BenQ S88 Service Manual
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BenQ S88 Service Manual

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Release 1.0
Service Manual
S88
Level 1-3
Release
Date
Department
Notes to change
R 1.0
15.02.2006
BenQ Mobile CC S CES
New document
02/2006
Technical Documentation
TD_Repair_L2.5L_S88_R1.0.pdf
Page 1 of 61
Company Confidential
2006©BenQ

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  • Page 1 Release 1.0 Service Manual Level 1-3 Release Date Department Notes to change R 1.0 15.02.2006 BenQ Mobile CC S CES New document 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 1 of 61 Company Confidential 2006©BenQ...

  • Page 2: Table Of Contents

    Release 1.0 Table of Content Key Feature ..........................3 Unit Description of S88 ......................4 Exploded View of S88 .......................5 Disassembly of S88........................6 Assembly of S88........................20 BenQ Service Equipment User Manual .................31 Setup of the Software......................32 Software basic settings ......................33 Software Download procedure....................34 10 Download PPF (Handset configuration)................36...

  • Page 3: Key Feature

    Camera video recording • USB 1.1; Bluetooth Connectivity • Embedded in Mobile Phone FM Radio • Support MPEG 4/ 3GP Camcorder • Support MP3/AAC MP3 – Player • Equalizer 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 3 of 61 Company Confidential 2006©BenQ...

  • Page 4: Unit Description Of S88

    Release 1.0 2 Unit Description of S88 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 4 of 61 Company Confidential 2006©BenQ...

  • Page 5: Exploded View Of S88

    Release 1.0 3 Exploded View of S88 Rear Cover Battery Cover Side Screw Battery Camera Frame Screws Ringer Lower Case Camera Shell Flex Cable Vibramotor Flash light Flex Cable Adhesive Strip RF Control Board S88 Display Joystick Adhesive Strip Earpiece...

  • Page 6: Disassembly Of S88

    Release 1.0 Disassembly of S88 All repairs as well as disassembling and assembling have to be carried out in an ESD protected environment and with ESD protected equipment/tools. For all activities the international ESD regulations have to be considered. For more details please check information in c – market https://market.benqmobile.com/SO/welcome.lookup.asp...
  • Page 7 Release 1.0 Step 3 Remove Battery. Step 4 Step 5 Open Handset – Cover to remove Side Screw. Use the Torque – Screwdriver T5. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 7 of 61 Company Confidential 2006©BenQ...
  • Page 8 Release 1.0 Step 6 Remove Screw. Step 7 Remove Camera Cover by using Alternative Opening Tool carefully. Step 8 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 8 of 61 Company Confidential 2006©BenQ...
  • Page 9 Release 1.0 Step 9 Remove screws with the Torque – Screwdriver. Step 10 Remove Lower Case Shell from Upper Case Shell with Alternative Opening Tool. Be very careful. Step 11 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 9 of 61 Company Confidential 2006©BenQ...
  • Page 10 Step 12 Remove Ringer by using Tweezers. Step 13 Remove Vibramotor by using Tweezers. Step 14 Use Tweezers to disconnect the Flex Cable from the RF Control Board sockets. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 10 of 61 Company Confidential 2006©BenQ...
  • Page 11 Step 15 Step 16 Pull the Memory Card Cover forward to remove the RF Control Board. Step 17 Remove RF Control Board from Lower Case with Alternative Opening Tool carefully. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 11 of 61 Company Confidential 2006©BenQ...
  • Page 12 Release 1.0 Step 18 Step 19 Disconnect the Adhesive Strip with Flex Cable from the RF Control Board by using Tweezers carefully. Step 20 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 12 of 61 Company Confidential 2006©BenQ...
  • Page 13 Release 1.0 Step 21 Step 22 Step 23 Disconnect Flash light Flex Cable from Camera Frame. Take care of the Flex Cable!!! 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 13 of 61 Company Confidential 2006©BenQ...
  • Page 14 Release 1.0 Step 24 Remove Camera with Camera Frame by pressing the hooks together. Step 25 Step 26 Disassemble Camera Frame from Camera. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 14 of 61 Company Confidential 2006©BenQ...
  • Page 15 Release 1.0 Step 27 Step 28 Remove Joystick by using Tweezers. Step 29 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 15 of 61 Company Confidential 2006©BenQ...
  • Page 16 Tweezers carefully. Step 31 Remove the Flash light Flex Cable from the RF Control Board. Use Tweezers very carefully! Step 32 Remove the Display by using the Alternative Opening Tool. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 16 of 61 Company Confidential 2006©BenQ...
  • Page 17 To avoid scratches it is mandatory to place a protection foil onto the Display!!! Step 31 Use Alternative Opening Tool to remove the Keypad MMI. Step 32 Remove Keypad by using Alternative Opening Tool. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 17 of 61 Company Confidential 2006©BenQ...
  • Page 18 Release 1.0 Step 33 Step 34 Remove the Side Keys by pushing them outside the frames. Step 35 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 18 of 61 Company Confidential 2006©BenQ...
  • Page 19 Release 1.0 Step 36 Step 37 Remove Camera – Video - Key by using Tweezers. Step 38 Remove the Earpiece with the Alternative Opening Tool. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 19 of 61 Company Confidential 2006©BenQ...

  • Page 20: Assembly Of S88

    Flash Screws Battery Camera Frame Vibramotor Side Keys and Camera Keypad MMI Ringer Assembly of S88 Step 1 Assemble Earpiece by using Tweezers. Step 2 Assemble Camera – Video – Key by using Tweezers. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 20 of 61 Company Confidential 2006©BenQ...
  • Page 21 Release 1.0 Step 3 Assemble Side Keys by using Tweezers. Step 4 Step 5 Assemble Keypad. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 21 of 61 Company Confidential 2006©BenQ...
  • Page 22 Release 1.0 Step 6 Assemble Keypad MMI. Step 7 Remove the Display Foil from the Display. Step 8 Assemble the Display in the given frame. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 22 of 61 Company Confidential 2006©BenQ...
  • Page 23 Use Tweezers to assemble the Microphone Shielding. Step 10 Assemble Joystick. Step 11 Connect the Flash light Flex Cable with the RF Control Board. Take care of the Flex Cable! 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 23 of 61 Company Confidential 2006©BenQ...
  • Page 24 Assemble the Camera into the Camera Frame. Step 13 Fit the Assembled Camera into the cut out of the RF Control Board. Step 14 Clip the Flash lights onto the Camera Frame. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 24 of 61 Company Confidential 2006©BenQ...
  • Page 25 Fix the Adhesive Strip onto the Camera Frame. Step 16 Step 17 Turn the RF Control Board and fix the end of the Adhesive Strip on the shielding plate. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 25 of 61 Company Confidential 2006©BenQ...
  • Page 26 Release 1.0 Step 15 Step 16 Fix the RF Control Board into the Upper Case Shell. Step 14 Connect the Flex Cable with the RF Control Board socket. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 26 of 61 Company Confidential 2006©BenQ...
  • Page 27 Control Board socket. Step 16 Assemble the Ringer in the given frame of the Lower Case Shell. Step 17 Assemble the Vibramotor in the given frame of the Lower Case Shell. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 27 of 61 Company Confidential 2006©BenQ...
  • Page 28 Release 1.0 Step 18 Assemble Upper Case Shell with Lower Case Shell. Step 19 Step 20 Place screws with the Torque – Screwdriver. T5. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 28 of 61 Company Confidential 2006©BenQ...
  • Page 29 Release 1.0 Step 21 Assemble Rear Cover. Step 22 Assemble Battery. Step 23 Place side screw. T5 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 29 of 61 Company Confidential 2006©BenQ...
  • Page 30 Release 1.0 Step 24 Assemble Battery Cover. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 30 of 61 Company Confidential 2006©BenQ...

  • Page 31: Benq Service Equipment User Manual

    Release 1.0 BenQ Service Equipment User Manual Introduction Every LSO repairing BenQ handset must ensure that the quality standards are observed. BenQ has developed an automatic testing system that will perform all necessary measurements. This testing system is known as: BenQ Mobile Service Equipment •...

  • Page 32: Setup Of The Software

    Plug in the Data cable and follow the installation instructions to complete the process. Check the Comport number of the data cable in the device manager. (XCSD tool supports only Comport 1 to 10) 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 32 of 61 Company Confidential 2006©BenQ...

  • Page 33: Software Basic Settings

    The installer creates a shortcut in the start menu bar. Start – Programs – XCSDTool_L1 - BenQS 8 Software basic settings Start the software (BenQS.exe). The XCSD tool will be shown on the screen Select Model: 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 33 of 61 Company Confidential 2006©BenQ...

  • Page 34: Software Download Procedure

    Release 1.0 Select Com port (Setting – Com port): 9 Software Download procedure Select Download Option (View – Download): 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 34 of 61 Company Confidential 2006©BenQ...
  • Page 35 Click the “Set E2p” to erase the customer data without software update. SW files naming rules: Program Code E22111710 Language Pack E22L11711 Project name Program Code Language Pack Version 1.17 10/11 Program Code ID 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 35 of 61 Company Confidential 2006©BenQ...

  • Page 36: Download Ppf (Handset Configuration)

    Database File (example: E22111710.bin) and PPF File (example benq_m315_twn.ppf) Don’t activate Connect mobile phone with data cable. Phone must be switched on. Click to “Write PPF” button to start the process. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 36 of 61 Company Confidential 2006©BenQ...
  • Page 37 Release 1.0 Confirmation about successful write of PPF appears after process is completed. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 37 of 61 Company Confidential 2006©BenQ...

  • Page 38: Backup And Restore Of Wap And Network Setting

    Connect mobile phone with data cable. Phone must be switched off. Click to “Backup” button to start the transfer the settings into the selected file. Click to “Restore” button to start the transfer from selected file into handset. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 38 of 61 Company Confidential 2006©BenQ...

  • Page 39: Backup And Restore Of Media Center Content

    Connect mobile phone with data cable. Phone must be switched on. Click to “Backup” button to start the transfer the settings into the selected file. Click to “Restore” button to start the transfer from selected file into handset. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 39 of 61 Company Confidential 2006©BenQ...

  • Page 40: Unlock Tool

    Release 1.0 13 Unlock Tool Select Unlock tool function (View – Unlock Tool): Select Database File (example: E22111710.bin) 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 40 of 61 Company Confidential 2006©BenQ...
  • Page 41 Release 1.0 Click to “Show PW” button to get the codes. Unlock the codes in the mobile phone menu. Click to “Hide PW” button to hide the codes. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 41 of 61 Company Confidential 2006©BenQ...

  • Page 42: International Mobile Equipment Identity, Imei

    2 digits. 6 digits have been allocated for the equipment serial number for manufacturer and the last digit is spare. S88 series IMEI label is accessible by removing the battery. Re – use of IMEI label is possible by using a hair – dryer to remove the IMEI label.

  • Page 43: General Testing Information

    Ensure that every data, which is required for the IRIS-Reporting is available in your database. Ensure that there is a description available for the employees how to enter the data. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 43 of 61 Company Confidential 2006©BenQ...
  • Page 44 If components and especially soldered components have to be replaced all rules mentioned in dedicated manuals or additional information e.g. service information have to be considered 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 44 of 61 Company Confidential 2006©BenQ...
  • Page 45 • highest PCL0 • Phase Error RMS • BS Power = -75 dBm • Phase Error Peak • middle BCCH • Average Power • Power Time Template Call release from BS 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 45 of 61 Company Confidential 2006©BenQ...
  • Page 46 Basis is the international standard of DIN ISO 2859. Use Normal Sample Plan Level II and the Quality Border 0,4 for LSO. Remark: All sample checks must be documented. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 46 of 61 Company Confidential 2006©BenQ...
  • Page 47 PUK 1 12345678 Pin 2 number: 0000 PUK 2 23456789 2) Test SIM Card from the company “T-D1” Pin 1 number: 1234 76543210 Pin 2 number: 5678 PUK 2 98765432 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 47 of 61 Company Confidential 2006©BenQ...
  • Page 48 Release 1.0 Annex 2 Device Date Code overview GSN rule: (ex: GS11500001TG0) 00001 Big class Date Month Year Factory Based on the definition above, GSC55... below means 2005/05/12. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 48 of 61 Company Confidential 2006©BenQ...

  • Page 49: Introduction Of Service Repair Documentation Level 3 (Basic) - S88

    Support section of the C-market). Check at least weekly C-market for updates and consider all S88 related Customer Care Information The part number for the S88 is S88 where the last for letters specify the housing and software variant. Scrap Handling: All Scrap information given in this manual are related to the SCRAP-Rules and instructions.

  • Page 50: List Of Available Level 3 (Basic) Parts

    Hardware requirements (According to General soldering information V1.3 - check C-market for updates) Jigs, Tools and working materials for all described repairs: hot air blower soldering gun tweezers flux solder 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 50 of 61 Company Confidential 2006©BenQ...

  • Page 51: S88 Board Layout

    Release 1.0 S88 Board Layout Upper board side T – Flash Socket Microphone Backup Battery Camera Connector Lower board side 10 Pin I/O Battery Connector Flash Connector DC Jack SIM Connector Keypad Connector Display Connector 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 51 of 61 Company Confidential 2006©BenQ...

  • Page 52: Sim Card Problems

    Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards. E-commerce order number: L50634-Z97-C637 E-commerce order name: CONN SIM BM05306-D18 Soldering temperature: ~ 360°C TIP Temp. 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 52 of 61 Company Confidential 2006©BenQ...

  • Page 53: Io Connector Problems

    Resolder new component afterwards. E-commerce order number: L50634-Z97-C558 E-commerce order name: CONN I/O 10P P0.5 Soldering temperature: ~ 360°C TIP Temp. IRIS Diagnose Code: 47300 Interface/Data Interface/Mechanical Damage 4B100 Interface/Headset Connector/Mechanical Damage 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 53 of 61 Company Confidential 2006©BenQ...

  • Page 54: Battery Connector Problems

    Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards. E-commerce order number: L50634-Z97-C556 E-Commerce name: CONN BAT3PD2.5AB303Y-C0G1 Soldering temperature: 240 - 255°C IRIS Diagnose Code: 13000 Battery/Mechanical Damage 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 54 of 61 Company Confidential 2006©BenQ...

  • Page 55: Rf Antenna Problems

    83100 Radio / Dropped Calls / Int. Antenna 83200 Radio / Dropped Calls / Ext. Antenna 84100 Radios / Call Setup / Int. Antenna 84200 Radio / Call Setup / Ext. Antenna 02/2006 Technical Documentation TD_Repair_L2.5L_S88_R1.0.pdf Page 55 of 61 Company Confidential 2006©BenQ...

  • Page 56: Micro Sd Connector Problems

    Resolder new component afterwards. E-commerce order number: L50634-Z97-C638 E-commerce order name: CONN MEMORY 11TFC-001 Soldering temperature: ~ 360°C TIP Temp. IRIS Diagnose Code: 4E000 Interfaces/ Memory Card Rerader 11/2005 Technical Documentation TD_Repair_L1-L3_S88_R1.0.pdf Page 56 of 61 Company Confidential 2005©BenQ...

  • Page 57: Camera Connector Problems

    Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards. E-commerce order number: L50634-Z97-C634 E-commerce order name: CONN AXK7L30227 Soldering temperature: ~ 360°C TIP Temp. IRIS Diagnose Code: BA000 Accessories / Camera 11/2005 Technical Documentation TD_Repair_L1-L3_S88_R1.0.pdf Page 57 of 61 Company Confidential 2005©BenQ...

  • Page 58: Display Problems

    Resolder new component afterwards. E-commerce order number: L50634-Z97-C635 E-commerce order name: CONN AXK734245 Soldering temperature: ~ 360°C TIP Temp. IRIS Diagnose Code: 21000 Display / Performance 22000 Display / Background Illumination 11/2005 Technical Documentation TD_Repair_L1-L3_S88_R1.0.pdf Page 58 of 61 Company Confidential 2005©BenQ...

  • Page 59: Charger Problems

    The value must be ~ 0Ω. E-commerce order number: L50634-Z97-C553 E-commerce order name: CONN DC PWR PA05302-QNJ IRIS Diagnose Code: 46100 Interface/Charging Connector/Mechanical Damage 11/2005 Technical Documentation TD_Repair_L1-L3_S88_R1.0.pdf Page 59 of 61 Company Confidential 2005©BenQ...

  • Page 60: Keypad Problems

    The value must be ~0Ω E-commerce order number: L50634-Z97-C633 E-commerce order name: CONN AXK7L20227 Soldering temperature: ~ 360°C TIP Temp. IRIS Diagnose Code: 21000 Display / Performance 22000 Display / Background Illumination 11/2005 Technical Documentation TD_Repair_L1-L3_S88_R1.0.pdf Page 60 of 61 Company Confidential 2005©BenQ...

  • Page 61: Flash Light Problems

    The value must be ~0Ω E-commerce order number: L50634-Z97-C636 E-commerce order name: CONN BF1-0115 Soldering temperature: ~ 360°C TIP Temp. IRIS Diagnose Code: 21000 Display / Performance 22000 Display / Background Illumination 11/2005 Technical Documentation TD_Repair_L1-L3_S88_R1.0.pdf Page 61 of 61 Company Confidential 2005©BenQ...

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