Table of Contents
Advertisement
HCD-RG66
QQ
3 7 63 1515 0
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
This appliance is classified as a CLASS 1 LASER product. The
TE
L 13942296513
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
www
.
2
http://www.xiaoyu163.com
x
ao
u163
y
i
2 9
8
TABLE OF CONTENTS
·········································································· 3
································································ 5
2-1. Case (Top) ····································································· 5
2-2. CD Door ········································································ 6
2-3. Front Panel Section ······················································· 6
2-4. CD Mechanism Deck (CDM58F-K6A) ························ 7
2-5. Tape Mechanism Deck (CWL43RR-51) ······················ 7
2-6. MIC Board, PANEL Board, REM Board ····················· 8
2-7. KEYBOARD Board ····················································· 8
2-8. Back Panel Section ······················································· 9
2-10. MAIN Board ······························································· 10
2-11. POWER Board ···························································· 10
2-12. TRANS Board ···························································· 11
2-13. BD Board, DRIVER Board ········································ 11
2-14. SPDL MORTR Board ················································ 12
2-15. Optical Pick-up (KSM-213DCP) ································ 12
2-16. MOTOR Board, ADDRESS SENSOR Board ············ 13
2-17. Table (New), Cam (Control) and DC Motor ··············· 13
···································································· 14
······································································ 18
5-1. Circuit Boards Location ·············································· 19
3
6 7
1 3
1 5
5-2. Block Diagrams -TUNER Section- ··························· 20
MAIN Section ····························································· 21
5-3. Printed Wiring Boards - CD Section (1/2) - ·············· 22
5-4. Printed Wiring Boards - CD Section (2/2) - ·············· 23
5-5. Schematic Diagram - CD Section - ··························· 24
5-6. Printed Wiring Board - MAIN Section - ··················· 25
5-7. Schematic Diagram - MAIN Section (1/4) - ············· 26
5-8. Schematic Diagram - MAIN Section (2/4) - ············· 27
5-9. Schematic Diagram - MAIN Section (3/4) - ············· 28
5-10. Schematic Diagram - MAIN Section (4/4) - ············· 29
5-11. Printed Wiring Boards - PANEL Section - ················ 30
5-12. Schematic Diagram - PANEL Section - ···················· 31
- SURROUND/KEYBOARD Section - ···················· 34
- SURROUND/KEYBOARD Section - ···················· 34
5-17. IC PIN FUNCTION DESCRIPTION ························· 38
······················································ 40
6-1. Main Section ······························································· 40
6-2. Front Panel Section ····················································· 41
6-3. MAIN Board Section ·················································· 42
6-4. CD Mechanism Deck Section (CDM58F-K6A) ········· 43
co
.
9 4
2 8
······························· 16
0 5
8
2 9
9 4
2 8
······································· 44
m
9 9
9 9
Hide quick links:
Advertisement
Table of Contents
