Sony MZ-R91 Service Manual page 24

MZ-R90/R91
• Semiconductor
Location
Ref. No.
D301
D302
D303
D304
D501
D600
D601
D602
D603
D801
D802
D803
D804
D901
D902
D903
D905
D906
D907
IC301
IC302
IC303
IC304
IC305
IC501
IC502
IC504
IC505
IC601
IC602
IC603
IC604
IC605
IC801
IC802
IC803
IC804
IC901
IC902
Q101
Q102
Q201
Q202
Q301
Q302
Q303
Q305
Q306
Q307
Q308
Q309
Q501
Q601
Q602
Q603
Q604
Q605
Q607
Q801
Q802
Q803
Q804
Q805
Q806
Q807
Q809
Q901
Q902
Q904
Q905
Q906
Q1001
– 29 –
6-4. PRINTED WIRING BOARD
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
Location and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
B-10
specified.
B-9
• % : indicates tolerance.
C-4
• : internal component.
f
B-10
• C : panel designation.
G-10
F-6
Note: The components identified by mark 0 or dotted line
F-9
with mark 0 are critical for safety.
G-6
Replace only with part number specified.
H-9
E-12
• A : B+ Line.
F-12
• Power voltage is dc 3 V and fed with regulated dc power
D-11
supply from external power voltage jack.
F-11
• Voltages and waveforms are dc with respect to ground
D-7
under no-signal conditions.
C-9
no mark : PLAYBACK
E-9
( ) : RECORD
C-11
∗
: Impossible to measure
C-11
• Voltages are taken with a VOM (Input impedance 10 MΩ).
D-11
Voltage variations may be noted due to normal produc-
tion tolerances.
C-12
• Waveforms are taken with a oscilloscope.
C-13
Voltage variations may be noted due to normal produc-
B-11
tion tolerances.
B-4
• Circled numbers refer to waveforms.
D-13
F-10
• Signal path.
G-12 E
: PLAYBACK (ANALOG OUT)
E-11
j : PLAYBACK (ANALOG IN)
E-12
l : RECORD (DEGITAL IN)
E-12
• Abbreviation
H-9
CND : Canadian model
G-9
FR : French model
F-12
HK : Hong Kong model
G-9
JEW : Tourist model
H-11
H-10
* IC502 and IC801 are not replaceable
E-11
G-11
• The voltage and waveform of CSP (chip size package) can-
D-10
not be measured, because its lead layout is different form
C-10
that of conventional IC.
B-9
B-11
C-10
B-11
B-10 Note on Printed Wiring Board:
C-13 • X : parts extracted from the component side.
B-10 • Y : parts extracted from the conductor side.
C-11
• x : parts mounted on the conductor side.
H-9
• z : Through hole.
C-10
• b : Pattern from the side which enables seeing.
B-11
(The other layers' patterns are not indicated.)
B-10
E-11
Caution:
F-9
Pattern face side: Parts on the pattern face side seen from
F-9
(Conductor Side) the pattern face are indicated.
G-7
Parts face side: Parts on the parts face side seen from
H-9
(Component Side) the parts face are indicated.
G-9
H-9
• Main board is four-layer printed board.
G-13
However, the patterns of layers 2 and 3 have not been in-
F-13
cluded in this diagrams.
F-13
F-13
F-13 * IC502 and IC801 are not replaceable
F-12
F-13
• Lead Layouts surface
D-11
C-6
D-9
C-11
C-6
C-10
E-11
Lead layout of conventional IC CSP (chip size package)
– 30 – – 31 –
Ver 1.2 2000. 02
– 32 –