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PLAN
#133 -
THERMAL APPL1'CATION NOTE FOR MICROPROCESSOR SYSTEMS USING STD/SERIES
7000 CARDS
TABLE OF CONTENTS
SECTION 1
SECTION ,2
SECTION
3
SECTION
It
SECTION
5
SECTION 6
SECTION 7
ILLUSTRATIONS
FIGURE 1
FIGURE 2
TABLES
TABLE 1
TABLE 2
TABLE 3
INTRODUCTION
THERMAL CONSIDERATIONS FOR STD SYSTEMS
CONFIGURING A TYPICAL SYSTEM
FAILURE RATE ACCELERATION DUE TO T
J
THERMAL RESISTANCE OF ICs
FORCED AIR COOLING
CONCLUSION
THERMAL AND ELECTRICAL ANALOGY
HEAT FLOW IN ENCLOSED DIGITAL SYSTEM
TYPICAL NOMINAL POWER DISSIPATION FOR SERIES 7000 CARDS
THERMAL RESISTANCE OF TYPICAL IC PACKAGES
FAILURE RATE AS A FUNCTION OF T
J
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