Samsung AQ12SGGE Service Manual page 30

BOTTOM
Parts List
No Location No.
1 C204,C301,C302,C402,C403 C-CERAMIC,CHIP
C501,C502,C503,C504,C901
2 C401
3 C404
4 IC04
5 IC05,IC06.IC08
6 IC07
7 IC51
8 Q401,Q601,Q603
9 Q602
10 R209,R301,R302,R401,R402 R-CHIP
R404,R602,R604,R610
11 R403,R407,R408
12 R405,R406
13 R501,R601,R603,R605,R908 R-CHIP
14 R606,R909
15 R607,R608
16 R609
Samsung Electronics
Description
100nF,+80-20%,50V,Y5V,TP,2012
C-CERAMIC,CHIP 1nF,10%,50V,X7R,TP,2012,-
C-CERAMIC,CHIP 10nF,+80-20%,50V,Y5V,TP,2012
IC-MICOM S3C8489XZZ-QTR5,-,64,+5V,10MHZ,STM-0219-O
TR-ARRAY 2003,NPN,7,1W,SOP-16,ST,1000
IC-SOURCE DRIVER TD62783AFW,SOL,18P,-,8,-500MA,TP,
IC-EEPROM 93LC56,128x16Bit,SOP,8P,150MIL,-,2.5V,-,
TR-SMALL SIGNAL 2SC2412K,NPN,200mW,SOT-23,TP,1
TR-SMALL SIGNAL MMST2907A,PNP,200mW,SOT-23,TP,100-
1Kohm,5%,1/10W,DA,TP,2012
R-CHIP 6.8Kohm,5%,1/10W,DA,TP,2012
R-CHIP 330ohm,5%,1/10W,DA,TP,2012
10Kohm,5%,1/10W,DA,TP,2012
R-CHIP 4.7Kohm,5%,1/10W,DA,TP,2012
R-CHIP 470ohm,5%,1/10W,DA,TP,2012
R-CHIP 560ohm,5%,1/10W,DA,TP,2012
Specification
PCB Diagrams
Q'TY Remark
10 SNA
1 SNA
1 SNA
1 SNA
3 SNA
1 SNA
1 SNA
3 SNA
1 SNA
9 SNA
3 SNA
2 SNA
5 SNA
2 SNA
2 SNA
1 SNA
6-5