HP d325 Series Quickspecs page 26

QuickSpecs
Technical Specifications – Communications
Lucent V.90 56K PCI Win Modem
DA-11642 North America — Version 7 — August 22, 2003
Data Transmission
NOTE: 56 Kbps technology refers to download speeds only and requires compatible modems at server sites.
Other conditions may limit modem speed. FCC limitations allow a maximum of 53 Kbps during download
transmissions.
Data Speeds
Data Standards
Fax speeds
Fax mode capabilities
Error Correction and Data
Compression
Power Management
Upgradability
Video
Other
Operating temperature
Operating humidity
Power
Chipset
Dimensions (L X H)
Connection
Other features
Safety
EMC
Telecom
Health
Other
HP Business Desktop d325 Series
V.90/K56flex technology speeds: 56,000 Kbps maximum downstream data,
controllerless
(Upload only) 33,600 / 31,200 / 28,800 / 26,400 / 21,600 / 19,200 / 16,800 /
14,400 / 12,000 / 9,600 / 7,200 / 4,800 / 2,400 / 1,200 / 300
ITU V.90, ITU-T, V.34bis, V.22bis, V.22bis, V.21, V.23, Bell 212A, and Bell 103
14,400 / 12,000 / 9,600 / 7,200 / 4,800 / 2,400 / 1,200 / 300 b/s
Group3 FAX, V. 17, V.29, V.27ter, and V.21 Channel 2, Class 1
V.44 (software upgradeable), 4.2bis, V.42 and MNP2-5
APM and ACPI states D0, D1, D2, and D3; meets PCI 2.2 requirements and
PC'99 requirements
Software driver upgradeable for v.92 and future enhancements
ITU-T V.80 video ready interface
TIA/EIA 602 standard AT command set
Integrated DTE interface with speeds of up to 115.2 Kbps, parallel 16550a
UART-compatible interface
Optional ring wakeup signal
32 to 104 F/0 to 40 C
20% to 80%, non-condensing
Requires a 3.3-V auxiliary power rail on PCI bus
Uses only one PCI load (i.e., one grant/request pair), one shared IRQ, one
electrical load
Agere Systems 1648C (Mars 3.2)—Integrated PCI interface with 5-V tolerant
buffers and CardBus support
Complies with PCI low profile specifications—6.7 x 2.3 inches (17.0 x 5.8 cm)
and supports high- and low-profile brackets
Dual, parallel RJ-11 support with auxiliary Tip/Ring connector
Digital line protection, call progress monitoring via on-board piezo device,
transformer-based DAA design, support for high profile and low profile
brackets, PnP ID supports via external EEPROM
UL recognized to UL 1950, 3rd edition (U.S. and Canada); IEC 950 (TUV,
NEMKO, DEMKO, SEMKO); CE Mark, EC 950 (TUV, NEMKO, DEMKO,
SEMKO, CE mark
FCC Part 15, IC ES003, EN 55022, 3rd edition, EN 55024, annex A, EN 61000-
4-6, EN 61000-4-8
FCC Part 68, IC-CS-03 (Canada); Worldwide PTT approvals
Bare PCB material compliant to 94V-0 or better (marked as such), Microsoft
Windows Me health compliant
PC'99 compliant, PCI version 2.2, WHQL approved; support for ACPI revision
1.1,
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