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(6) Schematic Diagram of HM Board
1
3
2
A
CN1301
20P
R1347
0
GND
1
1608
3.3
:CHIP
THRU_3.3V
2
+3.3VD
GND
3
B
1.0
MS_BS+
4
1.4
MS_BS-
5
1.0
MS_SDIR+
6
1.4
MS_SDIR-
7
GND
8
1.0
MS_SCLK+
9
1.4
TO
MS_SCLK-
10
MS2(4/4)BOARD
GND
11
CN4101
1.0
MS_SDO+
12
1.4
MS_SDO-
13
C
GND
14
1.0
MS_SDI+
15
1.4
MS_SDI-
16
3.3
MS_INS
17
GND
18
0
MS_LED
19
GND
20
D
+3.3VD
+3.3VD
E
FB1304
0UH
R1327
100
D1311
1/10W
L1503CB
:CHIP
1.9
Q1301
R1328
3.3
2SA1611-T1-M5M6
1k
LED DRIVER
1/10W
:CHIP
F
CN1304
10P
GND
1
MS_BS
2
NC
3
MS_SDIO
4
NC
5
MEMORY
MS_INS
6
STICK
R1332
G
1k
NC
7
1/10W
:RN-CP
MS_SCLK
8
VCC
9
GND
10
D1316
C1308
RD3.9SB2-T1
0.01
25V
B:CHIP
H
4
5
6
3.3VD
+3.3VD
FB1303
R1303
0UH
0
D1301
1608
:CHIP
HN1D03FU
IC1301
SN65LVDT14PWR
LVDS RECEIVER
1.4
1.4
R1305
0
GND
1608
1.0
:CHIP
1.0
VCC
D1303
1.0
HN1D03FU
1.4
GND
R1307
0
1.0
1608
:CHIP
1.4
VCC
1.0
R1309
0
1.4
1608
GND
:CHIP
D1305
HN1D03FU
R1311
0
1608
:CHIP
R1315
0
1608
:CHIP
D1307
HN1D03FU
R1317
0
1608
:CHIP
R1321
0
1608
:CHIP
IC1303
D1309
SN74CBTLV1G125DCKR
HN1D03FU
BUS SW
R1323
3.3
0
VCC
1608
:CHIP
GND
R1325
0
1608
:CHIP
3.3
R1329
C1305
10k
0.1
1/10W
16V
:CHIP
B:CHIP
Q1302
DTC144EUA-T106
D1313
DRIVER
HN1D03FU
MS_BUS
MS_DATA
R1330
R1331
22
22
1/10W
1/10W
:CHIP
:CHIP
3.3VD
+3.3VD
MS_INS
MS_SCLK
R1333
22
FB1301
1/10W
BK1608TS601
:CHIP
R1336
100k
D1315
3.3
1/10W
HN1D03FU
3.3
:CHIP
R1337
470
0
1/10W
Q1304
:RN-CP
MSB709-RT1
VCC SW
C1309
C1310
R1340
0.1
22
22k
16V
6.3V
1/10W
B:CHIP
:HT-CP
:CHIP
7
8
+3.3VD
L1302
C1301
10µH
0.1
:CHIP
25V
0
F:CHIP
C1311
C1302
10
0.01
3.3
6.3V
B:CHIP
B:CHIP
3.3
0
0
3.3
0
0
HM
(MEMORY STICK)
B-SS12581<HK.>-HM.
HM
[MEMORY STICK]
— HM BOARD —
<COMPONENT SIDE>
•
BM1C BOARD SEMICONDUCTOR LOCATION
Ref.
*
Q1301, Q1302,
2
Q1304
D1301, D1303,
-
D1305, D1307,
D1309, D1311,
D1313, D1315
D1316
3
*
: Refer to Terminal name of semiconductors in
silk screen printed circuit (see page 3-14)
<CONDUCTOR SIDE>
KE-MR61M2 (CH)
3-48
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