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CONTENTS
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1. SPECIFICATIONS .............................................................................................................................................6
3 7 63 1515 0
2.1 A-A9 model .................................................................................................................................................7
2.1.1 PACKING (A-A9) ..................................................................................................................................7
2.1.2 EXTERIOR (A-A9)................................................................................................................................8
2.2 A-A6 model ...............................................................................................................................................11
2.2.1 PACKING (A-A6) ................................................................................................................................11
2.2.2 EXTERIOR (A-A6)..............................................................................................................................12
3.1 OVERALL BLOCK DIAGRAM ..................................................................................................................16
3.2 OVERALL WIRING DIAGRAM .................................................................................................................18
3.5 XM-READY/USB ASSY ............................................................................................................................24
4. PCB CONNECTION DIAGRAM ......................................................................................................................30
4.5 XM-READY/USB ASSY ............................................................................................................................38
4.8 REG IC and POWER ASSYS...................................................................................................................44
5. PCB PARTS LIST ............................................................................................................................................46
6. ADJUSTMENT ................................................................................................................................................54
7. GENERAL INFORMATION .............................................................................................................................55
7.1 TROUBLE SHOOTIG................................................................................................................................55
7.4 PCB LOCATION .......................................................................................................................................57
7.5 DISASSEMBLY.........................................................................................................................................58
7.6 IC INFORMATION ....................................................................................................................................62
8. PANEL FACILITIES .........................................................................................................................................66
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