1-1.
........................................................................ 1-5
........................................................................ 1-7
1-2.
2-1.
SERVICE MODE ............................................... 2-1
3. DIAGRAMS ................................................... 3-1
3-1.
(4) G2 Board ........................................................ 3-4
SPM Boards ................................................... 3-6
(3) J1 Board ......................................................... 3-7
(5) BD Board ....................................................... 3-9
(8) G Board .......................................................... 3-12
3-2.
TABLE OF CONTENTS
3
3-3.
4
3-4.
3-5.
4-1.
4-2.
4-3.
4-4.
(5) Schematic Diagrams of H2 and H3 Boards .. 3-47
(8) Schematic Diagrams of J2 and SPM Boards . 3-51
SEMICONDUCTORS ....................................... 3-61
(PDM-6110) ...................................................... 4-10
PACKING MATERIALS FOR MEDIA
RECEIVER UNIT (MBT-MR2) ........................ 4-11
KE-MR61M2 (CH)
5