz 3G solution which realizes the conversion of the RF WCDMA signals from the antenna to the baseband and vice versa. The second transceiver is a GSM part which realizes the conversion of the GMSK-RF-signals from the antenna to the baseband and vice versa.
  • Page 9: Block Diagram Rf Part

    Release 1.0 5.1 Block diagram RF part VBATT VREG_RFTX RF/BB VREG_RFTX GSM_PA_EN TX_VCO_1_EN VREG_SYNTH Ant/RF GSM_PA_BAND TX_VCO_0_EN VREG_MSMP core/rest PA_RAMP VREG_RFRX_0 GSM Tx TX_VCO_1_EN TX_ON External TX_VCO_0_EN TX_IREF Cellular Renesas Cellular TX_AGC_ADJ Antenna ALPS PF08143B-06-TB Antenna Connector UCVA4XW02A Memory 942.5MHz SAW SB_**0 EPCOS B7837 SP6T...
  • Page 10: Receiver (Rtr6250 And Rfr6250)

    Release 1.0 Receiver (RTR6250 and RFR6250) The RFR6250 has two VCOs. The first is for the UMTS direct conversion receiver. The second is for the GPS receiver and the PLL for this VCO is on the RTR6250 RFIC. Block diagram RFR6250 The RTR6250 contains two PLLs, the first is used by the RTR for all GSM transceiver functions and for the UMTS TX LO generation.
  • Page 11 Release 1.0 5.2.1 GSM RX The GSM Receiver is a zero IF architecture with direct conversion by the IC. Although the IC provides four input paths, the GSM850 Receiver is not used in the SXG75. Block diagram RTR6250 5.2.2 UMTS RX The RFR6250 provides an LNA and an output to allow further input filtering.
  • Page 12: Transmitter

    Release 1.0 5.3 Transmitter 5.3.1 GSM TX modulation The GSM transmitter uses a Offset Phase Lock Loop Architecture. The high power VCO is external to the RTR6250. A feedback signal from the VCO is down-converted and the phase compared to that of an upconverted version of the IQ signals from the baseband.
  • Page 13 Release 1.0 GSM power amplifier 5.3.3 The output signals (OUT1 and OUT2) from the GSM TX VCO are led to the power amplifier. The power amplifier is the PA-module N300. It contains of two separate amplifier chains for GSM900 and GSM1800/GSM1900 operation. The amplification is controlled with the signal VRAMP.
  • Page 14 Release 1.0 UMTS TX 5.3.4 The IQ signals from the baseband are directly up-converted to the RF band by a Quadrature Upconverter and passed to the external filter. The UMTS 1900 TX path is not used in the SXG75. Blockdiagram RTR6250 VBATT WCDMA TX UMTS2100 TX...
  • Page 15: Antenna Switch

    Release 1.0 5.4 Antenna switch The SXG75 mobile has two antenna switches: The mechanical antenna switch for the differentiation between the internal and external antenna. Internal/external antenna switch External to/ from switch Internal module Circuit diagram (sheet 2) Technical Documentation 01/2006 TD_Repair_L3_SXG75_R1.0.pdf Page 15 of 73...
  • Page 16 Release 1.0 The electrical antenna switch for the differentiation between the GSM and UMTS receiving respectively transmitting signals Signal selection VREG_RFRX_0 signals from/ to antenna UMTS signals Circuit diagram (sheet 2) Technical Documentation 01/2006 TD_Repair_L3_SXG75_R1.0.pdf Page 16 of 73 Company Confidential 2006©BenQ...
  • Page 17: Baseband

    Release 1.0 6 Baseband 6.1 Block diagram Technical Documentation 01/2006 TD_Repair_L3_SXG75_R1.0.pdf Page 17 of 73 Company Confidential 2006©BenQ...
  • Page 18: Msm6250 Processor

    Release 1.0 6.2 MSM6250 processor 6.2.1 General features Supports UMTS FDD release 99 September 2002 standard air interface • • Supports GSM/GPRS in addition to W-CDMA • Supports low-power, low-frequency crystal to enable TCXO shutoff • radioOne™ Zero IF interface Zero IF support - DC offset cancellation and digital variable gain amplifier •...
  • Page 19 Release 1.0 6.2.2 MSM6250 power supplies The supplies used by the MSM6250 are generated by the PM6650 (Section 5). They are as follows: Supply Name Value Power Domain VREG_MSMC 1.375 V (±3%) Digital Core only. VREG_MSME 1.850 V (±3%) SDRAM interface (EBI1 bus), NAND FLASH and LCD interface (EBI2 bus), supply voltage for IO Pad group 2 VREG_MSMA...
  • Page 20 Release 1.0 6.2.3 Clock distribution The master clock for Wolf 5 baseband and RF systems runs at 19.2MHz. The clock is generated by Voltage-Controlled-Temperature-Compensated-Crystal-Oscillator Z1000. The clock is buffered to VREG_MSMP (2.6V) levels within the PM6650, and then sent to the MSM6250. The PM6650 buffer is enabled by logic control TCXO_EN from the MSM6250.
  • Page 21 Release 1.0 Circuit diagram (sheet 10) The oscillator output signal TCXO is connected to the power management IC (PMIC, N1300, Pin 58). The oscillator output signals RFR6250_TCXO and RTR6250_TCXO are connected to the RF chips RFR6250 (N600, Pin 33) resp. RTR6250 (D500, Pin 6). To compensate frequency drifts the oscillator frequency is controlled by the TRX_LO_ADJ signal, generated through the MSM6250 (D800, SW_TP902).
  • Page 22 Release 1.0 6.2.4 MSM6250 bootup and mode control The MSM6250 supports booting from the NAND FLASH memory. The high pull-up (R1700) on the bootmode input pin is used to indicate to the MSM hardware that FLASH boot-up is required. After power-on reset, the MSM hardware automatically loads the boot code from NAND flash to an on- chip boot SRAM, and then releases the ARM to execute from this boot SRAM.
  • Page 23: Msm6250 Interfaces

    Release 1.0 6.3 MSM6250 interfaces 6.3.1 Logic interfaces Each IO pin on the MSM6250 has an associated pad group. The pad group, and hence the IO pin, is powered from the supplies as below: Supply Name Value Pad Group Connections Group VREG_MSME 1.850 V (±3%)
  • Page 24 Release 1.0 GPIO Signal Name Function CAM1_PWR_EN Mpix camera regulator enable. Active high. CAM2_PWR_EN CIF camera regulator enable. Active high PS_HOLD PM6650. Held high to latch phone power ON. GSM_PA_EN RF system control. GSM_PA_BAND RF system control. (Not used) LOW_VOL TX_VCO_1_EN_N RF system control.
  • Page 25 Release 1.0 ETM detect Pull-down resistor used on ETM board version only. LCD2_CS_N LCD interface. MSM_UART1_DCD_N Accessory connector UART signal. PM_INT_N PM6650 interrupt to MSM6250. (Not used) FUEL_GAUGE_1 (Not used. required for ETM board version only) (Not used. required for ETM board version only) (Not used.
  • Page 26 Release 1.0 SDRAM_A1(0) SDRAM interface. PM_SBCK PM6650 serial port. MSM <> PM6650 communication. PM_SBST PM6650 serial port. MSM <> PM6650 communication. PM_SBDT PM6650 serial port. MSM <> PM6650 communication. USB_RS232_SEL1 USB / UART select control. High for UART selection. IRDA_TXD IrDA interface.
  • Page 27 Release 1.0 6.3.2 Analogue interfaces The analogue functions in the MSM6250 are powered from the VREG_MSMA (2.6V) supply. Signal functions are summarised below: MSM6250 Signal Name Function Function MIC1P MIC1_P Mic 1 input (+) to phone microphone MIC1N MIC1_M Mic 1 input (-) to phone microphone MIC2P MIC2_P Mic 2 input (+) to accessory connector mic input...
  • Page 28 Release 1.0 I_IM_CH0 RX0_I_M and from analogue IQ output from GSM receiver (RTR6250) Q_IP_CH0 RX0_Q_P Q_IM_CH0 RX0_Q_M I_OUT TX_I_P I_OUT_N TX_I_M To analogue IQ inputs of the RF transceiver (RTR6250) Q_OUT TX_Q_P Q_OUT_N TX_Q_M MSM6250 analogue interfaces Technical Documentation 01/2006 TD_Repair_L3_SXG75_R1.0.pdf Page 28 of 73 Company Confidential...
  • Page 29 Release 1.0 6.3.3 RF interfaces The MSM6250 provides the baseband controls for the RF section of the phone. Control and signal interfaces are shown below. Technical Documentation 01/2006 TD_Repair_L3_SXG75_R1.0.pdf Page 29 of 73 Company Confidential 2006©BenQ...
  • Page 30 Release 1.0 Signal Function WCDMA Power Detector Voltage proportional to TX power of WCDMA signal. Fed to HKAIN2 input HDET1 to MSM6250 ADC multiplexer. WCDMA PA Logic control to enable PA.. Turns the PA on and off as required to support UMTS operation while consuming minimum DC current.
  • Page 31 Release 1.0 RTR6250 GSM / WCDMA Rx IQ Interface RX0_I_M Received GSM and WCDMA IQ signals. The IQ signals are concerted to RX0_I_P digital by analog-to-digital converter (ADC) circuits within the MSM6250 RX0_Q_M RX0_Q_P RTR6250 / RFR6250 Serial Comms Interface The RTR6250 and RFR6250 operating modes and circuit parameters are MSM-controlled through the proprietary 3-line serial bus interface.
  • Page 32: Fm Radio

    Release 1.0 7 FM Radio The output from the Philips FM radio chip is fed into the auxiliary input of the MSM6250 audio CODEC. This is the routed directly to the auxiliary outputs of the MSM6250 via a built in gain stage. FM radio can be played in stereo or mono mode, depending upon signal quality and/or user selection.
  • Page 33 Release 1.0 Interface signals are: Signal Function 32.768MHz clock from PM6650. Used as master clock for FM system. SLEEP_CLK Logic output from FM radio. A_RDS_DATA_EXIST Provides an interrupt signal to MSM6250. The radio takes this line low for 10ms to indicate that it has new RDS data, or that some other action is required by the MSM6250.
  • Page 34: Power Management

    Release 1.0 8 Power management 8.1 PM6650 functional overview PM6650 functions Technical Documentation 01/2006 TD_Repair_L3_SXG75_R1.0.pdf Page 34 of 73 Company Confidential 2006©BenQ...
  • Page 35 Release 1.0 PM6650 block diagram Technical Documentation 01/2006 TD_Repair_L3_SXG75_R1.0.pdf Page 35 of 73 Company Confidential 2006©BenQ...
  • Page 36: Voltage Regulators And Voltage Converters

    Release 1.0 8.2 Voltage regulators and voltage converters The table below lists the voltage supplies of the PM6650. Note that the rated current is the current at which the regulator meets all its performance specifications. Higher currents are allowed but higher input voltages may be required and some performance characteristics may become degraded.
  • Page 37 Release 1.0 X2201 (LCD), D1000 (NAND FLASH), D1001 (SDRAM), VREG_MSME 0.75 -3.05V D800 (MSM6250 (Step-down VREG_MSME 1.85V (500mA) VDD_P2, VDD_P1) Switcher) VREG_MSMC 0.75 -3.05V D800 (MSM6250 (Step-down (500mA) VREG_MSMC 1.375V VDD_C) Switcher) D800 (MSM6250 D1800 (FM VDD_A), D800 Radio), RF/PA (MSM6250 temperature VDD_PLL), D800...
  • Page 38: Additional Power Supplies

    Release 1.0 8.3 Additional power supplies The following additional external regulators are required: Regula- Voltage Supply Net Name Supplies Enabled by set to 2.85V / CAM1_PWR_EN N1900 VREG_CAM1 (2) Camera 1 and 2 2.85V CAM2_PWR_EN (none) Supply on the N2201 2.9V LCD (on EBI2 bus) LCD_EN...
  • Page 39 Release 1.0 RUIM_M_IO USIM_DATA SIM signal level shifter interface to MSM6250 RUIM_IO UIM_P_DATA SIM signal level shifter interface to SIM Card USB Interface. The MSM6250 USB signals interface to a USB transceiver on the PM6650 USB_OE USB_OE_TP_N USB interface to MSM6250 USB_DAT USB_DAT_VP USB interface to MSM6250...
  • Page 40: Power On/Off Sequencing

    Release 1.0 AMUX_IN2 LCD_RST_N LCD Reset. Current control. The vibramotor is driven by a current sink function on the PM6650 /VIB_DRV VIB_DRV Current sink for Vibrator Motor Power Management. Power on/off and backup functions (100uF capacitor, VCOIN Back-up capacitor. 100uF for 40 sec backup C1312) /PON_RST PON_RST_N...
  • Page 41 Release 1.0 As each regulator is enabled, detector circuits confirm that it powers up properly before triggering a wait interval. After the wait interval expires, the next regulator is enabled. This process continues until all the default-on regulators have powered up successfully. Once all the default-on regulators are on another wait interval is observed before the PON_RESET_N signal is driven high.
  • Page 42 Release 1.0 • After an interval several conditions are checked to determine the next action: o If the over-temperature threshold was exceeded then the PON_RESET_N signal is immediately driven low and all PM6650 circuits are turned off. The over-temperature feature protects the PM6650 IC and cannot be disabled.
  • Page 43: Battery/Charging

    Release 1.0 9 Battery/Charging 9.1 Battery The battery is a high capacity LiIon - battery pack nominally rated at 4.2 V open circuit terminal voltage and about 1000 mAh minimal capacity. The battery pack has in-built electrical protection circuitry and contains a BQ27000 fuel gauge monitor from Texas Instruments. The fuel gauge signal is a 1-wire HDQ interface.
  • Page 44: Charging

    Release 1.0 GSM in which the RF PA current approaches 2A for full power transmit. Under these conditions the total voltage drop from cell to PA is in the order of 250mV. With a calibrated cell at 25C the primary shutdown point is intended to occur when sufficient capacity remains to allow a 3 minute call at high power which is deemed to be a supply current of 350mA.
  • Page 45 Release 1.0 9.3.1 Charging concept Overview Note: On initial inspection charging would appear to be a simple process. However, the safety requirements of LiIon cells necessitates that the phone charging system must monitor and control the process carefully. Control is achieved by means of the on board PM6650 ADC and from measurements made by a fuel gauge IC integrated into the battery.
  • Page 46 Release 1.0 Charging circuit elements controlled by the PM6650 The following signals are involved in the battery charging process: Signal Function POWER This is the supply connection to the accessory connector. Drive signal from PM6650. The control for the pass transistor, V1100. Low voltage turns on the transistor.
  • Page 47 Release 1.0 Battery charging signals The external charger voltage is presented on the line labelled “POWER”. When using the Siemens standard charger units, it is imperative that the pass transistor is operated as a fully saturated switch and that sufficient current is drawn from the charger to guarantee voltage fold back which minimises the voltage across the pass transistor and therefore maintains the dissipation of the pass transistor within acceptably low bounds.
  • Page 48 (charger) is detected with a supply voltage above 6.4 Volt by the PM6650. The level of charge current is only limited by the charger. The Wolf 5 normal charger is the Siemens Travel Charger which obeys the output envelope shown below.
  • Page 49 Release 1.0 Pulsed charging The pulsed charging mode is used to bring up the battery to maximum capacity. If the input transistor is switched off at a level of 4.2V, the battery voltage drops down. This dropdown voltage depends on the temperature, the age of the battery etc. This final stage of charging is referred to as TOPOFF and can take place in two stages.
  • Page 50: Audio Interference And Suspension Of Pulse Charging

    Release 1.0 10 Audio interference and suspension of pulse charging The low frequency pulsing of the charge current which takes place in TOPOFF charge mode makes audible interference when the phone is in a state where audio circuits are active. Hence in all such modes TOPOFF is suspended and constant current (FAST) charging becomes the only available charging mode.
  • Page 51 Release 1.0 11.1.2 Interface display module The display is connected to FPC socket X2201 on the main PCB via a 30-pin connector mounted on a short flex. Orientation of LCD connector (top view) LCD Interface signals are as follows: X2201 LCD Function Signal Function...
  • Page 52 Release 1.0 OE2_N Read signal WE2_N Write signal DAT0 EBI2_D(0) D0 ~ D7:connects to the 8/16- bit standard MPU data bus, using the 8/16-bit, bi- directional data bus DAT1 EBI2_D(1) EBI2 data bus DAT2 EBI2_D(2) EBI2 data bus DAT3 EBI2_D(3) EBI2 data bus DAT4 EBI2_D(4)
  • Page 53 Release 1.0 11.1.4 Illumination The LCD backlight is supplied by 4 white LEDs. These are connected in series to a high voltage supply at 18.75V (VREG_BCKLT). The supply is generated by switching regulator N900, and is enabled when BACKLIGHT_EN is high. The current through the LED chain is set to 18mA using the current-limiter circuit of V2200/R2222/R2225.
  • Page 54: Keypad

    Release 1.0 When the LEDs are being driven, LCD_BCLKT_PWM is high, so V2200(a) is ON. Current therefore flows through R2225. When the voltage across R2225 reaches approximately 0.7V, transistor V2200(b) turns ON, and starts to turn V2200(a) OFF. An equilibrium is then reached, where the LED current is set to 0.7V/39R= 18mA.
  • Page 55 Release 1.0 Keypad mapping Technical Documentation 01/2006 TD_Repair_L3_SXG75_R1.0.pdf Page 55 of 73 Company Confidential 2006©BenQ...
  • Page 56 Release 1.0 11.2.2 Illumination The keypad backlight is supplied by 10 white LEDs. These are arranged as two chains of 5 LEDs, both connected to a high voltage supply at 18.75V (VREG_BCKLT). The supply is generated by switching regulator N900, and is enabled when BACKLIGHT_EN is high. The current through each LED chain is set to approximately 3mA using the current-limiter circuit of V2000/R2017/R2018.
  • Page 57 Release 1.0 The voltage seen at the collector of V2000(a) is nominally 2.55V, but can vary between 0.87 and 5.43V with device tolerance. Resistors R1 and R2 in the LED chain are required to reduce the effects of any mismatch in diode forward voltage in the two chains.
  • Page 58: Acoustics

    Release 1.0 12 Acoustics Acoustics block diagram Technical Documentation 01/2006 TD_Repair_L3_SXG75_R1.0.pdf Page 58 of 73 Company Confidential 2006©BenQ...
  • Page 59: Microphone, Speaker And Hands-Free Speaker

    Release 1.0 12.1 Microphone, speaker and hands-free speaker SXG75 contains an internal earpiece receiver, a hands-free/ringer speaker and a microphone. The microphone and the earpiece receiver are connected to the MSM6250 dedicated audio CODEC inputs. The hands-free speaker is connected to the output speaker driver of the PM6650 with the audio signal for the hands-free speaker provided by the auxiliary output of the MSM6250 audio CODEC.
  • Page 60: Cif Camera

    Release 1.0 13.2 CIF camera The CIF camera module is the ADCM-1700-1002 from Agilent. The module is mounted in socket X1900. The camera is powered from the VREG_CAM2 (2.85V) supply. This is provided from regulator N1900. The regulator is enabled when the MSM6250 control line CAM2_PWR_EN is taken high. The camera is also set-up via the I2C bus (I2C_SDA, I2C_SDA).
  • Page 61 Release 1.0 When flash operation is required on the Samsung mega pixel camera, the VSYNC output becomes active earlier than normal. This extended pulse is used to synchronise the external flash to the time when the camera pixels are active. When the camera shutter is activated, The MSM6250 needs to enable one full V-sync pulse during the active camera period.
  • Page 62: Vibramotor

    Release 1.0 14 Vibramotor The vibration motor is mounted in the lower case. The electrical connection to the PCB is realised with pressure contacts XG1302 and XG1303. The vibration motor is controlled with the PM6650 vibra motor driver as illustrated below. The vibration driver is an SBI-programmable voltage output that is referenced to VPH_PWR.
  • Page 63: Irda And Fuel Gauge

    Release 1.0 15 IrDA and fuel gauge The IrDA transceiver and battery fuel gauge communicate with the MSM6250 using the same UART (a further spare UART is not available). So both functions are covered in this section. 15.1 IrDA transceiver V2106 is a low power infrared data interface transceiver module.
  • Page 64 Release 1.0 The MSM6250 interfaces to the fuel gauge are: • IRDA_RXD and IRDA_TXD from UART 3. These lines can be disconnected from the fuel gauge interface via a tri-state buffer. • IRDA_EN. The tri-state buffer is disabled when IRDA_EN is low. It is enabled when high. The fuel gauge interface is open-drain at the battery pack.
  • Page 65 Release 1.0 Bluetooth SXG75 contains a BCM2004 Bluetooth RF module. The BCM2004 is powered from VREG_MSMP (2.6V) for the digital interface, and VREG_AUX2 (2.85V) for the RF/core stages. The IC contains an internal regulator which regulates VREG_AUX2 down to VDD_BT (1.8V). The Bluetooth baseband processor is contained within the MSM6250.
  • Page 66: Accessory Interface

    Release 1.0 16 Accessory interface 16.1 Overview A standard “Slim Lumberg” BenQ Mobile accessory connector allows approved devices to be connected to the phone. These devices include battery chargers, data transfer cables (USB or UART), camera flash and audio products (headset, car kit etc). Signals at the accessory connector are listed below: Signal Function...
  • Page 67: Uart And Usb Multiplexing

    Release 1.0 16.2 UART and USB multiplexing On the accessory connector, the differential signals (D+ and D-) of the USB interface are multiplexed with the UART signals TX and RX. UART/ USB multiplexing block diagram Z1201 is a low-impedance switch which connects the accessory connector TX/RX lines either to the PM6650 USB port, or to the MSM6250 UART.
  • Page 68: Connector Default Configuration

    Release 1.0 16.3 Connector default configuration When no accessory is present, the accessory connector must be configured to a specific default state. This default state only applies when the phone is switched on or when the phone stays in charge mode. The default values are shown below: Signal Default Level...
  • Page 69: Uart

    Release 1.0 17 UART The UART at the accessory connector requires the status signals CTS, RTS, and DCD to be configured as a “DCE” device. This has DCD and CTS as outputs, and RTS as an input. However, TX and RX are configured as a “DTE” device, with TX output and RX input. UART1 on the MSM6250 is configured as a full “DTE”...
  • Page 70: Sim Interface

    Release 1.0 Signal Function Plus (+) line of the digital-differential, bi-directional USB signal to/from the MSM6250. Signal levels are translated between MSM and USB USB_DAT_VP domains within the PM6650 IC. Minus (-) line of the digital-differential, bi-directional USB signal to/from the MSM6250. Signal levels are translated between MSM and USB_SE0_VM USB domains within the PM6650 IC.
  • Page 71: Mmc Interface

    Release 1.0 20 MMC interface Reduced size MMC are supported. The card interface is supplied from VREG_AUX1 (2.85V). Card insertion is detected by the MMC_CD line. This line is an input to a MSM6250 port. The line has an external pull-up (R1400) to VREG_MSME. When a card is inserted, the MMC_CD line is pulled to ground by an internal connection in the card.
  • Page 72: Component Placement

    Release 1.0 21 Component placement The positions of the major components are indicated on the figures below: Components top side Technical Documentation 01/2006 TD_Repair_L3_SXG75_R1.0.pdf Page 72 of 73 Company Confidential 2006©BenQ...
  • Page 73: Technical Documentation Td_Repair_L3_Sxg75_R1.0.Pdf

    Release 1.0 Components bottom side Technical Documentation 01/2006 TD_Repair_L3_SXG75_R1.0.pdf Page 73 of 73 Company Confidential 2006©BenQ...

Table of Contents