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TABLE OF CONTENTS
1. SERVICE NOTE ...........................................................
2. GENERAL ....................................................................
3. DISASSEMBLY ..........................................................
5-2. Printed Wiring Board - Surround Section - ................... 27
5-3. Schematic Diagram - Surround Section - ..................... 31
5-4. Schematic Diagram - OSD Section - ............................ 35
5-5. Printed Wiring Board - OSD Section - .......................... 39
5-6. Printed Wiring Board - Amp Section - .......................... 43
5-7. Schematic Diagram - Amp Section - ............................. 47
5-8. Schematic Diagram - Display Section - ........................ 50
5-9. Printed Wiring Board - Display Section - ..................... 53
5-10. IC Block Diagrams
- Surround Section - ...................................................... 57
- OSD Section - ............................................................. 59
- Amp Section - ............................................................. 60
(MB90673PF-G-166-BND) ............................................ 62
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6 7
1 3
1 5
(MB90095PF-G-161-BND) ............................................ 64
(S-1810CF-049) .............................................................. 67
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE
WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN
co
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
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WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
9 4
2 8
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0 5
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2 9
9 4
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