Advertisement
SECTION 5 - THERMAL RESISTANCE OF ICs
Typical thermal resistance values of standard plastic integrated circuit
packages are shown in Table 3.
The values shown do not imply any guar-
antee, but represent the latest and best available data.
Steady-state
thermal conditions are assumed in the resistance measurements.
Also, the
following definitions apply:
Table 3 Conditions and Definitions
R
eJc -
Thermal resistance from junction to case using freon as a heat
sink.
This parameter offers good reapeatability and a high degree
(±5%) of correlation.
~JA-
Thermal resistance from junction to still air (25
0
C ambient) with
package in a specified socket.
This parameter is highly dependent
on test conditions which are difficult to reproduce accurately.
°C/WATT
&
SOCKET USED FOR
POWER
PACKAGE DESCRIPTION
RaJC ±5%
RaJA ±15%
RaJA MEASUREMENT
(mW)
8- Pin P 1 as tic DIP
52
95
Augat
300
14- or 16- Pin Plastic DIP
45
90
Augat
300
24-p i n Plastic DIP
35
65
Barnes
500 -
14- or l6-Pin Ceramic DIP
20
70
Augat
300
24 lead Ceramic, Kovar Lid
15
50
14 or 16 lead with glass seal
27
95
24 lead ceramic with glass seal
12
50
14- or l6-pin Ceramic Flat Pak
45
160
Barnes Carrier/
500
(a lloy mounted)
Contactor
14-Pin Ceramic Flat Pak
70
190
Mech-Pak Carrier
300
(g 1 ass mounted)
8- or lO-Pin Plug-In
40
120
Barnes
400
(a l10y mounted)
8- or 10-Pin Plug-In
90
170
Barnes
700
(glass mounted)
TABLE 3 - THERMAL RESISTANCE OF TYPICAL IC PACKAGES
~
For more accurate calculations use values given by the device manufacturer
24
o
o
()
Advertisement
