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SECTION
6 -
FORCED AIR COOLING
The card cage configuration shown below was used to evaluate the effects
of forced-air cooling.
A 37cfm (no head) fan was mounted over each 8-slot section
of the card cage.
The temperature was then monitored at different locations
on the center card of the three adjacent 7701 RAM cards.
It was found that for this forced-air cooling configuration, the hottest
IC on the card was at the top center of the memory chip array.
The case
temperature (TC) of the hottest 2114Ls was, in every instance, within
20
0
C of ambient (TA)'
Note that, without forced-air cooling, the hot spot on the card was at
the center of the memory chip array rather than at the top of the card.
For design of systems using forced-air, refer to fan manufacturer litera-
ture such as "How to Select the Optimum Fan for Your Application" by
Pamotor Corp., 770 Airport Blvd., Burlingame, Ca., 94010.
Ai r flo\..., from
37 cfw
fans mour.ted in
sheet metal plate
(yl diameter mounting holes)
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card
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moved in groups of 3 to
L
3/8" rubber feet
different locations of fully
(4 pIes.)
loaded ca rd rack
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(1/2" mounting centers)
25
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